Abstract: An air handler apparatus includes at least one heat exchanger device with a cooling fluid region separated from a temperature transfer fluid region, an evaporator device comprising an evaporator housing and at least one evaporator coil, and a pump. The cooling fluid region has a cooling fluid input and a cooling fluid output and the temperature transfer fluid region has a temperature transfer fluid input and a temperature transfer fluid output. The evaporator housing defines an air passage having an air input and an air output. The evaporator coil has an evaporator coil input coupled to the temperature transfer fluid output and an evaporator output coupled to temperature transfer fluid input of the temperature transfer fluid region in the heat exchanger device. The pump is coupled to the temperature transfer fluid region in the heat exchanger device to pump temperature transfer fluid between the temperature transfer fluid region and the evaporator coil when activated.

Abstract: A cooling assembly for cooling server racks includes a server rack enclosure sub-assembly that includes at least one panel member defining a volume for receiving one or more server racks having a front portion and a rear portion, at least one of the panel members is a rear panel member; at least one frame member defines an opening for receiving the rear portion of the server racks to form a hot space between the rear panel member and the combination of the frame member and the rear portion of the server racks; a cooling sub-assembly disposed in thermal communication with the hot space to cool at least one server supported in the server rack and including a chassis receiving at least one heat exchange member for exchanging heat between a refrigerant fluid flowing through the heat exchange member and fluid flowing through the hot space heated by the server.

Abstract: A modular server rack cooling structure for cooling at least one server in at least one server rack of a data center assembly includes at least a first supporting member and at least a first heat exchanger. The first heat exchanger is coupled to the first supporting member, which is configured to position the first heat exchanger in heat transfer relationship with the at least one server. The first heat exchanger is not attached to the at least one server rack. The modular server rack cooling structure is also applied to a system that includes at least a first rack and at least a second rack disposed opposite from one another to form a hot aisle or a cold aisle. A method is disclosed for installing additional heat exchangers on the support structure of a modular server rack cooling structure to meet increased cooling capacity requirements without requiring additional space.

Abstract: An evaporative fluid cooling apparatus includes a cooling housing, at least two fluid coils, an air movement apparatus, and one or more spray apparatuses. The cooling housing defines a cooling chamber with an air housing input and an air housing output. The fluid coils are positioned in and extend across at least a portion of the cooling chamber in a spaced apart stacked arrangement. One of the fluid coils is positioned closer to the air housing output and has a first fluid input configured to be coupled to a fluid return from one or more air handler devices and a first fluid output coupled to a second fluid input to the other fluid coil. The other fluid coil is positioned closer to the air housing input and has a second fluid output configured to be coupled to a fluid supply to the air handler devices.

Abstract: Systems and methods relating to a plural in-series pumped liquid refrigerant trim evaporator cycle are described. The cooling systems include a first evaporator coil in thermal communication with an air intake flow to a heat load, and a first liquid refrigerant distribution unit in thermal communication with the first evaporator coil. The cooling systems further include a second evaporator coil disposed in series with the first evaporator coil in the air intake flow and in thermal communication with the air intake flow, and a second liquid refrigerant distribution unit in thermal communication with the second evaporator coil. A trim compression cycle of the second liquid refrigerant distribution unit is configured to further cool the air intake flow through the second evaporator coil when the temperature of the first fluid flowing out of the main compressor of the second liquid refrigerant distribution unit exceeds a predetermined threshold temperature.

Abstract: A space-saving, high-density modular data pod and a method of cooling a plurality of computer racks are disclosed. The modular data pod includes an enclosure including wall members contiguously joined to one another along at least one edge of each wall member in the shape of a polygon and a data pod covering member. Computer racks arranged within the enclosure form a first volume between the inner surface of the wall members and first sides of the computer racks. A second volume is formed of second sides of the computer racks. A computer rack covering member encloses the second volume and the data pod covering member form a third volume coupling the first volume to the second volume. An air circulator continuously circulates air through the first, second, and third volumes. The method includes circulating air between the first and second volumes via the third volume and the computer racks.

