Patents by Inventor Gerald L. Leap

Gerald L. Leap has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6726083
    Abstract: An apparatus for processing printed circuit boards including a system for measuring and controlling solder wave height generally comprises conveyor system for transporting printed circuit board through a number of processing stations. The system for measuring and controlling the wave height of solder includes a sensor which is mounted in close proximity to the interface defined between the surface of the solder wave and the bottom surface of the printed circuit board. The sensor is coupled to a micro-controller and the micro-controller is coupled to a pump motor. The pump motor is coupled to a solder bath which generates the solder wave and is controlled to operate at a predetermined speed to maintain a predetermined solder wave height during the process of wave soldering printed circuit boards. The sensor provides a number voltages to the micro-controller representing the distance between the sensor and the top surface of the solder wave. The voltages are converted into a number of values.
    Type: Grant
    Filed: July 8, 2002
    Date of Patent: April 27, 2004
    Assignee: Speedline Technologies, Inc.
    Inventor: Gerald L. Leap
  • Publication number: 20030057257
    Abstract: An apparatus for processing printed circuit boards including a system for measuring and controlling solder wave height generally comprises conveyor system for transporting printed circuit board through a number of processing stations. The system for measuring and controlling the wave height of solder includes a sensor which is mounted in close proximity to the interface defined between the surface of the solder wave and the bottom surface of the printed circuit board. The sensor is coupled to a micro-controller and the micro-controller is coupled to a pump motor. The pump motor is coupled to a solder bath which generates the solder wave and is controlled to operate at a predetermined speed to maintain a predetermined solder wave height during the process of wave soldering printed circuit boards. The sensor provides a number voltages to the micro-controller representing the distance between the sensor and the top surface of the solder wave. The voltages are converted into a number of values.
    Type: Application
    Filed: July 8, 2002
    Publication date: March 27, 2003
    Inventor: Gerald L. Leap
  • Patent number: 6415972
    Abstract: An apparatus for processing printed circuit boards including a system for measuring and controlling solder wave height generally comprises conveyor system for transporting printed circuit board through a number of processing stations. The system for measuring and controlling the wave height of solder includes a sensor which is mounted in close proximity to the interface defined between the surface of the solder wave and the bottom surface of the printed circuit board. The sensor is coupled to a micro-controller and the micro-controller is coupled to a pump motor. The pump motor is coupled to a solder bath which generates the solder wave and is controlled to operate at a predetermined speed to maintain a predetermined solder wave height during the process of wave soldering printed circuit boards. The sensor provides a number voltages to the micro-controller representing the distance between the sensor and the top surface of the solder wave. The voltages are converted into a number of values.
    Type: Grant
    Filed: June 2, 2000
    Date of Patent: July 9, 2002
    Assignee: Speedline Technologies, Inc.
    Inventor: Gerald L. Leap