Abstract: A current sensor IC includes a lead frame having a die attach pad and elongated leads extending in a single direction with respect to the die attach pad, a semiconductor die having a first surface attached to the die attach pad and a second, opposing surface supporting magnetic field sensing elements, and a non-conductive mold material. A first portion of the mold material encloses the semiconductor die and the die attach pad, a second portion of the mold material encloses a portion of the elongated leads, and the mold material further includes a wing structure between the first portion and the second portion. In assembly, the first portion of the mold material extends into a cutout through a current conductor and the wing structure abuts a surface of the conductor. The current sensor can implement differential sensing based on signals from at least two magnetic field sensing elements.

Abstract: A current sensor integrated circuit (IC) includes a unitary lead frame having at least one first lead having a terminal end, at least one second lead having a terminal end, and a paddle having a first surface and a second opposing surface. A semiconductor die is supported by the first surface of the paddle, wherein the at least one first lead is electrically coupled to the semiconductor die and the at least one second lead is electrically isolated from the semiconductor die. The current sensor IC further includes a first mold material configured to enclose the semiconductor die and the paddle and a second mold material configured to enclose at least a portion of the first mold material, wherein the terminal end of the at least one first lead and the terminal end of the at least one second lead are external to the second mold material.

Abstract: Methods and apparatus for providing an integrated circuit having a drive current source, a magnetic sensing element coupled to the drive current source, the magnetic sensing element having first and second differential outputs, and first and second current elements to provide respective currents in relation to the drive current source, wherein the first current element is coupled to the first differential output and the second current element is coupled to the second differential output. In illustrative embodiments, an IC output can output a voltage corresponding to the currents of the first and second current elements.

Abstract: A current sensor integrated circuit (IC) includes a unitary lead frame having at least one first lead having a terminal end, at least one second lead having a terminal end, and a paddle having a first surface and a second opposing surface. A semiconductor die is supported by the first surface of the paddle, wherein the at least one first lead is electrically coupled to the semiconductor die and the at least one second lead is electrically isolated from the semiconductor die. The current sensor IC further includes a first mold material configured to enclose the semiconductor die and the paddle and a second mold material configured to enclose at least a portion of the first mold material, wherein the terminal end of the at least one first lead and the terminal end of the at least one second lead are external to the second mold material.

Abstract: A current sensor integrated circuit (IC) includes a unitary lead frame having at least one first lead having a terminal end, at least one second lead having a terminal end, and a paddle having a first surface and a second opposing surface. A semiconductor die is supported by the first surface of the paddle, wherein the at least one first lead is electrically coupled to the semiconductor die and the at least one second lead is electrically isolated from the semiconductor die. The current sensor IC further includes a first mold material configured to enclose the semiconductor die and the paddle and a second mold material configured to enclose at least a portion of the first mold material, wherein the terminal end of the at least one first lead and the terminal end of the at least one second lead are external to the second mold material.

Abstract: A current sensor integrated circuit (IC) includes a unitary lead frame having at least one first lead having a terminal end, at least one second lead having a terminal end, and a paddle having a first surface and a second opposing surface. A semiconductor die is supported by the first surface of the paddle, wherein the at least one first lead is electrically coupled to the semiconductor die and the at least one second lead is electrically isolated from the semiconductor die. The current sensor IC further includes a first mold material configured to enclose the semiconductor die and the paddle and a second mold material configured to enclose at least a portion of the first mold material, wherein the terminal end of the at least one first lead and the terminal end of the at least one second lead are external to the second mold material.

Abstract: A current sensor integrated circuit including a magnetic field sensing element, a current conductor, an insulation structure, and a power calculation circuit is configured to meet safety isolation requirements. Isolation resistors allow for voltage from a high voltage side to be sensed at a low voltage side of the circuit. The insulation structure, current sensor package, and isolation resistors can achieve at least 500 Vrms isolation.

Abstract: Methods and apparatus for providing an integrated circuit having a drive current source, a magnetic sensing element coupled to the drive current source, the magnetic sensing element having first and second differential outputs, and first and second current elements to provide respective currents in relation to the drive current source, wherein the first current element is coupled to the first differential output and the second current element is coupled to the second differential output. In illustrative embodiments, an IC output can output a voltage corresponding to the currents of the first and second current elements.

