Abstract: A photoresist composition comprising an alkali soluble resin, a photoacid generating compound that undergoes photolysis when exposed to a pattern of activating irradiation within a wavelength of from 330 to 700 .mu.m, a crosslinking agent capable of crosslinking the composition when activated by photogenerated acid and a dye that is an aromatic carboxylic acid having phenylazo substitution. The photoresist is characterized by the dye which is soluble in the photoresist solution, unreactive with components of the photoresist composition and may be used in relatively high concentration.

Abstract: The invention relates to a positive-acting photoresist composition containing a mixture of photoactive compounds. One component of the mixture is the esterification product of an o-quinonediazide sulfonyl compound with a phenolic resin. Another component of the mixture is the esterification product of an o-quinonediazide sulfonyl compound with a low molecular weight phenol having from one to three aryl groups and from one to three hydroxyl groups. A third photoactive component which may be present in the formulation is the esterification product of an o-quinonediazide sulfonyl compound with a relative high molecular weight, polyhydric, polynuclear phenol.