Abstract: A connection device for random connection of a first member of first transmission/reception units with a second number of second transmission/reception units has a switching matrix that includes a third number of controllable micromechanical switching elements that are respectively activatable to establish a connection between one of the first transmission/reception units and one of the second transmission/reception units. A control circuit selectively activates the respective micromechanical switching elements to selectively establish respective connections between the first number of first transmission/reception units and the second number of transmission/reception units.

Abstract: The embodiments describe an apparatus, in particular a microsystem, including a device for energy conversion, which device has apiezoelectric, mechanically vibrating diaphragm structure for converting mechanical energy into electrical energy. The diaphragm structure being coupled to a transformer and it being possible to displace said diaphragm structure by moving the transformer, and it being possible to effect the movement of the transformer in a contact-free fashion by interaction of the transformer with a moving part.

Abstract: The embodiments relate to a device, especially a microsystem, which comprises an energy converter unit having an electrode structure for the capacitive conversion of mechanical energy to electrical energy The electrode structure includes a first electrode and a second electrode the distance of which to the first electrode is variable. The device according to the invention also comprises a load circuit via which the first and second electrode are interconnected in an electroconductive manner. A transmitter is coupled to the second electrodes. The distance between the first and the second electrode can be varied by displacing the transmitter and the displacement of the transmitter can be effected in a countactles manner by interaction of the transmitter with a mobile part.

Abstract: An apparatus, in particular a microsystem, includes a device for energy conversion. The device for energy conversion has a piezoelectric, mechanically vibrating diaphragm structure for converting mechanical energy into electrical energy and/or vice versa, the diaphragm structure being arranged encapsulated in an environment which has a predetermined pressure which is, in particular, lower than an isostatic pressure.

Abstract: A first dynamically deflectable membrane structure has two electrode layers and one piezoelectric layer for converting mechanical capacity into electrical capacity, and vice versa. The first membrane structure is mechanically coupled to extra weight. Mechanical and electrical capacities are provided which reduce a non-linear portion of a resetting force of the membrane structure. A second membrane structure is mechanically counter-coupled to the first membrane structure such that both membrane structures are mechanically biased in opposite directions by the extra weight. In this manner, a linearization of the resetting forces occurs as a function of the membrane deflection. The piezoelectric energy converter can generate an electrical capacity of, for example, 0.4 watts to 10 watts.

Abstract: A plate-shaped chip supporting body has a number of write/read contacts for exchanging data with an external chip card. A number of corresponding terminal panels which are electrically connected to the write/read contacts of the front flat side, are arranged on the opposite rear side of the chip supporting body. A sensor ship is attached to the rear side of the chip supporting body and has contact pads electrically connected to the terminal panels of the chip supporting body. Contact panels on the flat side of the sensor chip are oriented toward the chip supporting body and are connected to the pad contact, which are located on the opposite flat side of the sensor chip, by at least one electrical signal line path passing through the sensor chip, and the contact panels are connected to the terminal panels of the chip supporting body by electrically conductive material.

Abstract: A device to extract material of a material reservoir has at least one guide tube with internal space and with an inner wall surrounding the internal space; at least one sled that can implement a sled translation movement in the inner space along a longitudinal alignment of the guide tube; and at least one collection unit with collection surface to collect the material. The collection unit and the sled are coupled to one another such that the sled translation movement of the sled leads to a collection translation movement of the collection surface of the collection unit, and such that the collection surface can be inserted into the material reservoir and be withdrawn from the material reservoir. A rotation mechanism that is operated manually or automatically can be provided with which a wire, which acts as a collection device, can be displaced in vivo over a length of 1 mm to up to 2 cm within a venous cannula.

Abstract: A device for converting mechanical energy into electrical energy has first electrode formed of a first material having a first work function for a charge carrier, and a second electrode formed of a second material having a second work function for a charge carrier, the second work function being different from the first work function. The first electrode and the second electrode are interconnected by a first load circuit in an electroconductive manner. The second electrode is arranged at a variable distance from the first electrode.

Abstract: A nanostructure is provided on a substrate by forming at least one multi-electrode arrangement on the substrate, wherein said electrodes comprise respective electrode areas projected with respect to the opposite electrode ends which extend along a line in such a way that the adjacent ends produce a respectively frequency time-variable potential difference. A suspension of nano-object such as nanotubes, nanowires and/or carbon nanotubes is produced and then transferred to the substrate between the adjacent ends. The assembly of respective individual nano-objects is dielectrophoreticly deposited on the line between said adjacent ends, and the assembly of respective nano-objects is fused in the area of the ends in such a way that the nanostructure is formed.

Abstract: A connection device for random connection of a first member of first transmission/reception units with a second number of second transmission/reception units has a switching matrix that includes a third number of controllable micromechanical switching elements that are respectively activatable to establish a connection between one of the first transmission/reception units and one of the second transmission/reception units. A control circuit selectively activates the respective micromechanical switching elements to selectively establish respective connections between the first number of first transmission/reception units and the second number of transmission/reception units.

Abstract: A separable connection is created between at least one transfer support and the conductor structure. The transfer support including the conductor structure and the substrate are joined together such that a connection that is stronger than the separable connection between the transfer support and the conductor structure is created between the conductor structure and the substrate. The separable connection between the transfer support and the conductor structure of the transfer support is separated while the connection between the conductor structure and the substrate remains intact. The method is particularly suitable for laterally disposing conductor structures comprising nanotubes at relatively low temperatures (T<600° C.), resulting in a substrate with a conductor structure which is connected to the substrate on a contact surface of the substrate and at least one additional contact surface of the substrate.

Abstract: A method for producing an electronic assembly and an electronic assembly which has been correspondingly produced are specified. In this case, CMOS structures are formed in a semiconductor substrate to form a circuit and, after the CMOS structures have been formed, at least one electrical conductor is introduced, in a low-temperature process into an opening in the semiconductor substrate in such a manner that the electrical conductor is formed between a first side and a second side, which is opposite the first side, of the semiconductor substrate to connect the circuit. The electronic assembly allows a close arrangement of electronics and detectors and is suitable, for example, for a medical apparatus.

Abstract: A bed comprises a frame and a deck coupled to the frame. The deck includes a back section, a seat section, a thigh section, and a foot section. An actuator is coupled to the back section to move the back section from a horizontal position to an elevated position relative to the frame.

Abstract: A passive component is integrated into a product having a rewiring location.