Patents by Inventor Gerald T. Marcyk

Gerald T. Marcyk has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6103625
    Abstract: The present invention describes a method of forming an interconnect structure. An insulating layer is formed, and then an opening is formed in the insulating layer. Next, a conductive layer is formed over the insulating layer and in the opening. A polishing stop layer is then formed over the conductive layer. The polishing stop layer and the conductive layer are then polished; however, the polishing stop layer is polished at a slower rate than the conductive layer.
    Type: Grant
    Filed: December 31, 1997
    Date of Patent: August 15, 2000
    Assignee: Intel Corporation
    Inventors: Gerald T. Marcyk, Joseph M. Steigerwald