Abstract: A circuit board is provided with a plurality of groups of connectors, so disposed and arranged in respect to each other that each group is capable of receiving a chip carrier. A fluid conduit, carrying a coolant, extends through each group so that when the contacts of a chip carrier are assembled to a group of connectors, a circuit chip, having a heat dissipating bar, is in close contact with the conduit. Conductors on each chip make electrical contact to the contacts on the chip carrier. A clip fastener is fastened to the carrier and includes bias means to bias the chip so that electrical connection is established between the chip contacts and the carrier contacts and thermal connection is established between the heat dissipating bar and the conduit.

Abstract: A temperature sensing device is disclosed in which the temperature sensing element is a semiconductor diode. The reference supply current for the diode is derived from an offset voltage regulator in such a way that power source fluctuations appear as common mode inputs to an operational amplifier. The operational amplifier controls a voltage controlled oscillator. The output pulses of the oscillator are counted over periodic time intervals of predetermined length to produce periodic counts which correlate to temperature. The device is designed in the preferred embodiment for use on commercial alternating current power lines where the length of timing for temperature sensing, the interval between readings and switching between multiple sensors is controlled by the power line frequency.