Abstract: In one embodiment, a semiconductor package comprising a metal base coupled to one or more pins, a semiconductor body having a top side and a bottom side, the top side comprising an integrated circuit and one or more metal surfaces for coupling the integrated circuit to the one more pins with one or more bonding wires, the bottom side non-positively coupled to the metal base, a disk having a top area and a base area, the base area coupled to the top side of the semiconductor body and at least partially covering the integrated circuit, the disk being electrically insulated from the semiconductor body, and a plastic compound completely enclosing the one or more bonding wires, and at least partially enclosing the top side of the integrated circuit, the top area of the disk, and the one or more pins.

Abstract: In one embodiment, a semiconductor package comprising a metal base coupled to one or more pins, a semiconductor body having a top side and a bottom side, the top side comprising an integrated circuit and one or more metal surfaces for coupling the integrated circuit to the one more pins with one or more bonding wires, the bottom side non-positively coupled to the metal base, a disk having a top area and a base area, the base area coupled to the top side of the semiconductor body and at least partially covering the integrated circuit, the disk being electrically insulated from the semiconductor body, and a plastic compound completely enclosing the one or more bonding wires, and at least partially enclosing the top side of the integrated circuit, the top area of the disk, and the one or more pins.

Abstract: A semiconductor chip for producing a controllable frequency is disclosed, for example in transceivers. The semiconductor chip includes a voltage-controlled oscillator located in a first chip region of the semiconductor chip, a heat source, in particular in the form of a power amplifier and/or in the form of a phase-locked loop, that is located in a second chip region of the semiconductor chip, and contacts for contacting the semiconductor chip in a bonding process. At least a part of the contacts is located between the first and second chip regions in such a manner that it functions as thermal shielding between the first and second chip regions.

Abstract: A d.c. signal controlled oscillator includes a frequency-determining network having a control input and a modulation input. A phase regulating loop includes the oscillator and components that provide a control signal to the control input. A circuit apparatus for driving the oscillator includes a modulation generator that provides a modulation signal to the modulation input, and a circuit arrangement that autonomously generates a signal depending on and representing a slope of the modulation and provides this slope signal to the modulation generator, which generates the modulation signal dependent on the slope signal.

Abstract: A d.c. signal controlled oscillator includes a frequency-determining network having a control input and a modulation input. A phase regulating loop includes the oscillator and components that provide a control signal to the control input. A circuit apparatus for driving the oscillator includes a modulation generator that provides a modulation signal to the modulation input, and a circuit arrangement that autonomously generates a signal depending on and representing a slope of the modulation and provides this slope signal to the modulation generator, which generates the modulation signal dependent on the slope signal.

Abstract: An integrated circuit layout complete with a bus logic unit connected to a data bus. The data bus includes at least one activation line for an activation signal, making it possible--via the data bus--to activate the bus logic unit for data transmission. A controllable power supply unit is provided with a control input connected to the activation line and serves to feed an operating current to the bus logic unit. The operating current is reduced by the activation signal when the bus logic unit is deactivated.