Abstract: Thermoplastic molding compositions, comprising A) from 10 to 99.999% by weight of a polyimide B) from 0.001 to 20% by weight of iron powder with a particle size of at most 10 ?m (d50 value), which is obtainable via thermal decomposition of pentacarbonyliron, C) from 0 to 70% by weight of further additives, where the total of the percentages by weight of components A) to C) is 100%.

Abstract: Thermoplastic molding compositions, comprising A) from 10 to 99.999% by weight of a polyimide B) from 0.001 to 20% by weight of iron powder with a particle size of at most 10 ?m (d50 value), which is obtainable via thermal decomposition of pentacarbonyliron, C) from 0 to 70% by weight of further additives, where the total of the percentages by weight of components A) to C) is 100%.

Abstract: A semiconductor component including a first integrated circuit in a substrate which is adapted to produce electrical signals with a high-frequency signal component, wherein the substrate is such that the high-frequency signal component can propagate on a substrate surface and/or in the substrate interior, a second integrated circuit in the same substrate which is such that its function can be compromised by high-frequency signals, and a countersignal circuit in the same substrate which is adapted to deliver an electrical countersignal which at least at a selected location of the substrate surface and/or the substrate interior attenuates or eliminates the high-frequency electrical signal component emanating from the first integrated circuit, wherein the countersignal circuit includes a receiver which is adapted to produce an electrical signal dependent on the instantaneous field strength of the high-frequency signal component, and a shielding transistor provided in the substrate and having a control electrode

Abstract: The present invention relates to a tectosilicate having an X-ray diffraction pattern in which at least the following reflections occur: Intensity (%) Diffraction angle 2?/° [Cu K(alpha 1)] 100 ?9.8-10.2 24-34 11.0-11.4 ?9-19 15.5-15.9 12-22 19.4-19.6 19-29 19.6-19.8 100% relating to the intensity of the maximum peak in the X-ray diffraction pattern.

Abstract: A magnetorheological formulation which comprises at least one base oil, at least one magnetizable particle, a at least one dispersant and a at least one thixotropic agent is described.

Abstract: A semiconductor component including a first integrated circuit in a substrate which is adapted to produce electrical signals with a high-frequency signal component, wherein the substrate is such that the high-frequency signal component can propagate on a substrate surface and/or in the substrate interior, a second integrated circuit in the same substrate which is such that its function can be compromised by high-frequency signals, and a countersignal circuit in the same substrate which is adapted to deliver an electrical countersignal which at least at a selected location of the substrate surface and/or the substrate interior attenuates or eliminates the high-frequency electrical signal component emanating from the first integrated circuit, wherein the countersignal circuit includes a receiver which is adapted to produce an electrical signal dependent on the instantaneous field strength of the high-frequency signal component, and a shielding transistor provided in the substrate and having a control electrode

Abstract: The present invention relates to a tectosilicate having an X-ray diffraction pattern in which at least the following reflections occur: Intensity (%) Diffraction angle 2?/° [Cu K(alpha 1)] 100 ?9.8-10.2 24-34 11.0-11.4 ?9-19 15.5-15.9 12-22 19.4-19.6 19-29 19.6-19.8 100% relating to the intensity of the maximum peak in the X-ray diffraction pattern.

Abstract: A magnetorheological formulation which comprises at least one base oil, at least one magnetizable particle, a at least one dispersant and a at least one thixotropic agent is described.

Abstract: Metalizable foils or sheets produced from a plastics mixture comprising, components A, B, C, and D, which gives a total of 100% by weight, a from 5 to 50% by weight of a thermoplastic polymer as component A, b from 50 to 95% by weight of a metal powder with an average particle diameter of from 0.01 to 100 ?m where the normal electrode potential of the metal in acidic solution is more negative than that of silver, as component B, c from 0 to 10% by weight of a dispersing agent as component C, and d from 0 to 40% by weight of fibrous or particulate fillers or their mixtures as component D, wherein the tensile strain at break of component A is greater by a factor of from 11 to 100 than the tensile strain at break of the plastics mixture comprising components A, B, and, if present, C and D, and wherein the tensile strength of component A is greater by a factor of from 0.5 to 4 than the tensile strength of the plastics mixture comprising components A, B, and, if present, C and D.

Abstract: The present invention relates to a dispersion for application of a metal layer on a substrate that is not electrically conductive, comprising an organic binder component, a metal component with different metals and/or metal particle shapes, and with a solvent component. The invention moreover relates to a process for preparation of the dispersion, to a process using the dispersion for production of a metal layer, if appropriate structured, and to the resultant substrate surfaces and their use.

Abstract: A process for preparing an organometallic framework material comprising reacting at least one metal salt with at least one at least bidentate compound capable of coordination to the metal ion of said metal salt, in the presence of an aqueous solvent system and at least one base wherein at least one bidentate compound comprises at least carboxy group and at least one further group which is not a carboxy group and which is capable of forming a hydrogen bridge linkage.

Abstract: The present invention relates to a tectosilicate having an X-ray diffraction pattern in which at least the following reflections occur: Intensity (%) Diffraction angle 2?/° [Cu K(alpha 1)] 100 ?9.8-10.2 24-34 11.0-11.4 ?9-19 15.5-15.9 12-22 19.4-19.6 19-29 19.6-19.8 100% relating to the intensity of the maximum peak in the X-ray diffraction pattern.

Abstract: A process for preparing an organometallic framework material comprising reacting at least one metal salt with at least one at least bidentate compound capable of coordination to the metal ion of said metal salt, in the presence of an aqueous solvent system and at least one base wherein at least one bidentate compound comprises at least carboxy group and at least one further group which is not a carboxy group and which is capable of forming a hydrogen bridge linkage.