Patents by Inventor Gerald Walter
Gerald Walter has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20030235578Abstract: The present invention encompasses monoclonal antibodies that bind to lipoteichoic acid (LTA) of Gram positive bacteria. The antibodies also bind to whole bacteria and enhance phagocytosis and killing of the bacteria in vitro. The invention also provides antibodies having human sequences (chimeric, humanized and human antibodies). The invention also sets forth the variable regions of three antibodies within the invention and presents the striking homology between them.Type: ApplicationFiled: December 20, 2002Publication date: December 25, 2003Inventors: Jeffrey R. Stinson, Richard F. Schuman, James J. Mond, Andrew Lees, Gerald Walter Fischer
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Publication number: 20030228322Abstract: The present invention encompasses protective monoclonal antibodies that bind to peptidoglycan of Gram-positive bacteria. The antibodies also bind to whole bacteria and enhance phagocytosis and killing of the bacteria in vitro and block nasal colonization by Gram-positive bacteria in vivo. The invention also provides human, humanized and chimeric antibodies. The invention also sets forth the heavy chain and light chain variable regions of an antibody within the invention.Type: ApplicationFiled: December 20, 2002Publication date: December 11, 2003Inventors: Richard F. Schuman, John Fitzgerald Kokai-Kun, Simon J. Foster, Jeffrey R. Stinson, Gerald Walter Fischer
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Publication number: 20030224000Abstract: This invention provides MAbs for blocking and alleviating nasal colonization by staphylococci and methods for their use in the anterior nares.Type: ApplicationFiled: December 20, 2002Publication date: December 4, 2003Inventors: John Fitzgerald Kokai-Kun, Jeffrey Richard Stinson, Scott Michael Walsh, Andrew Lees, James J. Mond, Gerald Walter Fischer
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Patent number: 6581546Abstract: The present invention provides for animal containment through a system having a containment collar and GPS (Global Positioning System), RF (Radio Frequency), or INS (Inertial Navigation System) data, or a combination thereof, to define the perimeter of a containment area. A receiver is mounted to the containment collar, worn by an animal, which contains positioning electronics, memory and warning outputs. The user defines the perimeter by programming “waypoints” (positions on the perimeter) into the collar. The system provides an audible warning when the animal is within a user programmable distance of the perimeter, and then provides an adjustable correction, such as an electrical impulse to the animal when the perimeter boundaries are exceeded. Upon perimeter violation and initial correction of the animal, the system dynamically changes the position of the boundary encompassing the animal's current but prohibited position.Type: GrantFiled: February 14, 2002Date of Patent: June 24, 2003Assignee: Waters Instruments, Inc.Inventors: Donald G. Dalland, Gerald Walter Grabowski
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Publication number: 20020099844Abstract: Available bandwidth utilization during transfer of large files over a TCP/IP network is improved by load balancing data streams at the initiation of a large data transfer and dynamically controlling the number of data streams utilized as conditions within the infrastructure environment change. Software code running in both the client and the server optimizes the number of data streams utilized for each data transfer. A determination is quickly made of the optimum number of data streams for a particular data file transfer in the early stage of transmission. During the first few seconds of the transfer, an initial number of data streams, which is one unless otherwise specified or determined, is used to transmit one or more file segments, each on a different data stream, immediately followed by a second initial number of data streams, which is at least two greater than the initial number of data streams, is used to transmit another portion of the large data file.Type: ApplicationFiled: January 8, 2002Publication date: July 25, 2002Applicant: International Business Machines CorporationInventors: Gerald Walter Baumann, Robert Franklin Pryor, Marc Steinbrecher
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Publication number: 20020078562Abstract: A process of fabricating a circuitized substrate is provided which comprising the steps of: providing an organic substrate having circuitry thereon; applying a dielectric film on the organic substrate; forming microvias in said dielectric film; sputtering a metal seed layer on the dielectric film and in said microvias; plating a metallic layer on the metal seed layer; and forming a circuit pattern thereon.Type: ApplicationFiled: January 27, 2000Publication date: June 27, 2002Inventors: Gerald Walter Jones, Ross William Keesler, Voya Rista Markovich, William John Rudik, James Warren Wilson, William Earl Wilson
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Patent number: 6376158Abstract: A novel method of filling apertures in substrates, such as through holes, is provided. The method utilizes a phtoimageable film, and comprises the following steps: applying a photoimagable, hole fill film over the apertures, preferably having a solvent content of 7-18%; reflowing the hole fill film to flow into the apertures; exposing the hole fill film to actinic radiation, preferably ultraviolet light, through a phototool, which preferably has openings slightly larger than the diameter of the apertures; then at least partially curing the hole fill film; and developing the hole fill film to remove the unexposed hole fill film. Thus, the apertures may be selectively filled. After the apertures are filled, the hole fill film is cured. Thereafter, the substrate may be subjected to further processing steps, for example, nubs of cured hole fill film can be removed. If desired, the substrate is circuitized and overplated with gold.Type: GrantFiled: January 18, 2000Date of Patent: April 23, 2002Assignee: International Business Machines CorporationInventors: Gerald Walter Jones, Heike Marcello, Kostas Papathomas
