Patents by Inventor Gerald Cois Byrd
Gerald Cois Byrd has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11815748Abstract: An optoelectronic device, including: a rib waveguide, the rib waveguide including: a ridge portion, which includes a temperature-sensitive optically active region, and a slab portion, positioned adjacent to the ridge portion; the device further comprising a heater, disposed on top of the slab portion wherein a part of the heater closest to ridge portion is at least 2 ?m away from the ridge portion. The device may also have a heater provided with a bottom cladding layer, and may also include various thermal insulation enhancing cavities.Type: GrantFiled: December 2, 2021Date of Patent: November 14, 2023Assignee: Rockley Photonics LimitedInventors: James Dongyoon Oh, Hooman Abediasl, Gerald Cois Byrd, Karlheinz Muth, Yi Zhang, Aaron John Zilkie
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Publication number: 20220319971Abstract: A via frame. In some embodiments, the via frame includes: a sheet of epoxy mold compound, having a plurality of holes each extending through the sheet of epoxy mold compound, and a plurality of conductive elements, each extending through a respective one of the holes.Type: ApplicationFiled: July 10, 2020Publication date: October 6, 2022Inventors: SEUNGJAE LEE, Brett SAWYER, Gerald Cois BYRD
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Publication number: 20220262962Abstract: An optoelectronic module. In some embodiments, the optoelectronic module includes a substrate; a digital integrated circuit, on an upper surface of the substrate; a photonic integrated circuit, secured in a pocket of the substrate, the pocket being in the upper surface of the substrate; and an analog integrated circuit, on the photonic integrated circuit.Type: ApplicationFiled: April 28, 2022Publication date: August 18, 2022Inventors: Gerald Cois BYRD, Thomas Pierre SCHRANS, Chia-Te CHOU, Arin ABED, Omar James BCHIR, Erman TIMURDOGAN, Aaron John ZILKIE
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Publication number: 20220189841Abstract: An electro-optical package. In some embodiments, the package includes: a carrier; a first integrated circuit, on the carrier; a first bonding layer, between the carrier and the first integrated circuit; a thermoelectric cooler, on the carrier; a second integrated circuit, on the thermoelectric cooler; and a first wire bond. The first wire bond may connect a first pad, on the first integrated circuit, to a second pad, on the second integrated circuit, the first pad and the second pad having a height difference less than 100 microns.Type: ApplicationFiled: December 14, 2021Publication date: June 16, 2022Inventors: Shuhe LI, Gerald Cois BYRD
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Publication number: 20220163824Abstract: An optoelectronic device, including: a rib waveguide, the rib waveguide including: a ridge portion, which includes a temperature-sensitive optically active region, and a slab portion, positioned adjacent to the ridge portion; the device further comprising a heater, disposed on top of the slab portion wherein a part of the heater closest to ridge portion is at least 2 ?m away from the ridge portion. The device may also have a heater provided with a bottom cladding layer, and may also include various thermal insulation enhancing cavities.Type: ApplicationFiled: December 2, 2021Publication date: May 26, 2022Inventors: James Dongyoon OH, Hooman ABEDIASL, Gerald Cois BYRD, Karlheinz MUTH, Yi ZHANG, Aaron John ZILKIE
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Publication number: 20220109075Abstract: An optoelectronic module. In some embodiments, the optoelectronic module includes: a substrate; a digital integrated circuit, on an upper surface of the substrate; and a frame, secured in a pocket of the substrate. The pocket is in a lower surface of the substrate, and the substrate includes an insulating layer, and a plurality of conductive traces.Type: ApplicationFiled: December 14, 2021Publication date: April 7, 2022Inventors: Gerald Cois BYRD, Thomas Pierre SCHRANS, Chia-Te CHOU, Arin ABED, Omar James BCHIR
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Patent number: 11262498Abstract: An optoelectronic module. In some embodiments, the module includes: a housing, a substantially planar subcarrier, a photonic integrated circuit, and an analog electronic integrated circuit. The subcarrier has a thermal conductivity greater than 10 W/m/K. The photonic integrated circuit and the analog electronic integrated circuit are secured to a first side of the subcarrier, and the subcarrier is secured to a first wall of the housing. A second side of the subcarrier, opposite the first side of the subcarrier, is parallel to, secured to, and in thermal contact with, an interior side of the first wall of the housing.Type: GrantFiled: July 31, 2020Date of Patent: March 1, 2022Assignee: Rockley Photonics LimitedInventors: Gerald Cois Byrd, Chia-Te Chou, Karlheinz Muth
