Abstract: The present invention provides a process and a structure of forming conductive vias using a light guide. In an exemplary embodiment, the process includes providing a via in a base material in a direction perpendicular to a plane of the base material, applying a photoresist layer to an interior surface of the via, inserting a light guide into the via, exposing, by the light guide, a portion of the photoresist layer to light, thereby resulting in an exposed portion of the photoresist layer and an unexposed portion of the photoresist layer, removing a portion of the photoresist layer, and plating an area of the via, where the photoresist has been removed, with a metal, thereby resulting in a portion of the via plated with metal and a portion of the via not plated with metal.

Abstract: A direct current (DC) blocking capacitor can be used with an integrated circuit (IC) package. The DC blocking capacitor can include a first electrically conductive planar surface having a first area and a second electrically conductive planar surface having a second area greater than the first area. The second planar surface is in a parallel planar orientation to the first planar surface. The DC blocking capacitor can also include a first set of electrically conductive plates electrically connected to the first planar surface and a second set of electrically conductive plates electrically connected to the second planar surface. The second set of electrically conductive plates is interleaved with and electrically insulated from the first set of electrically conductive plates by a dielectric material.

Abstract: The present invention provides a process and a structure of forming conductive vias using a light guide. In an exemplary embodiment, the process includes providing a via in a base material in a direction perpendicular to a plane of the base material, applying a photoresist layer to an interior surface of the via, inserting a light guide into the via, exposing, by the light guide, a portion of the photoresist layer to light, thereby resulting in an exposed portion of the photoresist layer and an unexposed portion of the photoresist layer, removing a portion of the photoresist layer, and plating an area of the via, where the photoresist has been removed, with a metal, thereby resulting in a portion of the via plated with metal and a portion of the via not plated with metal.

Abstract: The present invention provides a process and a structure of forming conductive vias using a light guide. In an exemplary embodiment, the process includes providing a via in a base material in a direction perpendicular to a plane of the base material, applying a photoresist layer to an interior surface of the via, inserting a light guide into the via, exposing, by the light guide, a portion of the photoresist layer to light, thereby resulting in an exposed portion of the photoresist layer and an unexposed portion of the photoresist layer, removing a portion of the photoresist layer, and plating an area of the via, where the photoresist has been removed, with a metal, thereby resulting in a portion of the via plated with metal and a portion of the via not plated with metal.

Abstract: A method for forming passive electrical devices that includes depositing a photo reactive layer over a sidewall of a via that extends through a printed circuit board; inserting a light pipe having a mask configured to provide a passive electronic device geometry within the via to an entire depth of the via; and exposing the photo reactive layer to radiation provided by the light pipe to provide a pattern having the passive electronic device geometry on the sidewall of the via.

Abstract: The present invention provides a process and a structure of forming conductive vias using a light guide. In an exemplary embodiment, the process includes providing a via in a base material in a direction perpendicular to a plane of the base material, applying a photoresist layer to an interior surface of the via, inserting a light guide into the via, exposing, by the light guide, a portion of the photoresist layer to light, thereby resulting in an exposed portion of the photoresist layer and an unexposed portion of the photoresist layer, removing a portion of the photoresist layer, and plating an area of the via, where the photoresist has been removed, with a metal, thereby resulting in a portion of the via plated with metal and a portion of the via not plated with metal.

Abstract: An embossed printed circuit board (PCB) for intrusion detection including a first security trace layer comprising a first serpentine trace monitored by a security sense circuit; a second security trace layer comprising a second serpentine trace monitored by the security sense circuit; a protected circuitry layer comprising circuitry protected from intrusion by the first security trace layer and the second security trace layer; and at least one embossed edge, wherein the at least one embossed edge comprises a fixed bend in at least one PCB layer, and wherein the fixed bend displaces at least one point of the at least one PCB layer a distance at least equivalent to a thickness of the at least one PCB layer.

Abstract: A memory chip suitable for use in a daisy chain of memory chips. The memory chip receives an address/command word on a first input, determines if the address command word is directed to the memory chip; if so, the memory chip accesses an array on the memory chip. If not, the memory chip re-drives the address/command word on a first output. Write data is received as part of the address/command word or from a first data bus port. A bus clock is received and is used to receive and transmit information on the first input, the first output, the first data bus port and the second data bus port. The memory chip is incorporated into a design structure that is embodied in a computer readable medium used for designing, manufacturing, or testing the memory chip.

