Patents by Inventor Gerald William Steele

Gerald William Steele has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11424727
    Abstract: An instrumentation amplifier with an electronically adjustable gain is disclosed. The gain is adjusted by electronically controlling a resistance coupled to a feedback portion of the instrumentation amplifier. The resistance is adjusted by switches controlled by resistor-control signals references to a common mode voltage appearing at the input of the instrumentation amplifier. Accordingly, the instrumentation amplifier is capable of accommodating a high voltage range of common mode voltages while still providing controllable gain.
    Type: Grant
    Filed: October 30, 2019
    Date of Patent: August 23, 2022
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Cornel D. Stanescu, Cristian Marian Dinca, Gerald William Steele
  • Publication number: 20210036674
    Abstract: An instrumentation amplifier with an electronically adjustable gain is disclosed. The gain is adjusted by electronically controlling a resistance coupled to a feedback portion of the instrumentation amplifier. The resistance is adjusted by switches controlled by resistor-control signals references to a common mode voltage appearing at the input of the instrumentation amplifier. Accordingly, the instrumentation amplifier is capable of accommodating a high voltage range of common mode voltages while still providing controllable gain.
    Type: Application
    Filed: October 30, 2019
    Publication date: February 4, 2021
    Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Cornel D. STANESCU, Cristian Marian DINCA, Gerald William STEELE
  • Patent number: 7847391
    Abstract: An integrated circuit package that comprises a lead frame, an integrated circuit located on the lead frame and a shunt resistor coupled to the lead frame and to the integrated circuit. The shunt resistor has a lower temperature coefficient of resistance than the lead frame, and the lead frame has a lower resistivity than the shunt resistor. The shunt resistor has a low-resistance coupling to external leads of the lead frame, or, the shunt resistor has its own integrated external leads.
    Type: Grant
    Filed: July 1, 2008
    Date of Patent: December 7, 2010
    Assignee: Texas Instruments Incorporated
    Inventors: Ubol Udompanyavit, Sreenivasan K. Koduri, Gerald William Steele, Jason Marc Cole, Steven Kummerl
  • Publication number: 20100001382
    Abstract: An integrated circuit package that comprises a lead frame, an integrated circuit located on the lead frame and a shunt resistor coupled to the lead frame and to the integrated circuit. The shunt resistor has a lower temperature coefficient of resistance than the lead frame, and the lead frame has a lower resistivity than the shunt resistor. The shunt resistor has a low-resistance coupling to external leads of the lead frame, or, the shunt resistor has its own integrated external leads.
    Type: Application
    Filed: July 1, 2008
    Publication date: January 7, 2010
    Applicant: Texas Instruments Incorporated
    Inventors: Ubol Udompanyavit, Sreenivasan K. Koduri, Gerald William Steele, Jason Marc Cole, Steven Kummerl