Abstract: A conductive clip for a semiconductor device package. In one example, the conductive clip may include a number of protrusions that extend from a surface of the conductive clip that in practice is solder-mounted to a leadframe of the semiconductor device package. In another example, the conductive clip may include the number of protrusions that each extend from the surface of the conductive clip that in practice is solder-mounted to the leadframe of the semiconductor device package, and may also include a number of protrusions that each extend from a surface of the conductive clip that in practice is solder-mounted to at least one electrical component that in turn is solder-mounted to the leadframe of the semiconductor device package.

Abstract: A conductive clip for a semiconductor device package. In one example, the conductive clip may include a number of protrusions that extend from a surface of the conductive clip that in practice is solder-mounted to a leadframe of the semiconductor device package. In another example, the conductive clip may include the number of protrusions that each extend from the surface of the conductive clip that in practice is solder-mounted to the leadframe of the semiconductor device package, and may also include a number of protrusions that each extend from a surface of the conductive clip that in practice is solder-mounted to at least one electrical component that in turn is solder-mounted to the leadframe of the semiconductor device package.

Abstract: A semiconductor package includes a leadframe having a clip foot portion, the clip foot portion having a first tie bar, a conductive clip situated over the leadframe, the conductive clip including a first lock fork having at least two prongs around the first tie bar so as to secure the conductive clip to the clip foot portion of the leadframe. The conductive clip includes a second lock fork having at least two prongs around a second tie bar of the clip foot portion. The conductive clip is electrically coupled to the clip foot portion of the leadframe. The clip foot portion of the leadframe includes exposed leads. The semiconductor package also includes at least one semiconductor device situated on the leadframe. The at least one semiconductor device is coupled to a driver integrated circuit situated on the leadframe.