Abstract: A device is used to handle small-sized semiconductor chips, such as ultra-high frequency chips delivered loose. In order to lift up these chips one by one at a precise point by means of a pipette, the device uses the charges of static electricity which make the chips adhere to an endless tape made of plastic. In a first, vertical part, the tape is loaded with chips in passing through a feeder bin. A stop retains all the chips on one side of the tape, and another stop lets through only those chips that are flat on the other side of the tape. In a second, horizontal part the tape passes through a tunnel in which the chips are oriented and then stored and taken up by a suction pipette. The invention can be applied to the assembly of semi-conductor chips in packages or on substrates.