Abstract: A foam-encapsulated electronic assembly particularly suitable for reworking and repair operations, wherein some of the electronic subassemblies must be removed without damaging them, including a plurality of electronic subassemblies removably inserted into a frame, a release agent interposed between the subassemblies and the frame, and subassembly extraction means attached to the subassemblies prior to encapsulation. Preferably, each subassembly has structural holes such as alignment holes, and a loop of flexible line can be secured through the structural holes and encapsulated within the foam, with a part of the line positioned near or at the surface of the foam so that the line may be located when extraction is desired. The release agent can be a tape or film which prevents the foam from bonding the subassembly to the frame. The assembly also preferably includes foam cutting means between laterally adjacent subassemblies.