Patents by Inventor Gerald Schaffler
Gerald Schaffler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8836481Abstract: In a method for operating a transponder (1, 41), the transponder (1, 4) receives a signal from a transmitter (2, 42). The signal comprises an information about a reference sensitivity and the transponder (1, 41) has an input sensitivity such that the transponder (1, 41) detects only signals above a certain power corresponding to the input sensitivity. In response to the received signal, the input sensitivity of the transponder (1, 41) is adjusted to the reference sensitivity.Type: GrantFiled: December 19, 2007Date of Patent: September 16, 2014Assignee: Quotainne Enterprises LLCInventor: Gerald Schaffler
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Patent number: 8494600Abstract: A mobile communication device (1, 10) comprises shielding components that provide electromagnetic shielding or attenuation between a first area (A) and a second area (B, B1, B2) within and/or external of the communication device (1, 10). In said first area (A) an antenna (4) and at least one ferrite (6) are arranged, which ferrite (6) is provided to interact with said antenna (4) and to guide a magnetic flux between said first area (A) and said second area (B, B1, B2).Type: GrantFiled: February 10, 2006Date of Patent: July 23, 2013Assignee: NXP B.V.Inventor: Gerald Schaffler
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Patent number: 7907057Abstract: An electric circuit for a communication device (200) for communicating with a further communication device (500), the electric circuit comprising an inductive antenna element (101) adapted for inductively communicating with the further communication device (500), a capacitive antenna element (102) adapted for capacitively communicating with the further communication device (500), and a common matching circuit (105) adapted to match impedances of the inductive antenna element (101) and of the capacitive antenna element (102).Type: GrantFiled: April 27, 2007Date of Patent: March 15, 2011Assignee: NXP B.V.Inventors: Gerald Schaffler, Erich Merlin
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Patent number: 7733657Abstract: In a module base unit (1) for a module (30) for a data carrier, two connection plates (2, 3) are provided, which comprise electrically conductive material and which each have a direction of extent (4, 5) and which are separated from each other by a gap (16) transverse to the two directions of extent (4, 5), and at least one strain relief member (34) is connected to the two connection plates (2, 3), which strain relief member (34) is constructed to absorb tensile forces occurring parallel to the directions of extent (4, 5) and acting on the connection plates (2, 3).Type: GrantFiled: July 26, 2005Date of Patent: June 8, 2010Assignee: NXP B.V.Inventors: Reinhard Fritz, Gerald Schaffler, Joachim Schober
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Publication number: 20100073143Abstract: In a method for operating a transponder (1, 41), the transponder (1, 4) receives a signal from a transmitter (2, 42). The signal comprises an information about a reference sensitivity and the transponder (1, 41) has an input sensitivity such that the transponder (1, 41) detects only signals above a certain power corresponding to the input sensitivity. In response to the received signal, the input sensitivity of the transponder (1, 41) is adjusted to the reference sensitivity.Type: ApplicationFiled: December 19, 2007Publication date: March 25, 2010Applicant: NXP, B.V.Inventor: Gerald Schaffler
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Publication number: 20100026442Abstract: In a method of manufacturing an antenna structure (16), the following steps are carried out: a) providing a process support (1), b) applying a process support coating (2) to a work surface (1 a) of the process support (1), c) producing a negative (3) of the antenna structure in the process support coating (2) by removing corresponding regions of the process support coating along the contours of the antenna structure to be produced, d) introducing a release agent (4) into the negative antenna structure (3) of the process support coating, e) introducing an electrically conductive antenna material (5) into the negative antenna structure (3) of the process support coating (2), optionally followed by curing of the antenna material (5), f) joining the antenna material (5) to an antenna substrate (7) by means of an adhesive (6), and g) pulling the antenna structure (16) off the process support (1), said antenna structure being joined to the antenna substrate (7) and made of the antenna material (5).Type: ApplicationFiled: August 17, 2005Publication date: February 4, 2010Applicant: KONINKLIJKE PHILIPS ELECTRONICS N.V.Inventor: Gerald Schaffler
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Publication number: 20090190314Abstract: In a module base unit (1) for a module (30) for a data carrier, two connection plates (2, 3) are provided, which comprise electrically conductive material and which each have a direction of extent (4, 5) and which are separated from each other by a gap (16) transverse to the two directions of extent (4, 5), and at least one strain relief member (34) is connected to the two connection plates (2, 3), which strain relief member (34) is constructed to absorb tensile forces occurring parallel to the directions of extent (4, 5) and acting on the connection plates (2, 3).Type: ApplicationFiled: July 26, 2005Publication date: July 30, 2009Applicant: KONINKLIJKE PHILIPS ELECTRONICS N.V.Inventors: Reinhard Fritz, Gerald Schaffler, Joachim Heinz Schober
