Abstract: The invention relates to a system and a process for analyzing the interaction between a drop of fluid which is immiscible in an ambient medium and a surface, this surface being another drop of fluid or else alternatively a solid surface. The system also comprises processing means suitable for determining, according to data collected by an image acquisition and processing device, a value of interfacial tension of the drop after a contact between the drop and the surface, and a value of pressure difference between the internal pressure of the drop and the pressure in the ambient medium without having to know the position of the apex of the drop. The invention also relates to a device for forming drops and bringing drops into contact and to a device for forming a drop of fluid and bringing a drop of fluid into contact with a solid surface for the purpose of analyzing them by means of the appropriate system.

Abstract: Techniques and architecture are disclosed for implementing an optical dome bezel to interface an optical dome/window and a housing of differing coefficients of thermal expansion (CTEs), In some embodiments, the bezel may comprise a material (e.g., Ti-6Al-4V) that is CTE-matched to the optical dome material (e.g., silicon, germanium, sapphire, ALON), thereby mitigating temperature effects on system performance. In some embodiments, the bezel may include a radially compliant flexure feature (e.g., flexure blades, spring-form S-channels), which mitigates physical stress effects (e.g., vibration, thermal expansion/contraction, etc.) on system performance. In some embodiments, the bezel may include an integral environmental sealing feature (e.g., O-ring gaskets), which protects internal optics/electronics from external environmental hazards (e.g., moisture, corrosive substances, particulates, debris).

Abstract: A fluid cooled thermal management technique for a high-density composite focal plane array (CPFA) is disclosed. In one embodiment, a high density CFPA assembly includes a plurality of imaging dies mounted on a front surface of a printed wiring board (PWB) and a base plate. The base plate has a substantially matched coefficient of thermal expansion (CTE) to that of the high density CFPA. Further, the high density CFPA is disposed on a front side of the base plate. Furthermore, the base plate has a plurality of integral serpentine fluid flow channels configured to receive and circulate fluid and further configured such that the heat generated by the CFPA is transferred via conduction into the base plate and to the integral serpentine fluid flow channels and to the circulating fluid to dissipate the generated heat.

Abstract: A cross axis cable management system comprising a bird cage mechanism, a clock spring mechanism and a rolling loop mechanism positioned about a first axis, second axis and third axis of a gimbal mechanism respectively. Each mechanism provides defined channels and protective elements to prevent cable damage. The mechanisms also have one fixed end, one rotational end, and an optimized amount of slack for repeatable cable motion. The system effectively manages a large number of conventional and fiber optic cables while minimizing the friction or drag associated with the motion about the multiple axes and preventing cable damage and the resultant loss of performance.

Abstract: A vacuum compatible high-density electrical interconnect system for use in a vacuum environment is disclosed. In one embodiment, the vacuum compatible high-density electrical interconnect system includes a vacuum compatible base plate, a vacuum compatible printed wiring board (PWB) disposed on the vacuum compatible base plate and a vacuum compatible interposer module disposed in the vacuum compatible base plate. Further, the vacuum compatible PWB includes a plurality of components on a front side of the vacuum compatible PWB and a plurality of associated pads on a back side of the vacuum compatible PWB. In one exemplary embodiment, the vacuum compatible interposer module is disposed in the vacuum compatible base plate such that it operatively connects to the plurality of associated pads on the back side of the vacuum compatible PWB and further operatively connects to a plurality of pads of an external device that is disposed outside the vacuum environment.

Abstract: A deformable focal plane array (DFPA) for imaging systems is disclosed. In one embodiment, the DFPA includes a detection circuitry on one side. For example, the thickness of the DFPA is in a range of about 5 to 40 microns. In one exemplary embodiment, the DFPA when warped to a desired shape provides a substantially wider field of view (FOV) than a flat focal plane array (FPA).

Abstract: Techniques and architecture are disclosed for implementing an optical dome bezel to interface an optical dome/window and a housing of differing coefficients of thermal expansion (CTEs), In some embodiments, the bezel may comprise a material (e.g., Ti-6Al-4V) that is CTE-matched to the optical dome material (e.g., silicon, germanium, sapphire, ALON), thereby mitigating temperature effects on system performance. In some embodiments, the bezel may include a radially compliant flexure feature (e.g., flexure blades, spring-form S-channels), which mitigates physical stress effects (e.g., vibration, thermal expansion/contraction, etc.) on system performance. In some embodiments, the bezel may include an integral environmental sealing feature (e.g., O-ring gaskets), which protects internal optics/electronics from external environmental hazards (e.g., moisture, corrosive substances, particulates, debris).

