Abstract: An electrolytic type level sensor is secured atop spaced posts of a ceramic pedestal by applying epoxy only about the periphery of each post where it contacts the glass container of the level sensor and so that the glass container otherwise rests upon the posts. A thermal shunt of flexible braided copper is disposed about the glass container and is urged snuggly thereagainst by heat shrinking a plastic tube about the thermal shunt. The ceramic pedestal is received in an opening of a mounting plate and is urged by a spring pin against a "v" block type seat formed in the opening to establish points-of-contact therebetween. Epoxy is applied between the pedestal and opening to secure same together except at said points-of-contact. Plastic insulation is disposed about the sensor and pedestal and otherwise fills spaces in a housing for same and attached to said mounting plate.