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Publication number: 20090189769Abstract: An electric circuit for a communication device (200) for communicating with a further communication device (500), the electric circuit comprising an inductive antenna element (101) adapted for inductively communicating with the further communication device (500), a capacitive antenna element (102) adapted for capacitively communicating with the further communication device (500), and a common matching circuit (105) adapted to match impedances of the inductive antenna element (101) and of the capacitive antenna element (102).Type: ApplicationFiled: April 27, 2007Publication date: July 30, 2009Applicant: NXP B.V.Inventors: Gerald Schaffler, Erich Merlin
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Publication number: 20080207282Abstract: A mobile communication device (1, 10) comprises shielding components that provide electromagnetic shielding or attenuation between a first area (A) and a second area (B, B1, B2) within and/or external of the communication device (1, 10). In said first area (A) an antenna (4) and at least one ferrite (6) are arranged, which ferrite (6) is provided to interact with said antenna (4) and to guide a magnetic flux between said first area (A) and said second area (B, B1, B2).Type: ApplicationFiled: February 10, 2006Publication date: August 28, 2008Applicant: NXP B.V.Inventor: Gerald Schaffler
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Patent number: 6712279Abstract: A module (1) for a data carrier (3) for performing of operations with contacts and operations without contacts comprising an integrated component (4) with component connections (A1, A2, A3, A4, A5, A7, A8) and having a contact field (5) accessible to counter contacts with module connecting contacts (C1, C2, C3, C4, C5, C6, C7, C8), with each component connection (A1, A2, A3, A5, A7) used for operations with contacts being in an electrically conductive connection with a module connecting contact (C1, C2, C3, C5, C7) of the contact field (5) and each component connection (A4, A8) used for operations without contacts also being in an electrically conductive connection with a module connecting contact (C4, C8) of the contact field (5).Type: GrantFiled: July 19, 2002Date of Patent: March 30, 2004Assignee: Koninklijke Philips Electronics N.V.Inventors: Andreas Muehlberger, Gerald Schaffler, Joachim Schober
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Publication number: 20030024996Abstract: A module (1) for a data carrier (3) for performing of operations with contacts and operations without contacts comprising an integrated component (4) with component connections (A1, A2, A3, A4, A5, A7, A8) and having a contact field (5) accessible to counter contacts with module connecting contacts (C1, C2, C3, C4, C5, C6, C7, C8), with each component connection (A1, A2, A3, A5, A7) used for operations with contacts being in an electrically conductive connection with a module connecting contact (C1, C2, C3, C5, C7) of the contact field (5) and each component connection (A4, A8) used for operations without contacts also being in an electrically conductive connection with a module connecting contact (C4, C8) of the contact field (5).Type: ApplicationFiled: July 19, 2002Publication date: February 6, 2003Applicant: KONINKLIJKE PHILIPS ELECTRONICS N.V.Inventors: Andreas Muehlberger, Gerald Schaffler, Joachim Schober
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Patent number: 6321994Abstract: The data carrier of a device provided with the data carrier includes a casing which is formed by injection molding and which accommodates a holding device for holding a chip and at least one transmission coil, and also includes an electrically conductive connector connected to the holding device and arranged to connect the chip terminals of the chip to the coil terminals of the transmission coil. The holding device includes a holding foil and the connector is realized while utilizing a conductor frame. The connector is formed by conductor segments of the conductor frame with parts of the conductor segments connected to the holding foil in order to hold the conductor segments. The entire holding foil and the parts of the conductor segments which are connected to the holding foil are fully enclosed by the casing.Type: GrantFiled: December 20, 1999Date of Patent: November 27, 2001Assignee: U.S. Philips CorporationInventors: Marcus Toth, Wolfgang Scheucher, Gerald Schaffler, Heinz Kwas
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Patent number: 6275158Abstract: The data carrier (4) of a device (1) provided with a data carrier (4) includes a casing (5) which is formed by injection molding and in which there are accommodated holding means (6) for holding a chip (7) and at least one transmission coil (8), and also includes electrically conductive connection means (16) which are connected to the holding means (6) and are arranged to connect the chip terminals (9, 10) of the chip (7) to the coil terminals (11, 12) of the transmission coil (8); the holding means (6) include a holding foil (17) and the connection means (16) are realized while utilizing a conductor frame (18) and are formed by conductor segments (20, 21, 22, 23, 24, 25, 28, 29, 30, 31; 42, 43, 45, 46) of the conductor frame (18) and are completely enclosed by the casing (5), at least parts of said conductor segments (20, 21, 22, 23, 24, 25, 28, 29, 30, 31; 42, 43, 45, 46) being connected to the holding foil (17) in order to hold said conductor segments.Type: GrantFiled: December 20, 1999Date of Patent: August 14, 2001Assignee: U.S. Philips CorporationInventors: Marcus Toth, Wolfgang Scheucher, Gerald Schaffler, Heinz Kwas