Abstract: A tip for a vacuum pipette having improved electrostatic discharge properties is disclosed. The tip and the coupling sections of a known tip are separated both physically and electrically from one another. A large resistance then electrically couples the two sections together and a plastic insulator surrounds the resistance to physically couple the sections together. This construction forces all static discharges to flow through the resistor, thereby changing the static discharge from one large discharge to a series of small discharges, each small discharge being insufficient to damage the wafers. The tip is also coated with a thin ceramic coating, which acts as a barrier against ionic contamination from the material used to make the tip. This coating is also smoother and more abrasion resistant than the basic material, causing less contamination when used. Finally, the coating can have a controlled conductivity that improves the static discharge behavior of the tip.

Abstract: A tip having a flattened part (1b) which has a suction gripping (1b2) at the end, which is raised very slightly to reduce the contact surface of the wafer and prevent it from touching the rest of the flattened part.

Abstract: The object of this invention relates to the technical sector of microelectronics.The vacuum handling system according to the invention comprises a hollow body (1) of which the end takes the gripping tip forming an inside chamber (1b) with at least two annular grooves (1b1) and (1b2) for the positioning of two O rings (7) of a soft deformable material to insure, on the one hand the dismantable assembling of the part corresponding to the tip, and, on the other hand, the vacuum tightness.

Abstract: The object of the invention relates to the technical sector of microelectronics. According to the process, one starts off with a hollow stainless steel tube (1) of determined diameter; the tube (1) is shrunk for a certain length (1a) and flattened, the remaining part is flattened to form two opposite flat non close joining faces (1b) and (1c); a slot (1b1) is machined in one of the flattened faces (1b) and a hole (1c1) in the other face (1c); a blade (2) provided with an axial notch (2a) on one of its edges is inserted between the two faces (1b) and (1c); through the hole (1c1) formed in one of the faces, a powder is inserted, designed to carry out microbrazing after heating; the assembly is placed in to a furnace to insure bracing of the blade (2) with the flattened parts and simultaneously filling by microbrazing remaining cavities between the blades and the flattened parts; the ends of the flattened gripping parts are rounded off; the flattened gripping areas are ground.

Abstract: The device according to this invention comprises a casing in which turns a device designed to support and hold the wafer, the said device is fitted eccentrically with respect to its rotational pin (3) a support element 5-6 designed to hold the silicon wafer by its edges in a horizontal plane, the device assembly being mounted in stable balance with respect to the said pin.