Abstract: A method and apparatus for sealing a drawtape to a hem of a thermoplastic film structure is disclosed. The thermoplastic film structure includes a panel, the hem, and the drawtape. The hem is formed along one end of the panel, and the drawtape is housed within the hem. In the method, the film structure is conveyed to a stationary heat sealer that includes a stationary heated block and a hot air blower spaced from the heated block. The film structure is momentarily stopped at the stationary heat sealer with hem disposed between the heated block and the hot air blower. While the film structure is stopped, the hot air blower blows heated air onto the hem to force the hem against the heated block, thereby sealing the drawtape to the hem.

Abstract: An improved thermoplastic film heat bonding apparatus includes a heated seal bar, a support member supporting the heated seal bar for reciprocating motion against a platen and a resilient coupling between the support member and the heated seal bar to allow deflection of the heated seal bar with respect to the support member providing better conformance between the platen and the face of the seal bar contacting the platen for more uniform and repeatable heat seals. Springs are used to provide the resilient coupling between the support member and the heated seal bar. One mounting providing both resilient coupling and continuous adjustable spacing between the support member and the heated seal bar includes a bracket supporting a threaded member passed through the support member and a coil spring biasing the bracket and support member apart. The bracket is itself resiliently mounted to the heated seal bar also by compression coil springs.