Abstract: An embodiment system and method for dispensing multiple dairy products includes a dispenser which houses two or more dairy product bases with different formulations, which may be combined with or without water to create a multitude of homogenous dairy beverages. The two or more dairy product bases may be mixed together first and then separately mixed with water, mixed together simultaneously with water, or mixed together without adding water. They may be mixed together with or without additional flavoring, ingredients, mineral or nutritional additives. The dispenser comprises a pump with a quick-release mechanism to allow for quick and clean maintenance of the system.

Abstract: A remote radio head assembly attaches a remote radio head to the back wall of an antenna unit. The remote radio head assembly has a radio bracket attached to the top of the radio head having a handle for lifting and carrying the radio head. Radio guide spacers attached to the back side of the remote radio head are for sliding the remote radio head along a mounting rail attachment disposed on the back wall of the antenna unit. The mounting rail has a pivot hook for receiving an installation lever configured to engage with the handle to move the remote radio head in downward and upward directions so as to couple the connector ports of the antenna unit.

Abstract: A method of bonding semiconductor components is described. In one aspect a first component, for example a semiconductor die, is bonded to a second component, for example a semiconductor wafer or another die, by direct metal-metal bonds between metal bumps on one component and corresponding bumps or contact pads on the other component. In addition, a number of solder bumps are provided on one of the components, and corresponding contact areas on the other component, and fast solidified solder connections are established between the solder bumps and the corresponding contact areas, without realizing the metal-metal bonds. The latter metal-metal bonds are established in a heating step performed after the soldering step. This enables a fast bonding process applied to multiple dies bonded on different areas of the wafer and/or stacked one on top of the other, followed by a single heating step for realizing metal-metal bonds between the respective dies and the wafer or between multiple stacked dies.

Abstract: Articles of manufacture, machines, processes for using the articles and machines, processes for making the articles and machines, and products produced by the process of making, along with necessary intermediates, directed to mixed nuclear power conversion.

Abstract: A machine, article, process of using, process of making, products produced thereby and necessary intermediates.

Abstract: A machine, article, process of using, process of making, products produced thereby and necessary intermediates. Illustratively, there can be a process that includes: ionizing at least some injected gas to form ions; confining, without using magnetic fields, at least some of said ions to produce confined ions; accumulating at least some of said confined ions to produce accumulated ions; cooling at least some of said accumulated ions to produce cooled ions; compressing, without using magnetic fields, at least some of said accumulated ions to produce compressed ions; accelerating at least some of said compressed ions to produce accelerated ions; ejecting at least some of said accelerated ions; and measuring at least one property of said ejected ions.

Abstract: A power unit including multiple generators supplies power to a load or loads that may be variable. The generators can differ, e.g., in generating capacities, rates at which their outputs can be changed, maintenance requirements, and/or different energy-conversion efficiencies. A control unit throttles the generators independently according to a digitally implemented algorithm that may, but need not, use the difference(s) in supplying power to the load. In some cases, the controller regulates monitored power delivered to the load or loads. A power combiner is connected to the outputs of the generators. If desired, a buffer can be used between the generators and the load or loads to provide energy storage that can allow for the load or loads to change at a faster rate than the generators are throttled and for peak loads that temporarily exceed the capacity of the generators.

Abstract: Articles of manufacture, machines, processes for using the articles and machines, processes for making the articles and machines, and products produced by the process of making, along with necessary intermediates, directed to direct nuclear power conversion.

Abstract: A method of bonding semiconductor components is described. In one aspect a first component, for example a semiconductor die, is bonded to a second component, for example a semiconductor wafer or another die, by direct metal-metal bonds between metal bumps on one component and corresponding bumps or contact pads on the other component. In addition, a number of solder bumps are provided on one of the components, and corresponding contact areas on the other component, and fast solidified solder connections are established between the solder bumps and the corresponding contact areas, without realizing the metal-metal bonds. The latter metal-metal bonds are established in a heating step performed after the soldering step. This enables a fast bonding process applied to multiple dies bonded on different areas of the wafer and/or stacked one on top of the other, followed by a single heating step for realizing metal-metal bonds between the respective dies and the wafer or between multiple stacked dies.

Abstract: A machine, method of making, and method of using, along with necessary intermediates, illustratively, by way of a method, there can be a method of generating electrical power, the method including: inputting air, including adjusting flow rate of the air; inputting fuel, including throttling flow rate of the fuel, wherein: the fuel flow rate and the air flow rate are in stoichiometric proportions for combustion, and the fuel is comprised of at least one hydrocarbon, alcohol, or both; combusting a mixture of the fuel and a portion of the air with the remainder of the air to produce heat, wherein: prior to the combusting: combining the portion of the air with the fuel to produce the mixture that, when heated, stoichiometrically forms syngas; heating the mixture with the heat from the combusting; heating the remainder of the air with the heat from the combusting; and during the combusting, matching the remainder of the air with at least one of flow rate, pressure drop, and flow velocity of the mixture; generating

Abstract: The disclosed technology generally relates to integrating semiconductor dies and more particularly to bonding semiconductor substrates. In an aspect, a method of bonding semiconductor substrates includes providing a first substrate and a second substrate. Each of the first substrate and the second substrate comprises a dielectric bonding layer comprising one or more a silicon carbon oxide (SiCO) layer, a silicon carbon nitride (SiCN) layer or a silicon carbide (SiC) layer. The method additionally includes, prior to bonding the first and second substrates, pre-treating each of the dielectric bonding layer of the first substrate and the dielectric bonding layer of the second substrate. Pre-treating includes a first plasma activation process in a plasma comprising an inert gas, a second plasma activation process in a plasma comprising oxygen, and a wet surface treatment including a water rinsing step or an exposure to a water-containing ambient.