Abstract: An air handler apparatus includes at least one heat exchanger device with a cooling fluid region separated from a temperature transfer fluid region, an evaporator device comprising an evaporator housing and at least one evaporator coil, and a pump. The cooling fluid region has a cooling fluid input and a cooling fluid output and the temperature transfer fluid region has a temperature transfer fluid input and a temperature transfer fluid output. The evaporator housing defines an air passage having an air input and an air output. The evaporator coil has an evaporator coil input coupled to the temperature transfer fluid output and an evaporator output coupled to temperature transfer fluid input of the temperature transfer fluid region in the heat exchanger device. The pump is coupled to the temperature transfer fluid region in the heat exchanger device to pump temperature transfer fluid between the temperature transfer fluid region and the evaporator coil when activated.

Abstract: An air handler apparatus includes at least one heat exchanger device with a cooling fluid region separated from a temperature transfer fluid region, an evaporator device comprising an evaporator housing and at least one evaporator coil, and a pump. The cooling fluid region has a cooling fluid input and a cooling fluid output and the temperature transfer fluid region has a temperature transfer fluid input and a temperature transfer fluid output. The evaporator housing defines an air passage having an air input and an air output. The evaporator coil has an evaporator coil input coupled to the temperature transfer fluid output and an evaporator output coupled to temperature transfer fluid input of the temperature transfer fluid region in the heat exchanger device. The pump is coupled to the temperature transfer fluid region in the heat exchanger device to pump temperature transfer fluid between the temperature transfer fluid region and the evaporator coil when activated.

Abstract: An evaporative fluid cooling apparatus includes a cooling housing, at least two fluid coils, an air movement apparatus, and one or more spray apparatuses. The cooling housing defines a cooling chamber with an air housing input and an air housing output. The fluid coils are positioned in and extend across at least a portion of the cooling chamber in a spaced apart stacked arrangement. One of the fluid coils is positioned closer to the air housing output and has a first fluid input configured to be coupled to a fluid return from one or more air handler devices and a first fluid output coupled to a second fluid input to the other fluid coil. The other fluid coil is positioned closer to the air housing input and has a second fluid output configured to be coupled to a fluid supply to the air handler devices.

Abstract: An evaporative fluid cooling apparatus includes a cooling housing, at least two fluid coils, an air movement apparatus, and one or more spray apparatuses. The cooling housing defines a cooling chamber with an air housing input and an air housing output. The fluid coils are positioned in and extend across at least a portion of the cooling chamber in a spaced apart stacked arrangement. One of the fluid coils is positioned closer to the air housing output and has a first fluid input configured to be coupled to a fluid return from one or more air handler devices and a first fluid output coupled to a second fluid input to the other fluid coil. The other fluid coil is positioned closer to the air housing input and has a second fluid output configured to be coupled to a fluid supply to the air handler devices.

Abstract: An evaporative fluid cooling apparatus includes a cooling housing, at least two fluid coils, an air movement apparatus, and one or more spray apparatuses. The cooling housing defines a cooling chamber with an air housing input and an air housing output. The fluid coils are positioned in and extend across at least a portion of the cooling chamber in a spaced apart stacked arrangement. One of the fluid coils is positioned closer to the air housing output and has a first fluid input configured to be coupled to a fluid return from one or more air handler devices and a first fluid output coupled to a second fluid input to the other fluid coil. The other fluid coil is positioned closer to the air housing input and has a second fluid output configured to be coupled to a fluid supply to the air handler devices.

Abstract: An air handler apparatus includes at least one heat exchanger device with a cooling fluid region separated from a temperature transfer fluid region, an evaporator device comprising an evaporator housing and at least one evaporator coil, and a pump. The cooling fluid region has a cooling fluid input and a cooling fluid output and the temperature transfer fluid region has a temperature transfer fluid input and a temperature transfer fluid output. The evaporator housing defines an air passage having an air input and an air output. The evaporator coil has an evaporator coil input coupled to the temperature transfer fluid output and an evaporator output coupled to temperature transfer fluid input of the temperature transfer fluid region in the heat exchanger device. The pump is coupled to the temperature transfer fluid region in the heat exchanger device to pump temperature transfer fluid between the temperature transfer fluid region and the evaporator coil when activated.