Abstract: A current sensor integrated circuit including a magnetic field sensing element, a current conductor, an insulation structure, and a power calculation circuit is configured to meet safety isolation requirements. The current sensor integrated circuit may include or be used with isolation resistors to allow for voltage from a high voltage side to be sensed at a low voltage side of the circuit. The insulation structure, current sensor package, and isolation resistors can achieve at least 500 Vrms isolation.

Abstract: Methods and apparatus for providing an integrated circuit having a drive current source, a magnetic sensing element coupled to the drive current source, the magnetic sensing element having first and second differential outputs, and first and second current elements to provide respective currents in relation to the drive current source, wherein the first current element is coupled to the first differential output and the second current element is coupled to the second differential output. In illustrative embodiments, an IC output can output a voltage corresponding to the currents of the first and second current elements.

Abstract: Methods and apparatus to provide an integrated circuit having a magnetic sensing element having differential first and second outputs and an input, the input to receive current and first and second switches coupled to a respective one of the differential first and second outputs. A first voltage source is coupled between the first and second switches, the first and second switches having a first state in which the first voltage source is coupled across the differential first and second outputs, and an IC output can output a voltage corresponding to the first voltage source when the first and second switches are in the first state for monitoring operation of a signal path from the magnetic sensing element to the IC output.

Abstract: Methods and apparatus to provide an integrated circuit having a magnetic sensing element and fault detection module coupled to the sensing element, the fault detection module including circuitry to detect a fault condition and to self-test operation of the circuitry for detecting the fault condition. In illustrative embodiments, a fault pin indicates the fault condition.

Abstract: Methods and apparatus for an integrated circuit having a magnetic sensing element, a fault detection module including circuitry to detect a fault condition and to self-test operation of the circuitry to detect the fault. The integrated circuit includes a fault pin to indicate the fault condition.

Abstract: Methods and apparatus to provide an integrated circuit having a magnetic sensing element and fault detection module coupled to the sensing element, the fault detection module including circuitry to detect a fault condition and to self-test operation of the circuitry for detecting the fault condition. In illustrative embodiments, a fault pin indicates the fault condition.

Abstract: Methods and apparatus for providing an integrated circuit having a drive current source, a magnetic sensing element coupled to the drive current source, the magnetic sensing element having first and second differential outputs, and first and second current elements to provide respective currents in relation to the drive current source, wherein the first current element is coupled to the first differential output and the second current element is coupled to the second differential output. In illustrative embodiments, an IC output can output a voltage corresponding to the currents of the first and second current elements.

Abstract: Methods and apparatus to provide an integrated circuit having a magnetic sensing element having differential first and second outputs and an input, the input to receive current and first and second switches coupled to a respective one of the differential first and second outputs. A first voltage source is coupled between the first and second switches, the first and second switches having a first state in which the first voltage source is coupled across the differential first and second outputs, and an IC output can output a voltage corresponding to the first voltage source when the first and second switches are in the first state for monitoring operation of a signal path from the magnetic sensing element to the IC output.

Abstract: Methods and apparatus for an integrated circuit having a magnetic sensing element, a fault detection module including circuitry to detect a fault condition and to self-test operation of the circuitry to detect the fault. The integrated circuit includes a fault pin to indicate the fault condition.

Abstract: A multi-voltage biasing system with over voltage protection has an amplifier with a stage including at least one output device and one cascode protection device having a predetermined maximum recommended voltage; a biasing network is selectively responsive to a plurality of different supply voltages at least one of which is higher than the maximum recommended voltage for providing to the stage a bias voltage to operate the cascode device and output device below their maximum recommended voltages.

Abstract: A multistage dual logic level voltage translator for translating both high and low input logic levels to higher levels, at least one of which levels is above the maximum recommended voltage of transistors implementing the stages, includes an input stage for receiving input logic levels and an output stage including a high voltage converter having at least a pair of cross-coupled converter transistors responsive to the input stage and including a pair of clamping circuit connected one across each of the converter transistors, for providing the shifted low and high output logic levels.