Abstract: A method for creating scribe lines on a wafer having an electronic device constructed therein. A plurality of boundary segments is formed on the wafer to define a region on the wafer. This region encompasses the electronic device. An insulating layer is formed over the boundary segments, wherein the insulating layer covers the electronic device. A portion of the insulating layer is removed such that each of the segments is exposed. The boundary segments are then etched away to expose the wafer and form a plurality of scribe lines, wherein the wafer may be cut at the scribe lines to separate the electronic device from the wafer while minimizing damage to the electronic device.