Abstract: A cooling assembly for cooling server racks includes a server rack enclosure sub-assembly that includes at least one panel member defining a volume for receiving one or more server racks having a front portion and a rear portion, at least one of the panel members is a rear panel member; at least one frame member defines an opening for receiving the rear portion of the server racks to form a hot space between the rear panel member and the combination of the frame member and the rear portion of the server racks; a cooling sub-assembly disposed in thermal communication with the hot space to cool at least one server supported in the server rack and including a chassis receiving at least one heat exchange member for exchanging heat between a refrigerant fluid flowing through the heat exchange member and fluid flowing through the hot space heated by the server.

Abstract: A modular server rack cooling structure for cooling at least one server in at least one server rack of a data center assembly includes at least a first supporting member and at least a first heat exchanger. The first heat exchanger is coupled to the first supporting member, which is configured to position the first heat exchanger in heat transfer relationship with the at least one server. The first heat exchanger is not attached to the at least one server rack. The modular server rack cooling structure is also applied to a system that includes at least a first rack and at least a second rack disposed opposite from one another to form a hot aisle or a cold aisle. A method is disclosed for installing additional heat exchangers on the support structure of a modular server rack cooling structure to meet increased cooling capacity requirements without requiring additional space.

Abstract: Systems and methods for cooling an inverter of a variable frequency drive that drives a compressor in a cooling system for electronic equipment are disclosed. The system includes a first fluid circuit that cools electronic equipment using a first fluid flowing therethrough and a second fluid circuit that free cools a second fluid flowing therethrough. The second fluid circuit cools the first fluid using the free-cooled second fluid. The system further includes a third fluid circuit that mechanically cools the second fluid using a third fluid flowing therethrough as a function of the wet bulb temperature of atmospheric air. The third fluid circuit includes at least one compressor compresses the third fluid and is driven by a motor coupled to the variable frequency drive. At least a portion of the first fluid flowing through the third fluid circuit is diverted to cool the inverter of the variable frequency drive.

Abstract: The present invention relates to a process for production of pure terephthalic acid comprising: a) removing a mother liquor from a terephthalic acid through a filter with a gas, wherein the gas comprises steam at a concentration of least about 50% by volume; b) purifying the gas; and c) recycling the gas purified in step (b) back to step (a).

Abstract: The invention relates to a process for producing terephthalic acid and for purifying the mother liquor resulting from said process. Useful compounds can be extracted from the mother liquor and the purified mother liquor can be returned for use in the process. Advantageously, certain parameters of the mother liquor purification method are selected such that the purification provides an economic benefit as compared with other purification methods.

Abstract: Systems and methods for cooling an inverter of a variable frequency drive that drives a compressor in a cooling system for electronic equipment are disclosed. The system includes a first fluid circuit that cools electronic equipment using a first fluid flowing therethrough and a second fluid circuit that free cools a second fluid flowing therethrough. The second fluid circuit cools the first fluid using the free-cooled second fluid. The system further includes a third fluid circuit that mechanically cools the second fluid using a third fluid flowing therethrough as a function of the wet bulb temperature of atmospheric air. The third fluid circuit includes at least one compressor compresses the third fluid and is driven by a motor coupled to the variable frequency drive. At least a portion of the first fluid flowing through the third fluid circuit is diverted to cool the inverter of the variable frequency drive.

Abstract: The cooling systems and methods of the present disclosure relate to a plural in-series pumped liquid refrigerant trim evaporator cycle that may be incorporated into an existing cooling system to increase the efficiency of the existing cooling system. The cooling systems of the present disclosure include a first evaporator coil in thermal communication with an air intake flow to a heat load, such as a heat load being cooled by the existing cooling system, and a first liquid refrigerant distribution unit in thermal communication with the first evaporator coil. The cooling systems further includes a second evaporator coil disposed in series with the first evaporator coil in the air intake flow and in thermal communication with the air intake flow, and a second liquid refrigerant distribution unit in thermal communication with the second evaporator coil.

Abstract: The cooling systems and methods of the present disclosure relate to cooling electronic equipment in data centers or any other applications that have high heat rejection temperature and high sensible heat ratio.