Abstract: A double-data-rate two synchronous dynamic random access (DDR2) memory circuit includes a low-speed input path and a high-speed input path coupled thereto by an input coupling and forming a common input, the common input coupled to a memory core, the memory core having a common output wherein a high-speed output path and a low-speed output path are coupled together by an output coupling and further coupled to the common output of the memory core.

Abstract: A via resistor structure and method are provided for implementing a resistor and for trimming a resistance value of the resistor. A resistive material selectively is deposited adjacent to a pad connecting to a via where a resistor is to be defined. A trimmed path is formed in the resistive material for selectively changing the resistance value of the resistor.

Abstract: In an embodiment, a predicted voltage to supply to an electronic device is learned based on a dynamic voltage variation that occurs at the electronic device. The dynamic voltage variation occurs in response to the electronic device processing a functional event, and the predicted voltage is supplied to the electronic device in response to observing the functional event on a bus that is connected to the electronic device. In response to observing the dynamic voltage variation, the predicted voltage that is associated with the functional event is modified based on the dynamic voltage variation. Then, on the next occurrence of the functional event, the predicted voltage is supplied to the electronic device. In this way, voltage transients at the electronic device are controlled.

Abstract: A circuit arrangement, method and apparatus utilize communication links that are selectively configurable to operate in both unidirectional and bidirectional modes to communicate data between multiple nodes that are interconnected to one another in a daisy chain configuration. As a result, in many instances communications may be maintained with nodes located both before and after a discontinuity in a daisy chain configuration.

Abstract: A method, and apparatus are provided for implementing a directory organization to selectively optimize performance or reliability in a computer system. A directory includes a user selected operational modes including a performance mode and a reliability mode. In the reliability mode, more directory bits are used for error correction and detection. In the performance mode, reclaimed directory bits not used for error correction and detection are used for more associativity.

Abstract: A power control method and power control structures are provided for managing a plurality of voltage islands of a functional chip. The power control structure includes a supply control and partition chip positioned between a substrate carrier and a functional chip including a plurality of voltage islands. The supply control and partition chip includes a plurality of first electrical connections to the functional chip including the plurality of voltage islands. The supply control and partition chip includes a plurality of second electrical connections to the substrate carrier. Power applied to predefined ones of the first electrical connections to the functional chip are selectively switched on and off by the supply control and partition chip.

Abstract: A stacking method and structure for attaching memory components to a ball grid array (BGA) device are provided. A specialized carrier includes multiple memory devices such as memory die, or chip scale packaging (CSP) memory. The specialized carrier is attached to a mating supporting carrier to form a stacked structure. The mating supporting carrier includes an associated ball grid array (BGA) device for the multiple devices of the specialized carrier.

Abstract: An apparatus includes a virtual memory manager that moves data from a first block to second block in memory. When the virtual memory manager is ready to transfer data from the first block to the second block, a third, temporary block of memory is defined. The translation table in a DMA controller is changed to point DMA transfers that target the first block to instead target the temporary block. The virtual memory manager then transfers data from the first block to the second block. When the transfer is complete, a check is made to see if the DMA transferred data to the temporary block while the data from the first block was being written to the second block. If so, the data written to the temporary block is written to the second block. A hardware register is preferably used to efficiently detect changes to the temporary block.

Abstract: A memory controller provides page copy logic that assures data coherency when a DMA operation to a page occurs during the copying of the page by the memory controller. The page copy logic compares the page index of the DMA operation to a copy address pointer that indicates the location currently being copied. If the page index of the DMA operation is less than the copy address pointer, the portion of the page that would be written to by the DMA operation has already been copied, so the DMA operation is performed to the physical address of the new page. If the page index of the DMA operation is greater than the copy address pointer, the portion of the page that would be written to by the DMA operation has not yet been copied, so the DMA operation is performed to the physical address of the old page.

Abstract: An apparatus and method for simulation and testing of electronic systems using a single model that has the composite behavioral information of multiple parts. The single model allows the designer to simulate using one model that captures the anticipated extremes (best case behavior to worst case behavior) across a collection of devices from different vendors.

Abstract: A method and structure are provided for implementing enhanced cooling of a plurality of memory devices. The memory structure includes a stack of platters. A sub-plurality of memory devices is mounted on each platter. At least one connector is provided with each platter for connecting to the sub-plurality of memory devices. A heat sink is associated with the stack of platters for cooling the plurality of memory devices.

Abstract: A method, apparatus and computer program product are provided for implementing vertically coupled noise control through a mesh plane in an electronic package design. Electronic package physical design data are received. Instances of vertically coupled noise in the electronic package physical design data are identified. The identified instances of vertically coupled noise are quantified. Then the electronic package physical design data are modified to limit the vertically coupled noise.