Patents by Inventor Gerald J. Martyniak

Gerald J. Martyniak has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4420206
    Abstract: The invention relates to a connector(12) adapted to be used with a plastic sheet (15) on a circuit board (13) to effect electrical connection between registering conductive areas of conductive strips 17 and 14 on the adjacent surfaces, of respectively, the sheet and the board. The connector comprises (a) a housing (20) adapted to be placed over the sheet and board and having legs (22) with means at their lower ends to couple the housing to the board (13), and (b) a pressure generating body (41) adjustable in the housing (20) between a first setting at which the body exerts no significant pressure and a second setting at which the body exerts downward pressure on the sheet resulting in a pressing together of the said registering conductive areas on the sheet and board.
    Type: Grant
    Filed: November 30, 1981
    Date of Patent: December 13, 1983
    Assignee: Western Electric Company, Inc.
    Inventor: Gerald J. Martyniak
  • Patent number: 4361862
    Abstract: Electrical components (10 or 30) are fastened to a mounting surface (16) of a printed circuit board (11) by forming a plurality of thermoplastic pins (20, 35) projecting from the mounting surface of the board adjacent to positions where components are to be located. The component is placed on the board so that portions of the component are located adjacent to portions of the pins, following which portions of the pins are heated and formed about portions of the component to form plastic locking sections (22 or 37) that fasten the component to the board in a desired position. The mounting surface (16) of the board may be formed with a pocket (18 or 33) that receives and positions the component at the desired location, so that component leads (17 or 32) extend along the mounting surface to positions overlapping lead-contact areas (14, 34) of printed contact patterns deposited on the mounting surface, after which the leads are attached to the contact areas, as by reflow soldering.
    Type: Grant
    Filed: October 6, 1980
    Date of Patent: November 30, 1982
    Assignee: Western Electric Company, Inc.
    Inventor: Gerald J. Martyniak
  • Patent number: 4263341
    Abstract: Printed circuits, and techniques and materials for making printed circuits by prior-known metal-spraying techniques, particularly for making two-sided boards with metal through-hole connects. Preferably, a primer coating (40) of a metal such as zinc is sprayed onto one surface of the substrate, through a chrome-plated metal stencil (30), after which a conductive coating (13 or 16), such as copper or nickel, is sprayed onto the zinc coating to form the conductive patterns. Through hole connections (20) are fabricated by forming tapered holes (50), and placing a removable stop member (51) against the narrow end of the hole before spraying the patterns. The first pattern (16) is then sprayed on from the wide end of the hole (50) so that a portion (52) of the material coats the walls of the hole and forms a bridging strip (53) across the narrow end of the hole.
    Type: Grant
    Filed: December 19, 1978
    Date of Patent: April 21, 1981
    Assignee: Western Electric Company, Inc.
    Inventor: Gerald J. Martyniak
  • Patent number: 4254448
    Abstract: Electrical components (10 or 30) are fastened to a mounting surface (16) of a printed circuit board (11) by forming a plurality of thermoplastic pins (20, 35) projecting from the mounting surface of the board adjacent to positions where components are to be located. The component is placed on the board so that portions of the component are located adjacent to portions of the pins, following which portions of the pins are heated and formed about portions of the component to form plastic locking sections (22 or 37) that fasten the component to the board in a desired position. The mounting surface (16) of the board may be formed with a pocket (18 or 33) that receives and positions the component at the desired location, so that component leads (17 or 32) extend along the mounting surface to positions overlapping lead-contact areas (14, 34) of printed contact patterns deposited on the mounting surface, after which the leads are attached to the contact areas, as by reflow soldering.
    Type: Grant
    Filed: May 14, 1979
    Date of Patent: March 3, 1981
    Assignee: Western Electric Company, Inc.
    Inventor: Gerald J. Martyniak