Abstract: A method for producing an electronic module includes arranging a housing part element on a circuit board element after separately producing and preparing the housing part element. The housing part element is formed with a material that can be reversibly plasticized, such as a thermoplastic like polyamide. At least a portion of a surface of the housing part element is reversibly plasticized, for example via local heating or light irradiation. Arranging the housing part element on the circuit board element includes joining the plasticized portion of the surface of the housing part element to a microstructured portion of the circuit board element and then hardening the plasticized portion to form an interlocking and hermetically sealed connection therebetween.

Abstract: An electronic module includes a printed circuit board element with at least one electronic component and a case element. The case element is at least partially connected to the printed circuit board element with a form fit. The at least one electronic component is arranged between the case element and the printed circuit board element. The form-fit connection of the printed circuit board element and the case element includes micro structuring of the printed circuit board element.

Abstract: A polymer composition containing at least one thermoplastic polymer, in particular polyamide. To reduce the formation of conductive deposits on a metal or metal-plastic composite 10 coated and/or extrusion coated using the polymer composition, the polymer composition contains at least one copper halide and at least one alkali halide.

Abstract: A line set having a plastic body made of plastic material for contacting a sensor and to a method for manufacturing a line set of this type. The plastic body includes at least one flexible, elastic area like a film hinge. At least one cable is embedded plane-parallel in the plastic body over its length.