Abstract: A device includes a first semiconductor chip and a second semiconductor chip which are connected to each other in an electrically conductive manner via a bonding wire, the bonding wire having a contact to the first semiconductor chip at a first contact point and having a contact to the second semiconductor chip at a second contact point, and the device including a further bonding wire which has a further first contact point and a further second contact point, a maximum distance between the bonding wire and a direct connecting line between the first and second contact points perpendicular to the connecting line being greater than a further maximum distance between the further bonding wire and a further connecting line between the further first contact point and the further second contact point perpendicular to the further connecting line.

Abstract: A micromechanical sensor having an analyzer circuit and at least two detecting elements, each of the two detecting elements being connected to the analyzer circuit by at least one signal line. At least one signal line is connected to both detecting elements.

Abstract: A micromechanical sensor having an analyzer circuit and at least two detecting elements, each of the two detecting elements being connected to the analyzer circuit by at least one signal line. At least one signal line is connected to both detecting elements.

Abstract: An electronic device includes a resonant circuit and an evaluation circuit. The resonant circuit includes an acceleration-sensitive sensor which is excited to vibrate during a testing phase of the acceleration-sensitive sensor. The evaluation circuit is coupled to the resonant circuit to determine a performance reliability of the acceleration-sensitive sensor.

Abstract: An acceleration sensor having a piezoelectric sensor element, which is supported as a flexural resonator in a holding module and whose electrodes are connected to an evaluation circuit. The holding module mechanically fixes the sensor element in position and provides, at the same time, for its electrical contacting.

Abstract: A piezoelectric force sensor includes a piezoelectric plate, with one electrode on each of the top and bottom sides of the plate. One of the electrodes is electrically connected via a conductor to a contact pad. In the case that the piezoelectric plate experiences breakage, the conductor is broken, and the remaining residual capacitance of the conductor and contact pad becomes so comparatively small that the breakage can be reliably detected.