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Patent number: 11239377Abstract: An optoelectronic module. In some embodiments, the optoelectronic module includes: a substrate; a digital integrated circuit, on an upper surface of the substrate; and a frame, secured in a pocket of the substrate. The pocket is in a lower surface of the substrate, and the substrate includes an insulating layer, and a plurality of conductive traces.Type: GrantFiled: August 6, 2018Date of Patent: February 1, 2022Assignee: Rockley Photonics LimitedInventors: Gerald Cois Byrd, Thomas Pierre Schrans, Chia-Te Chou, Arin Abed, Omar James Bchir
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Patent number: 11209678Abstract: An optoelectronic device, including: a rib waveguide, the rib waveguide including: a ridge portion, which includes a temperature-sensitive optically active region, and a slab portion, positioned adjacent to the ridge portion; the device further comprising a heater, disposed on top of the slab portion wherein a part of the heater closest to ridge portion is at least 2 ?m away from the ridge portion. The device may also have a heater provided with a bottom cladding layer, and may also include various thermal insulation enhancing cavities.Type: GrantFiled: February 20, 2019Date of Patent: December 28, 2021Assignee: Rockley Photonics LimitedInventors: Dong Yoon Oh, Hooman Abediasl, Gerald Cois Byrd, Karlheinz Muth, Yi Zhang, Aaron John Zilkie
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Patent number: 11133225Abstract: An optical fiber adapter and method of fabricating the same from a wafer including a double silicon-on-insulator layer structure. The optical fiber adapter may include a mode converter, a trench, and a V-groove, the V-groove and the trench operating as passive alignment features for an optical fiber, in the transverse translational and rotational degrees of freedom, and in the longitudinal translational degree of freedom, respectively. The mode converter may include a buried tapered waveguide.Type: GrantFiled: May 1, 2020Date of Patent: September 28, 2021Assignee: Rockley Photonics LimitedInventors: John Drake, Damiana Lerose, Henri Nykänen, Gerald Cois Byrd
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Patent number: 10877217Abstract: A system and method for packing optical and electronic components. A module includes an electronic integrated circuit and a plurality of photonic integrated circuits, connected to the electronic integrated circuit by wire bonds or by wire bonds and other conductors. A metal cover of the module is in thermal contact with the electronic integrated circuit and facilitates extraction of heat from the electronic integrated circuit. Arrays of optical fibers are connected to the photonic integrated circuits.Type: GrantFiled: July 8, 2019Date of Patent: December 29, 2020Assignee: Rockley Photonics LimitedInventors: Gerald Cois Byrd, David Arlo Nelson, Javid Messian, Thomas Pierre Schrans, Chia-Te Chou, Karlheinz Muth
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Publication number: 20200363585Abstract: An optoelectronic module. In some embodiments, the module includes: a housing, a substantially planar subcarrier, a photonic integrated circuit, and an analog electronic integrated circuit. The subcarrier has a thermal conductivity greater than 10 W/m/K. The photonic integrated circuit and the analog electronic integrated circuit are secured to a first side of the subcarrier, and the subcarrier is secured to a first wall of the housing. A second side of the subcarrier, opposite the first side of the subcarrier, is parallel to, secured to, and in thermal contact with, an interior side of the first wall of the housing.Type: ApplicationFiled: July 31, 2020Publication date: November 19, 2020Inventors: Gerald Cois Byrd, Chia-Te Chou, Karlheinz Muth
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Patent number: 10761262Abstract: An optoelectronic module. In some embodiments, the module includes: a housing, a substantially planar subcarrier, a photonic integrated circuit, and an analog electronic integrated circuit. The subcarrier has a thermal conductivity greater than 10 W/m/K. The photonic integrated circuit and the analog electronic integrated circuit are secured to a first side of the subcarrier, and the subcarrier is secured to a first wall of the housing. A second side of the subcarrier, opposite the first side of the subcarrier, is parallel to, secured to, and in thermal contact with, an interior side of the first wall of the housing.Type: GrantFiled: July 31, 2018Date of Patent: September 1, 2020Assignee: ROCKLEY PHOTONICS LIMITEDInventors: Gerald Cois Byrd, Chia-Te Chou, Karlheinz Muth
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Publication number: 20200258791Abstract: An optical fiber adapter and method of fabricating the same from a wafer including a double silicon-on-insulator layer structure. The optical fiber adapter may include a mode converter, a trench, and a V-groove, the V-groove and the trench operating as passive alignment features for an optical fiber, in the transverse translational and rotational degrees of freedom, and in the longitudinal translational degree of freedom, respectively. The mode converter may include a buried tapered waveguide.Type: ApplicationFiled: May 1, 2020Publication date: August 13, 2020Inventors: John Drake, Damiana Lerose, Henri Nykänen, Gerald Cois Byrd