Abstract: A fluid cooled thermal management technique for a high-density composite focal plane array (CPFA) is disclosed. In one embodiment, a high density CFPA assembly includes a plurality of imaging dies mounted on a front surface of a printed wiring board (PWB) and a base plate. The base plate has a substantially matched coefficient of thermal expansion (CTE) to that of the high density CFPA. Further, the high density CFPA is disposed on a front side of the base plate. Furthermore, the base plate has a plurality of integral serpentine fluid flow channels configured to receive and circulate fluid and further configured such that the heat generated by the CFPA is transferred via conduction into the base plate and to the integral serpentine fluid flow channels and to the circulating fluid to dissipate the generated heat.

Abstract: A cross axis cable management system comprising a bird cage mechanism, a clock spring mechanism and a rolling loop mechanism positioned about a first axis, second axis and third axis of a gimbal mechanism respectively. Each mechanism provides defined channels and protective elements to prevent cable damage. The mechanisms also have one fixed end, one rotational end, and an optimized amount of slack for repeatable cable motion. The system effectively manages a large number of conventional and fiber optic cables while minimizing the friction or drag associated with the motion about the multiple axes and preventing cable damage and the resultant loss of performance.

Abstract: A deformable focal plane array (DFPA) for imaging systems is disclosed. In one embodiment, the DFPA includes a detection circuitry on one side. For example, the thickness of the DFPA is in a range of about 5 to 40 microns. In one exemplary embodiment, the DFPA when warped to a desired shape provides a substantially wider field of view (FOV) than a flat focal plane array (FPA).

Abstract: A vacuum compatible high-density electrical interconnect system for use in a vacuum environment is disclosed. In one embodiment, the vacuum compatible high-density electrical interconnect system includes a vacuum compatible base plate, a vacuum compatible printed wiring board (PWB) disposed on the vacuum compatible base plate and a vacuum compatible interposer module disposed in the vacuum compatible base plate. Further, the vacuum compatible PWB includes a plurality of components on a front side of the vacuum compatible PWB and a plurality of associated pads on a back side of the vacuum compatible PWB. In one exemplary embodiment, the vacuum compatible interposer module is disposed in the vacuum compatible base plate such that it operatively connects to the plurality of associated pads on the back side of the vacuum compatible PWB and further operatively connects to a plurality of pads of an external device that is disposed outside the vacuum environment.

Abstract: A passive heat exchanger for gimbal thermal management is disclosed. In one embodiment, a thermal management system includes one or more electronics and/or sensor equipment. Further, the thermal management system includes a thermally conductive shell configured to house the electronics and/or sensor equipment. Furthermore, the thermally conductive shell includes an external surface and an internal surface. In addition, at least some portion of the external surface and the internal surface of the thermally conductive shell include an extended surface configured to reduce thermal resistance between an interior region of the thermally conductive shell and ambient air.

Abstract: Methods and apparatus for hermetically sealing an optical fiber in a feedthrough connection. In brief overview, the optical fiber is mounted in a housing whose physical properties differ from that of the fiber by utilizing a structure in accordance with the present invention. The structure, typically in transition bushing form, is formed from at least two materials, such that the physical properties of a first material are selected to match the physical properties of the optical fiber, and the physical properties of a second material are selected to match physical properties of the housing. When the matched physical properties are the coefficients of thermal expansion (CTE) of the fiber and the housing, the result is a fiber optic mounting that remains hermetically sealed despite changes in ambient temperature that would typically induce stresses in the seal, potentially causing its failure.

Abstract: Methods and apparatus for hermetically sealing an optical fiber in a feedthrough connection. In brief overview, the optical fiber is mounted in a housing whose physical properties differ from that of the fiber by utilizing a structure in accord with the present invention. The structure, typically in transition bushing form, is formed from at least two materials, such that the physical properties of a first material are selected to match the physical properties of the optical fiber, and the physical properties of a second material are selected to match physical properties of the housing. When the matched physical properties are the coefficients of thermal expansion (CTE) of the fiber and the housing, the result is a fiber optic mounting that remains hermetically sealed despite changes in ambient temperature that would typically induce stresses in the seal, potentially causing its failure.