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Patent number: 6228397Abstract: The present invention provides a pharmaceutical composition which is substantially free of unpleasant tastes and orally administrable which comprises: (a) an active medicament, (b) an inner coating layer comprising an oil substance having a melting point at a range of from about 50° C. to about 100° C., (c) an outer coating layer comprising at least a polymeric substance.Type: GrantFiled: August 25, 1998Date of Patent: May 8, 2001Assignee: Pharmacia & Upjohn COmpanyInventors: Robert W. Shen, Gerald A. Walter
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Publication number: 20010000471Abstract: The present invention provides a pharmaceutical composition which is substantially free of unpleasant tastes and orally administrable which comprises:Type: ApplicationFiled: December 15, 2000Publication date: April 26, 2001Inventors: Robert W. Shen, Gerald A. Walter
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Patent number: 6131279Abstract: A process of fabricating a circuitized substrate is provided which comprising the steps of: providing an organic substrate having circuitry thereon; applying a dielectric film on the organic substrate; forming microvias in said dielectric film; sputtering a metal seed layer on the dielectric film and in said microvias; plating a metallic layer on the metal seed layer; and forming a circuit pattern thereon.Type: GrantFiled: January 8, 1998Date of Patent: October 17, 2000Assignee: International Business Machines CorporationInventors: Gerald Walter Jones, Ross William Keesler, Voya Rista Markovich, William John Rudik, James Warren Wilson, William Earl Wilson
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Patent number: 6127097Abstract: Simple, environmentally friendly developers and strippers are disclosed for free radical-initiated, addition polymerizable resists, cationically cured resists and solder masks and photoresists. Both the developers and the strippers include benzyl alcohol, optionally also including a minor amount of methanol, ethanol, isopropyl alcohol, propylene glycol monomethylacetate, ethylene glycol monomethyl ether, formamide, nitromethane, propylene oxide, or methyl ethyl ketone, acetone and water.Type: GrantFiled: March 18, 1997Date of Patent: October 3, 2000Assignee: International Business Machines CorporationInventors: Nageshwer Rao Bantu, Anilkumar Chinuprasad Bhatt, Ashwinkumar Chinuprasad Bhatt, Joseph Alphonse Kotylo, Gerald Walter Jones, Robert John Owen, Kostas Papathomas, Anaya Kumar Vardya
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Patent number: 6066889Abstract: A novel method of filling apertures in substrates, such as through holes, is provided. The method utilizes a photoimageable film, and comprises the following steps: applying a photoimagable, hole fill film over the apertures; reflowing the hole fill film to flow into the apertures; exposing the hole fill film to actinic radiation, preferably ultraviolet light, through a phototool, which preferably has openings slightly larger than the diameter of the apertures; then at least partially curing the hole fill film; and developing the hole fill film to remove the unexposed hole fill film. An advantage of the present method is that the apertures may be selectively filled. After the apertures are filled, the hole fill film is cured, preferably by baking. Thereafter, the substrate is preferably subjected to further processing steps; for example, nubs of cured hole fill film are preferably removed. If desired, the substrate is circuitized.Type: GrantFiled: September 22, 1998Date of Patent: May 23, 2000Assignee: International Business Machines CorporationInventors: Gerald Walter Jones, Heike Marcello, Kostas Papathomas
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Patent number: 6027858Abstract: A process of tenting plated through holes with a photoimageable dielectric is provided which includes a dielectric film comprising a photoimageable epoxy based resin layer and a peelable polyester layer. In accordance with the process of the present invention, the peelable polyester layer of the dielectric film is removed prior to baking, developing, patterning or curing the structure.Type: GrantFiled: June 6, 1997Date of Patent: February 22, 2000Assignee: International Business Machines CorporationInventors: Gerald Walter Jones, Ross William Keesler, Voya Rista Markovich, Heinke Marcello, James Warren Wilson, William Earl Wilson
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Patent number: 6025057Abstract: A method of fabricating an electronic package having an organic substrate. The substrate is formed of fiberglass and epoxy. In order to additively circuitize the electronic package substrate, an organic polyelectrolyte is deposited onto the organic substrate. A colloidal palladium-tin seed layer is deposited atop the organic polyelectrolyte. This is followed by depositing a photoimageable polymer atop the seed layer, and photolithographically patterning the photoimageable polymer to uncover portions of the seed. layer. The uncovered portions of the seed layer are catalytic to the electroless deposition of copper. In this way a conductive layer of copper is deposited atop the uncovered seed layer. The organic polyelectrolyte is deposited from an aqueous solution at the pH appropriate for the desired seed catalyst coating, depending on the ionizable character of the particular polyelectrolyte employed.Type: GrantFiled: December 17, 1997Date of Patent: February 15, 2000Assignee: International Business Machines CorporationInventors: Anastasios Peter Angelopoulos, Gerald Walter Jones, Richard William Malek, Heike Marcello, Jeffrey McKeveny
