Abstract: In one exemplary embodiment, an EMI shield assembly generally includes a frame adapted to be secured to a mounting surface, a cover attachable to the frame, and at least one resilient electrically-conductive member disposed on an inner side of the cover. The at least one resilient electrically-conductive member may be configured to contact at least one electrically-conductive surface on the mounting surface, to establish a current-conducting path from the electrically-conductive surface to the cover when the cover is attached to the frame. The at least one resilient electrically-conductive member may be configured to be compressed against at least one electrically-conductive surface on the mounting surface when the cover is attached to the frame. This compression may help provide an effective amount of contact pressure against the at least one electrically-conductive surface to establish a predetermined or desirable level of electrical conductivity.

Abstract: A shielding enclosure generally includes a frame and a lid. The frame may include sidewalls, an inwardly extending horizontal lip defining an open top for the frame, generally horizontal flanges extending outwardly relative to the lip, and one or more openings disposed generally under the corresponding one or more flanges. The lid may include an upper surface to cover the frame's open top, a downwardly extending lip configured to at least partially fit generally over the frame's sidewalls, one or more openings, and one or more generally upwardly extending flanges having one or more lateral detent protrusions. The lid may be attached to the frame by the interlocking engagement of the lid's one or more lateral detent protrusions generally under the corresponding one or more flanges of the frame, which said one or more flanges of the frame are at least partially received through the corresponding one or more openings of the lid.

Abstract: A shielding enclosure generally includes a frame and a lid. The frame may include sidewalls, an inwardly extending horizontal lip defining an open top for the frame, generally horizontal flanges extending outwardly relative to the lip, and one or more openings disposed generally under the corresponding one or more flanges. The lid may include an upper surface to cover the frame's open top, a downwardly extending lip configured to at least partially fit generally over the frame's sidewalls, one or more openings, and one or more generally upwardly extending flanges having one or more lateral detent protrusions. The lid may be attached to the frame by the interlocking engagement of the lid's one or more lateral detent protrusions generally under the corresponding one or more flanges of the frame, which said one or more flanges of the frame are at least partially received through the corresponding one or more openings of the lid.

Abstract: The electromagnetic shielding device includes a frame and a lid. The frame includes sidewalls and upstanding male detent elements with outwardly extending detent protrusions. The lid includes a generally planar top with peripheral lip portions. Slots are formed at the intersection of the lid and the peripheral lip portions so that upstanding male detent elements can extend therethrough and detent engage the frame to the lid. Variations of the detent engagement are shown in different embodiments, by which can be achieved a reduced height of the electromagnetic shielding device.

Abstract: According to various aspects of the present disclosure, exemplary embodiments are provided of EMI shielding apparatus capable of providing board level EMI shielding for one or more electronic components while also providing dissipation of heat generated by the one or more electronic components. In one particular embodiment, an apparatus generally includes a board level shield having at least one resiliently compressible EMI gasket disposed along at least a portion of the board level shield. At least one thermally-conductive compliant material is disposed relative to an inner surface of the board level shield and to the one or more electrical components. The at least one thermally-conductive material can form a thermally-conducting heat path from the one or more electrical components to the board level shield.

Abstract: According to various aspects of the present disclosure, exemplary embodiments are of assemblies capable of providing board level EMI shielding and heat dissipation of one or more electrical components. Other aspects relate to components of such assemblies. Further aspects relate to methods of using EMI shielding and thermal management assemblies. Additional aspects relate to methods of making EMI shielding and thermal management assemblies, and methods of making the components thereof.

Abstract: An EMI shielding assembly generally includes a frame attachable to the board's first side, and first and second covers configured to be respectively positioned on generally opposite sides of the board. The first cover is configured to cover at least one opening along an upper portion of the frame. The second cover is attachable to the first cover with the first and second covers respectively positioned along the board's generally opposite first and second sides. Accordingly, the assembly is operable for shielding one or more electrical components on the board's first side that are within a first interior defined by the frame's walls, first cover, and at least a portion of the board's first side, and one or more electrical components on the board's second side that are within a second interior defined by the second cover and at least a portion of the board's second side.

Abstract: The electromagnetic shielding device includes a frame and a lid. The frame includes sidewalls and upstanding male detent elements with outwardly extending detent protrusions. The lid includes a generally planar top with peripheral lip portions. Slots are formed at the intersection of the lid and the peripheral lip portions so that upstanding male detent elements can extend therethrough and detent engage the frame to the lid. Variations of the detent engagement are shown in different embodiments, by which can be achieved a reduced height of the electromagnetic shielding device.

Abstract: The electromagnetic shielding device includes a frame and a lid. The frame includes sidewalls and upstanding male detent elements with outwardly extending detent protrusions. The lid includes a generally planar top with peripheral lip portions. Slots are formed at the intersection of the lid and the peripheral lip portions so that upstanding male detent elements can extend therethrough and detent engage the frame to the lid. Variations of the detent engagement are shown in different embodiments. In particularly, a reduced height of the electromagnetic shielding device can be achieved.

Abstract: The electromagnetic shielding device includes a frame and a lid. The frame includes sidewalls and upstanding male detent elements with outwardly extending detent protrusions. The lid includes a generally planar top with peripheral lip portions. Slots are formed at the intersection of the lid and the peripheral lip portions so that upstanding male detent elements can extend therethrough and detent engage the frame to the lid. Variations of the detent engagement are shown in different embodiments. In particularly, a reduced height of the electromagnetic shielding device can be achieved.

Abstract: The replacement lid for an electromagnetic shielding device is generally planar with stenciled solder segments formed immediately inwardly adjacent from the periphery thereof. The replacement lid is installed onto an electromagnetic shielding device by placing the stenciled solder segments against the walls of the electromagnetic shielding device so that the unstenciled side of the replacement lid is exposed. The installer then applies a heat source to the unstenciled side of the replacement lid thereby melting the solder and forming a bond between the replacement lid and the shielding device. The replacement lid may be manufactured by securing the replacement lid between a platen and a stencil and using a squeegee to apply solder paste through the stencil onto the replacement lid.