Abstract: Methods for producing megakaryocytes and platelets derived from inducible pluripotent stem cells are provided. Such megakaryocytes or platelets can be genetically modified to comprise a nucleic acid molecule encoding a therapeutic agent. The present disclosure further provides methods and compositions for loading a platelet or a megakaryocyte with a therapeutic agent and for genetically modifying a platelet or a megakaryocyte to express an agent.

Abstract: The disclosed technology generally relates to semiconductor wafer bonding, and more particularly to direct bonding by contacting surfaces of the semiconductor wafers. In one aspect, a method for bonding a first semiconductor substrate to a second semiconductor substrate by direct bonding is described. The substrates are both provided on their contact surfaces with a dielectric layer, followed by a CMP step for reducing the roughness of the dielectric layer. Then a layer of SiCN is deposited onto the dielectric layer, followed by a CMP step which reduces the roughness of the SiCN layer to the order of 1 tenth of a nanometer. Then the substrates are subjected to a pre-bond annealing step and then bonded by direct bonding, possibly preceded by one or more pre-treatments of the contact surfaces, and followed by a post-bond annealing step, at a temperature of less than or equal to 250° C.

Abstract: The disclosed technology generally relates to integrating semiconductor dies and more particularly to bonding semiconductor substrates. In an aspect, a method of bonding semiconductor substrates includes providing a first substrate and a second substrate. Each of the first substrate and the second substrate comprises a dielectric bonding layer comprising one or more a silicon carbon oxide (SiCO) layer, a silicon carbon nitride (SiCN) layer or a silicon carbide (SiC) layer. The method additionally includes, prior to bonding the first and second substrates, pre-treating each of the dielectric bonding layer of the first substrate and the dielectric bonding layer of the second substrate. Pre-treating includes a first plasma activation process in a plasma comprising an inert gas, a second plasma activation process in a plasma comprising oxygen, and a wet surface treatment including a water rinsing step or an exposure to a water-containing ambient.

Abstract: A lift assist for a bumper pivotally mounted to a vehicle frame for movement between a normally closed upright position and a forwardly projecting open position. The bumper may be an animal protection bumper fitted to a heavy duty truck. The lift assist includes a torsion bar comprising a relatively short length of wire rope extending between first and second end fittings of the torsion bar, a first anchor assembly for securing the first end fitting to the bumper, and a second anchor assembly for securing the second end fitting to the vehicle frame. The second anchor assembly restrains rotational movement of the second end fitting when a torquing force is applied to the torsion bar, at the same time permitting contraction of the length of the wire rope when a torquing force is applied.

Abstract: The disclosed technology generally relates to semiconductor wafer bonding, and more particularly to direct bonding by contacting surfaces of the semiconductor wafers. In one aspect, a method for bonding a first semiconductor substrate to a second semiconductor substrate by direct bonding is described. The substrates are both provided on their contact surfaces with a dielectric layer, followed by a CMP step for reducing the roughness of the dielectric layer. Then a layer of SiCN is deposited onto the dielectric layer, followed by a CMP step which reduces the roughness of the SiCN layer to the order of 1 tenth of a nanometer. Then the substrates are subjected to a pre-bond annealing step and then bonded by direct bonding, possibly preceded by one or more pre-treatments of the contact surfaces, and followed by a post-bond annealing step, at a temperature of less than or equal to 250° C.

Abstract: Systems and methods for using antiprotons for terminating unwanted or undesirable cells which can be used in the treatment of conditions caused by the existence and/or proliferation of such undesirable cells. Such conditions include cardiovascular ailments, Parkinson's disease, wet macular degeneration, endocrine disorders, dermatological ailments, and cancer. Because of the unique nature of antiprotons and their annihilation characteristics, the preferred antiproton delivery device (1010, 1015, 1030) embodiments further incorporate detector arrays (1050a), capable of detecting characteristic emissions in the course of treatment.

Abstract: A lift assist for a bumper pivotally mounted to a vehicle frame for movement between a normally closed upright position and a forwardly projecting open position is disclosed. The bumper may be an animal protection bumper fitted to a heavy duty truck. The lift assist includes a torsion bar comprising a relatively short length of wire rope extending between first and second end fittings of the torsion bar, a first anchor assembly for securing the first end fitting to the bumper, and a second anchor assembly for securing the second end fitting to the vehicle frame. The second anchor assembly restrains rotational movement of the second end fitting when a torquing force is applied to the torsion bar, at the same time permitting contraction of the length of the wire rope when a torquing force is applied.

Abstract: Particle storing apparatus including only one electric field restraining charged particles, such as antiprotons, in an ultrahigh vacuum from striking a container surface for a half-life of at least 1 hour. Depending on implementation, restraining can be devoid of a magnetic field, and the container can be devoid of cryogenic cooling or need not include a dewar.

Abstract: A method for using a synchrotron, the method including the steps of: providing a synchrotron designed to accelerate a hadron beam to higher momenta; altering said synchrotron to enable deceleration of hadron beams to lower momenta; and using the synchrotron in said altering step in decelerating a hadron beam to lower momentum.