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Patent number: 5997997Abstract: The present invention provides a novel method of reducing the amount of seed deposited on polymeric dielectric surfaces. The method comprises the following steps: providing a work-piece coated with a polymeric dielectric layer; baking the work-piece to modify the surface of the polymeric dielectric layer; then applying the seed to polymeric dielectric layer and electrolessly plating metal to the seed layer. The invention also relates to a circuit board produced by the method of the present invention.Type: GrantFiled: June 13, 1997Date of Patent: December 7, 1999Assignee: International Business Machines Corp.Inventors: Anastasios Peter Angelopoulos, Gerald Walter Jones, Luis Jesus Matienzo, Thomas Richard Miller, Voya Rista Markovich
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Patent number: 5935652Abstract: The present invention provides a novel method of reducing the amount of seed deposited on polymeric dielectric surfaces. The method comprises the following steps: providing a work-piece coated with a polymeric dielectric layer; baking the work-piece to modify the surface of the polymeric dielectric layer; then applying the seed to polymeric dielectric layer and electrolessly plating metal to the seed layer. The invention also relates to a circuit board produced by the method of the present invention.Type: GrantFiled: March 23, 1998Date of Patent: August 10, 1999Assignee: International Business Machines Corp.Inventors: Anastasios Peter Angelopoulos, Gerald Walter Jones, Luis Jesus Matienzo, Thomas Richard Miller, Voya Rista Markovich
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Patent number: 5922517Abstract: Bridging between electrically conductive circuit features during conformal plating is prevented by avoiding the deposition of catalytic seed material onto non-circuit areas of the substrate. Preparatory to forming electrical circuit features on a nonconductive substrate by the full additive process, extraneous seed material is either trapped between two layers of a photoimageable film, whereby it is unavailable during plating, or deposited on the surface of an aqueous photoimageable film, which is removed prior to plating. The method embodying the present invention eliminates the need for seed removal after initial plating and prior to conformal plating of a precious metal over the initial plating.Type: GrantFiled: June 12, 1996Date of Patent: July 13, 1999Assignee: International Business Machines CorporationInventors: Anilkumar Chinuprasad Bhatt, Ashwinkumar C. Bhatt, Voya Rista Markovich, William Earl Wilson, Gerald Walter Jones
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Patent number: 5905018Abstract: Bridging between electrically conductive circuit features during conformal plating is prevented by avoiding the deposition of catalytic seed material onto non-circuit areas of the substrate. Preparatory to forming electrical circuit features on a nonconductive substrate by the full additive process, extraneous seed material is either trapped between two layers of a photoimageable film, whereby it is unavailable during plating, or deposited on the surface of an aqueous photoimageable film, which is removed prior to plating. The method embodying the present invention eliminates the need for seed removal after initial plating and prior to conformal plating of a precious metal over the initial plating.Type: GrantFiled: October 24, 1997Date of Patent: May 18, 1999Assignee: International Business Machines CorporationInventors: Anilkumar Chinuprasad Bhatt, Ashwinkumar C. Bhatt, Voya Rista Markovich, William Earl Wilson, Gerald Walter Jones
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Patent number: 5866237Abstract: A method of fabricating an electronic package having an organic substrate. The substrate is formed of fiberglass and epoxy. In order to additively circuitize the electronic package substrate, an organic polyelectrolyte is deposited onto the organic substrate. A colloidal palladium-tin seed layer is deposited atop the organic polyelectrolyte. This is followed by depositing a photoimagable polymer atop the seed layer, and photolithographically patterning the photoimagable polymer to uncover portions of the seed layer. The uncovered portions of the seed layer are catalytic to the electroless deposition of copper. In this way a conductive layer of copper is deposited atop the uncovered seed layer. The organic polyelectrolyte is deposited from an aqueous solution at the pH appropriate for the desired seed catalyst coating, depending on the ionizable character of the particular polyelectrolyte employed.Type: GrantFiled: August 23, 1996Date of Patent: February 2, 1999Assignee: International Business Machines CorporationInventors: Anastasios Peter Angelopoulos, Gerald Walter Jones, Richard William Malek, Heike Marcello, Jeffrey McKeveny
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Patent number: 5789121Abstract: The present invention provides a method of ablative photodecomposition and forming metal pattern which attains high resolution, is convenient, and employs non-halogenated solvents. The present invention is directed to a process for forming a metal pattern, preferably circuitization on an organic substrate, preferably on a circuit board or component thereof, which comprises coating the substrate with an ablatively-removable coating comprising a polymer resin preferably an acrylate polymer resin and preferably an ultraviolet absorber. A pattern is formed in the polymer coating corresponding to the desired metal pattern by irradiating at least a portion of the polymer coating with a sufficient amount of ultraviolet radiation to thereby ablatively remove the irradiated portion of the polymer coating. Next the patterned substrate is coated with a conductive metal paste to define the metal pattern, and the conductive metal paste is cured.Type: GrantFiled: June 20, 1997Date of Patent: August 4, 1998Assignee: International Business Machines CorporationInventors: Douglas Adam Cywar, Charles Robert Davis, Thomas Patrick Duffy, Frank Daniel Egitto, Paul Joseph Hart, Gerald Walter Jones, Edward McLeskey