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Publication number: 20200073050Abstract: A system and method for packing optical and electronic components. A module includes an electronic integrated circuit and a plurality of photonic integrated circuits, connected to the electronic integrated circuit by wire bonds or by wire bonds and other conductors. A metal cover of the module is in thermal contact with the electronic integrated circuit and facilitates extraction of heat from the electronic integrated circuit. Arrays of optical fibers are connected to the photonic integrated circuits.Type: ApplicationFiled: July 8, 2019Publication date: March 5, 2020Inventors: Gerald Cois Byrd, David Arlo Nelson, Javid Messian, Thomas Pierre Schrans, Chia-Te Chou, Karlheinz Muth
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Publication number: 20190258094Abstract: An optoelectronic device, including: a rib waveguide, the rib waveguide including: a ridge portion, which includes a temperature-sensitive optically active region, and a slab portion, positioned adjacent to the ridge portion; the device further comprising a heater, disposed on top of the slab portion wherein a part of the heater closest to ridge portion is at least 2 ?m away from the ridge portion. The device may also have a heater provided with a bottom cladding layer, and may also include various thermal insulation enhancing cavities.Type: ApplicationFiled: February 20, 2019Publication date: August 22, 2019Inventors: Dong Yoon Oh, Hooman Abediasl, Gerald Cois Byrd, Karlheinz Muth, Yi Zhang, Aaron John Zilkie
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Patent number: 10365436Abstract: A system and method for packing optical and electronic components. A module includes an electronic integrated circuit and a plurality of photonic integrated circuits, connected to the electronic integrated circuit by wire bonds or by wire bonds and other conductors. A metal cover of the module is in thermal contact with the electronic integrated circuit and facilitates extraction of heat from the electronic integrated circuit. Arrays of optical fibers are connected to the photonic integrated circuits.Type: GrantFiled: January 4, 2018Date of Patent: July 30, 2019Assignee: Rockley Photonics LimitedInventors: Gerald Cois Byrd, David Arlo Nelson, Javid Messian, Thomas Pierre Schrans
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Patent number: 10317620Abstract: An interposer chip for coupling light between an array of fibers and an array of optical waveguides on a second photonic chip. The interposer chip has an array of V-grooves for aligning the ends of the fibers to corresponding ends of an array of optical waveguides on the interposer chip. Each optical waveguide has a taper with a first end and a second end, the first end being configured to support an optical mode that couples efficiently to the mode of an optical fiber. The taper reduces the vertical mode size, so that the mode supported by the second end of the taper may be efficiently coupled to a 3-micron thick optical waveguide on the second photonic chip. The interposer chip further has a hard stop having a flat surface parallel to the optical waveguides on the interposer chip, at the interface to the second chip.Type: GrantFiled: July 1, 2015Date of Patent: June 11, 2019Assignee: ROCKLEY PHOTONICS LIMITEDInventors: Andrew George Rickman, Aaron Zilkie, Damiana Lerose, Gerald Cois Byrd
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Publication number: 20190044002Abstract: An optoelectronic module. In some embodiments, the optoelectronic module includes: a substrate; a digital integrated circuit, on an upper surface of the substrate; and a frame, secured in a pocket of the substrate. The pocket is in a lower surface of the substrate, and the substrate includes an insulating layer, and a plurality of conductive traces.Type: ApplicationFiled: August 6, 2018Publication date: February 7, 2019Inventors: Gerald Cois Byrd, Thomas Pierre Schrans, Chia-Te Chou, Arin Abed, Omar James Bchir
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Publication number: 20190041576Abstract: An optoelectronic module. In some embodiments, the module includes: a housing, a substantially planar subcarrier, a photonic integrated circuit, and an analog electronic integrated circuit. The subcarrier has a thermal conductivity greater than 10 W/m/K. The photonic integrated circuit and the analog electronic integrated circuit are secured to a first side of the subcarrier, and the subcarrier is secured to a first wall of the housing. A second side of the subcarrier, opposite the first side of the subcarrier, is parallel to, secured to, and in thermal contact with, an interior side of the first wall of the housing.Type: ApplicationFiled: July 31, 2018Publication date: February 7, 2019Inventors: Gerald Cois Byrd, Chia-Te Chou, Karlheinz Muth