Abstract: A structure to improve the cooling of electronic modules of the type including a printed circuit board contained between two covers. The structure extracts, by at least one of the covers, heat produced by at least one component borne by the printed circuit board. According to one feature, the cover responsible for extracting the heat bears at least one device having a high thermal conductivity, making it possible to even out the temperatures of the surface of the cover with which it is in contact. Such a structure may be particularly applied to the electronic modules on board aircraft.

Abstract: The object of the invention is to improve the cooling of electronic modules (40), of the type comprising a printed circuit board (41) contained between two covers (42, 42a, 43). The invention relates more specifically to the extraction by means of at least one of the covers (42, 42a, 43) of heat produced by at least one component (C1, C2, C3) borne by the printed circuit board (41).

Abstract: A tool change device, for transferring selected tools between a rotary tool magazine and the rotary spindle of a machine tool. The magazine has a plurality of sector-shaped tool holders, in each of which one tool is stored. Tools are individually loaded or unloaded at a corresponding orientation of the magazine, at which a selected sector-shaped tool holder is in axial alignment with the machine spindle. When in such alignment, the sector-shaped tool holder is moved axially into cooperative relationship with the spindle and tool transfer is effected. Means are provided to lock each of the sector-shaped tool holders into an inactive axial storage position, except when selected.