Abstract: A transformer assembly and method for powering a load with a secondary fault protected isolated secondary. The fault fault path is isolated from ground allowing voltage detection of faults and the return terminal is isolated from the midpoint for multiple load connection schemes using the midpoint as a ground connection. A power control system is connected between the primary winding and the input terminal with a ground fault detection circuit connected between the fault path and the ground terminal, where the ground fault detection circuit is operable to detect a fault and activate the power control system to disconnect the source of power from the primary winding in response to detecting the fault. Also disclosed is a high frequency filter adapted to reduce the effects of high frequency transients and a capacitive reactance connected between the input terminal means and the ground terminal. The capacitive reactance is adapted to provide a ground fault path for fault signals.

Abstract: Gold is deposited on a copper base defining electrical circuit features disposed on a substrate containing a palladium seeder, by initially treating the substrate with an alkaline cleaner, followed by treating the substrate with sodium persulfate, and subsequently treating the substrate with a diluted sulfuric acid solution. The substrate is rinsed between each one of the treatments, and after the final rinse following treatment with diluted sulfuric acid, the substrate is immersed in a gold deposition solution whereby gold is deposited on the exposed surfaces of the copper circuit features on a substrate. The process embodying the present invention provides a method for depositing gold on high density copper conductor lines or pads, even in areas of the surface in which the conductors are spaced apart 2.0 mil or less, without cleaning or removing the palladium seed from the surface.

Abstract: Gold is deposited on a copper base defining electrical circuit features disposed on a substrate containing a palladium seeder, by initially treating the substrate with an alkaline cleaner, followed by treating the substrate with sodium persulfate, and subsequently treating the substrate with a diluted sulfuric acid solution. The substrate is rinsed between each one of the treatments, and after the final rinse following treatment with diluted sulfuric acid, the substrate is immersed in a gold deposition solution whereby gold is deposited on the exposed surfaces of the copper circuit features on a substrate. The process embodying the present invention provides a method for depositing gold on high density copper conductor lines or pads, even in areas of the surface in which the conductors are spaced apart 2.0 mil or less, without cleaning or removing the palladium seed from the surface.

Abstract: A low cost power supply with enhanced safety protection for neon lamps connected in a midpoint commoned lamp configuration. The power supply has a return path which is isolated from the earth ground so that a fault current does not flow from the output terminals to the earth ground. The windings are phased in a series opposing configuration such that the voltages between the output terminals sum to zero. This power supply of mid-point connected secondary coil design is capable of operating lamp lengths that typically require 15,000 volts of open circuit voltage while not exceeding 7500 volts to ground when any one output terminal is grounded.

Abstract: A low cost power supply for neon lamps provides enhanced safety protection. The power supply has a transformer with a return path which is separate from the earth ground so that a fault current can be detected. The power supply has a mid-point connected secondary coil design which operates a mid-point connected neon lamp configuration. A protection circuit detects the fault current flowing between the output terminals and the earth ground. When the fault current is detected, the protection circuit disconnects the input power from the primary winding. An input power reset is required to restart the power supply once the protection circuit has operated.

Abstract: A transformer enclosure design with a separate receptacle housing used for power transformers especially those used with neon lamps. The separate receptacle housing allows for multiple neon gas discharge tube mounting orientations and allows for multiple transformer mounting configurations with one enclosure design. The receptacle is used to connect the ends of a gas discharge lamp to the transformer. The receptacle housing contains a pair of recessed bushings and features a removable mounting bracket that can be mounted in several positions. Connection between the receptacle housing and the transformer housing is through flexible GTO wiring. The design allows an almost infinite number of spatial mounting orientations so that any tube orientation may be accommodated.

Abstract: An electroless metal plating bath composition, a corresponding method for electrolessly depositing a metal onto a substrate surface, as well as the resulting, metallized substrate, are disclosed. The inventive bath composition includes water, a soluble source of the metal ions it is desired to chemically reduce at, and deposit onto, the substrate surface of interest, and a complexing agent for the metal ions. In addition, the bath composition includes a soluble source of any one or more of a select group of what are termed mediator ions, which group includes palladium (Pd), platinum (Pt), silver (Ag), ruthenium (Ru), iridium (Ir), osmium (Os) and rhodium (Rh) ions, as well as a complexing agent for the mediator ions. Moreover, the bath composition includes a chemical reducing agent, which primarily serves to chemically reduce the mediator ions at the substrate surface of interest.

Abstract: An electroless metal plating bath composition, a corresponding method for electrolessly depositing a metal onto a substrate surface, as well as the resulting, metallized substrate, are disclosed. The inventive bath composition includes water, a soluble source of the metal ions it is desired to chemically reduce at, and deposit onto, the substrate surface of interest, and a complexing agent for the metal ions. In addition, the bath composition includes a soluble source of any one or more of a select group of what are termed mediator ions, which group includes palladium (Pd), platinum (Pt), silver (Ag), ruthenium (Ru), iridium (Ir), osmium (Os) and rhodium (Rh) ions, as well as a complexing agent for the mediator ions. Moreover, the bath composition includes a chemical reducing agent, which primarily serves to chemically reduce the mediator ions at the substrate surface of interest.