Abstract: A piezoactuator includes a base. The base contains a stack of piezoelectric layers and electrode layers interspersed among the piezoelectric layers. The piezoelectric layers contain a ceramic material; the piezoelectric layers and the electrode layers are sintered together; and the base has a hole therethrough. The piezoactuator also includes a contact element, such as a pin, in the hole. The contact element is for use in forming an electrical connection to at least some of the electrode layers.

Abstract: The invention relates to a piezoactuator having a base body (4) that contains a stack (1) of superimposed piezoelectric layers (2) and electrode layers (3) disposed between them, in which the piezoelectric layers (2) contain ceramic material and are sintered together, in which, perpendicular to the electrode layers (3a, 3b), a hole passes through the base body (4), into which a pin (5a, 5b, 5c, 5d) is inserted. The invention also relates to a method for the production of a piezoactuator, comprising the following steps: a) Formation of a layered stack (1) of superimposed ceramic green foils (2) and electrode layers (3a, 3b) b) Drilling of a hole into a layered stack (1) c) Insertion of a pin (5a, 5b, 5c, 5d, 9) into the hole.

Abstract: A piezo actuator (1) is disclosed that has a contact lug (20, 21) for the electrical contacting of an electrode (14, 15) of an actuator member (11). Due to an expansion and contraction of the actuator member, a mechanical stress occurs in the contact lug that is minimized in that the contact lug has a device for adapting the expanse to a dimension of the expansion and contraction. The device is, for example, a deformation material in the form of a wire weave. The piezo actuator is utilized for the drive of an injection valve in an internal combustion engine.

Abstract: In a passive network, such as a CC array in the form of a chip, internal conductors of a number of capacitors are led out at a longitudinal side surface of a chip wafer as terminals therefor. Common frame electrodes of the number of capacitors are, in contrast, led out at both frontal side surfaces of the chip wafer.