Abstract: A high voltage distribution system and method for use with a cathode of a radiographic sensor device of a radiographic imaging apparatus are provided. The distribution system includes an insulated conductor formed on a first detector portion of the radiographic sensor device and communicating a high voltage to the cathode. The distribution system further includes an intermediate conduction portion communicating with the insulated conductor. The intermediate conduction portion includes a contact surface. The distribution system further includes a interconnect extending from a second portion of the radiographic sensor device. The separable interconnect communicates with an electrical voltage source and is positioned to come into contact with the intermediate conduction portion when the first detector portion of the radiographic sensor device is assembled to the second signal processing portion.

Abstract: A solid state gamma camera module and integrated thermal management method thereof includes a printed circuit board having a first thermal layer and a second thermal layer. The first thermal layer is thermally and/or electrically bonded to the second thermal layer. A semiconductor detector module having the temperature sensitive material electrically communicates with the second thermal layer. A plurality of the integrated circuits each having a bottom metal layer and wire bonds are electrically connected to the first thermal layer. A cover is electrically and thermally bonded to the first thermal layer and covers the plurality of integrated circuits. The first thermal layer extracts heat from the integrated circuits by direct interface to the bottom metal layer (or the second thermal layer), and the second thermal layer extracts heat from an integrated circuit (IC) interconnect. The IC interconnect can be through a wire bond, die bond, direct solder flip chip attachment or the like.

Abstract: A heat sink system and method for a radiographic sensor device includes a heat sink formed of a first material possessing a predetermined thermal conductivity. The heat sink system further includes a thermal channel device formed of a second material possessing a predetermined thermal conductivity. The thermal channel device includes at least one contact portion adapted to contact the radiographic sensor device and an extending member that extends away from the at least one contact portion and contacts the heat sink. The thermal channel device is designed to extend between and substantially contact the heat sink and the radiographic sensor device when the heat sink system is assembled. The thermal channel device conducts heat from the radiographic sensor device to the heat sink.

Abstract: A solid state gamma camera module and integrated thermal management method thereof includes a printed circuit board having a first thermal layer and a second thermal layer. The first thermal layer is thermally and/or electrically bonded to the second thermal layer. A semiconductor detector module having the temperature sensitive material electrically communicates with the second thermal layer. A plurality of the integrated circuits each having a bottom metal layer and wire bonds are electrically connected to the first thermal layer. A cover is electrically and thermally bonded to the first thermal layer and covers the plurality of integrated circuits. The first thermal layer extracts heat from the integrated circuits by direct interface to the bottom metal layer (or the second thermal layer), and the second thermal layer extracts heat from an integrated circuit (IC) interconnect. The IC interconnect can be through a wire bond, die bond, direct solder flip chip attachment or the like.

Abstract: A planarizing heat sink plate having a top portion and a bottom portion is provided. The heat sink plate includes a plurality of receiving means formed therethrough and operable to receive a module ejection device, and at least one removing means formed therethrough and operable to receive a driving device. Also included is at least one planarizing projection formed on the bottom portion and adapted to receive a radiographic sensor module. The at least one removing means is disposed between the plurality of receiving means, and the at least one planarizing projection corresponds to the at least one removing means. The heat sink plate is a multi-functional device that can aid in forming an efficient radiographic detector head comprising a plurality of radiographic sensor modules in the same plane, safely removing the radiographic sensor modules, and conducting heat away from the radiographic sensor modules.

Abstract: A heat sink system and method for a radiographic sensor device includes a heat sink formed of a first material possessing a predetermined thermal conductivity. The heat sink system further includes a thermal channel device formed of a second material possessing a predetermined thermal conductivity. The thermal channel device includes at least one contact portion adapted to contact the radiographic sensor device and an extending member that extends away from the at least one contact portion and contacts the heat sink. The thermal channel device is designed to extend between and substantially contact the heat sink and the radiographic sensor device when the heat sink system is assembled. The thermal channel device conducts heat from the radiographic sensor device to the heat sink.

Abstract: A high voltage distribution system for distributing a high voltage supply to a plurality of semiconductor radiation detector modules, includes a conductive strip connected to a high voltage supply. The conductive strip is preferably made of aluminum foil, and contacts a surface of each of the detectors. The conductive strip is held into contact with the semiconductor radiation detectors by applying pressure to said conductive strip with a pressure plate, including a compressible layer such as a foam layer. A vacuum is created in an area occupied by the semiconductor modules and the conductive strip. The high voltage distribution system allows a high negative voltage to be applied to the semiconductor detector modules with a minimum of attenuation. In a preferred embodiment, the detector modules are CZT modules, and the system is incorporated into a solid-state gamma camera for nuclear medicine imaging.

Abstract: A pair of flexible interlocking edges for power operated doors primarily used on mass transit vehicles such as subway cars. If door closing is prevented, edge design allows withdrawal of obstructions, including deformable objects caught in the interstices of mating edges.

Abstract: A pair of flexible interlocking edges for power operated doors primarily used on mass transit vehicles such as subway cars. If door closing is prevented, edge design allows withdrawal of obstructions, including deformable objects caught in the interstices of mating edges.