Patents by Inventor Gerald Hilpert

Gerald Hilpert has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6329723
    Abstract: In a coolant temperature control (1) for regulating the coolant temperature of a power converter of an electrically driven vehicle, in particular an electrical locomotive, the coolant temperature is regulated to a set value (16) that is independent from the current ambient temperature in order to increase the life of the used high-performance traction power converters. As a result, the components are subject to less drastic temperature load alternations.
    Type: Grant
    Filed: July 1, 1999
    Date of Patent: December 11, 2001
    Assignee: DaimlerChrysler AG
    Inventor: Gerald Hilpert
  • Patent number: 5859772
    Abstract: Converters having a 1st power converter (1) on the mains systems side and a 2nd power converter (9) on the load side may have valve arms with insulated gate bipolar transistors (IGBTs) (T1, T2; T1', T2'). In order to be able to switch high currents, as are required in traction applications, a plurality of IGBTs (T1, T2) and (T1', T2') are operated electrically in parallel with one another. In order to avoid destruction or explosion of a module having IGBTs (T1, T2; T1', T2') of this type in the event of a short circuit, a fuse (Si1, Si2; Si1', Si2') is connected in series with each IGBT (T1, T2; T1', T2') on the cathode side thereof, which fuse blows when a predeterminable limit current intensity is exceeded, and thereby interrupts the short-circuit current. The current then flows only via the parallel-connected IGBT.
    Type: Grant
    Filed: August 12, 1997
    Date of Patent: January 12, 1999
    Assignee: ABB Daimler-Benz Transportation (Technology) GmbH
    Inventor: Gerald Hilpert
  • Patent number: 5777849
    Abstract: A power semiconductor module is specified. It comprises a housing into which any desired power semiconductor circuit is installed. The power semiconductor circuit has at least two connections, which are passed out of the housing. According to the invention, the connections have the form of an elongate plug contact. An insulating plate may additionally be provided between the adjacent plug contacts. Reliable, yet easily releasable, low-inductance electrical contact is achieved by this form of the connections.
    Type: Grant
    Filed: February 6, 1996
    Date of Patent: July 7, 1998
    Assignee: Asea Brown Boveri AG
    Inventors: Reinhold Bayerer, Gerald Hilpert, Rolf Schifferli