Abstract: Modulation circuitry is configured to generate a phase modulated signal having an output frequency that corresponds to a local oscillator (LO) signal divided by N.5. A phase locked loop (PLL) is configured to generate an LO signal having a frequency that is N.5 times the output frequency. Pulse circuitry configured to generate, based at least on a value of N, an edge signal including a pulse aligned with a positive edge of the LO signal and a pulse aligned with a negative edge of the LO signal. The edge signal is used to generate the phase modulated signal.

Abstract: Modulation circuitry is configured to generate a phase modulated signal having an output frequency that corresponds to a local oscillator (LO) signal divided by N.5. A phase locked loop (PLL) is configured to generate an LO signal having a frequency that is N.5 times the output frequency. Pulse circuitry configured to generate, based at least on a value of N, an edge signal including a pulse aligned with a positive edge of the LO signal and a pulse aligned with a negative edge of the LO signal. The edge signal is used to generate the phase modulated signal.

Abstract: A digital to time converter (DTC). The DTC includes a lookup table, a divider, a thermometric array and a switched capacitor array. The lookup table is configured to generate one or more corrections based on thermometric bits of an input signal. The divider is configured to generate a plurality of divider signals from an oscillator signal based on the one or more corrections. The thermometric array is configured to generate a medium approximation signal from the plurality of divider signals based on the one or more corrections. The switched capacitor array is configured to generate a digital delay signal from the medium approximation signal based on the one or more corrections and switched capacitor bits of the input signal.

Abstract: A digital to time converter (DTC). The DTC includes a lookup table, a divider, a thermometric array and a switched capacitor array. The lookup table is configured to generate one or more corrections based on thermometric bits of an input signal. The divider is configured to generate a plurality of divider signals from an oscillator signal based on the one or more corrections. The thermometric array is configured to generate a medium approximation signal from the plurality of divider signals based on the one or more corrections. The switched capacitor array is configured to generate a digital delay signal from the medium approximation signal based on the one or more corrections and switched capacitor bits of the input signal.

Abstract: An apparatus includes a die with through-silicon vias and radio frequency integrated circuit capabilities and it is vertically integrated with a phased-array antenna substrate. The through-silicon via and a radio frequency integrated circuit is coupled to a plurality of antenna elements disposed on the phased-array antenna substrate where each of the plurality of antenna elements is coupled to the through-silicon vias and radio frequency integrated circuit through a plurality of through-silicon vias. A process of assembling the through-silicon vias and radio frequency integrated circuit to the phased-array antenna substrate includes testing the apparatus.

Abstract: A digital to time converter (DTC). The DTC includes a lookup table, a divider, a thermometric array and a switched capacitor array. The lookup table is configured to generate one or more corrections based on thermometric bits of an input signal. The divider is configured to generate a plurality of divider signals from an oscillator signal based on the one or more corrections. The thermometric array is configured to generate a medium approximation signal from the plurality of divider signals based on the one or more corrections. The switched capacitor array is configured to generate a digital delay signal from the medium approximation signal based on the one or more corrections and switched capacitor bits of the input signal.

Abstract: A system for combining power includes a plurality of branches and a secondary winding. The plurality of branches are configured to provide branch power. Each of the branches contribute to the branch power at non-peak power. The secondary winding is configured to combine the branch power from the plurality of branches into an output power.

Abstract: A system for combining power includes a plurality of branches and a secondary winding. The plurality of branches are configured to provide branch power. Each of the branches contribute to the branch power at non-peak power. The secondary winding is configured to combine the branch power from the plurality of branches into an output power.

Abstract: An apparatus includes a die with through-silicon vias and radio frequency integrated circuit capabilities and it is vertically integrated with a phased-array antenna substrate. The through-silicon via and a radio frequency integrated circuit is coupled to a plurality of antenna elements disposed on the phased-array antenna substrate where each of the plurality of antenna elements is coupled to the through-silicon vias and radio frequency integrated circuit through a plurality of through-silicon vias. A process of assembling the through-silicon vias and radio frequency integrated circuit to the phased-array antenna substrate includes testing the apparatus.