Patents by Inventor Gerard Frederickson

Gerard Frederickson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Efficient, green-emitting phosphors, and combinations with red-emitting phosphors
    Patent number: 7427366
    Abstract: Provided among other things is a phosphor of the formula Sr1-x3Cax3Ga2S4:Eu:xGa2S3??(I) wherein x is 0 to about 0.2 (or about 0.0001 to about 0.2), wherein x3 is 0.0001 to 1, and wherein a minor part of the europium component is substituted with praseodymium in an efficiency enhancing amount.
    Type: Grant
    Filed: July 5, 2005
    Date of Patent: September 23, 2008
    Assignee: Sarnoff Corporation
    Inventors: Yongchi Tian, Perry Niel Yocom, Gerard Frederickson, Liyou Yang
  • Phosphors protected against moisture and LED lighting devices
    Publication number: 20070125984
    Abstract: The present invention provides-a photoluminescent phosphor coated with a coating of oxide, the phosphor comprising (1) an inorganic phosphor chosen from (a) a metal thiogallate phosphor and (b) a metal sulfide phosphor and (2) a coating that comprises at least one layer having at least one oxides. The coated photoluminescent phosphor of the present invention is more resistant to water-induced degradation than when it is uncoated.
    Type: Application
    Filed: June 19, 2006
    Publication date: June 7, 2007
    Inventors: Yongchi Tian, Perry Yocom, Liyou Yang, Gerard Frederickson, Robert Simms
  • Efficient, green-emitting phosphors, and combinations with red-emitting phosphors
    Publication number: 20060012287
    Abstract: Provided among other things is a phosphor of the formula Sr1-x3Cax3Ga2S4:Eu:xGa2S3 ??(I) wherein x is 0 to about 0.2 (or about 0.0001 to about 0.2), wherein x3 is 0.0001 to 1, and wherein a minor part of the europium component is substituted with praseodymium in an efficiency enhancing amount.
    Type: Application
    Filed: July 5, 2005
    Publication date: January 19, 2006
    Inventors: Yongchi Tian, Perry Yocom, Gerard Frederickson, Liyou Yang
  • Method of making ceramic multilayer circuit boards mounted in a patterned metal support substrate
    Patent number: 6739047
    Abstract: A package for an electronic component includes a metal support substrate having a pattern of openings therethrough and a body of an insulating material, such as glass or ceramic, on and bonded to the surface of the support substrate. The body is formed from a plurality of layers of an insulating material, and conductive vias extending through the plurality of layers to the support substrate; said insulating body having an opening therein, an electronic component directly mounted in said opening to the patterned base plate. The base plate can be cut into one or more modules and directly soldered to a motherboard having additional devices mounted thereon.
    Type: Grant
    Filed: October 30, 2002
    Date of Patent: May 25, 2004
    Assignee: Lamina Ceramics, Inc.
    Inventors: Mark Stuart Hammond, Ellen Schwartz Tormey, Barry Jay Thaler, Leszek Hozer, Hung-tse Daniel Chen, Bernard Dov Geller, Gerard Frederickson
  • Ceramic multilayer circuit boards mounted on a patterned metal support substrate and method of making
    Publication number: 20030062185
    Abstract: A package for an electronic component includes a metal support substrate having a pattern of openings therethrough and a body of an insulating material, such as glass or ceramic, on and bonded to the surface of the support substrate. The body is formed from a plurality of layers of an insulating material, and conductive vias extending through the plurality of layers to the support substrate; said insulating body having an opening therein, an electronic component directly mounted in said opening to the patterned base plate. The base plate can be cut into one or more modules and directly soldered to a motherboard having additional devices mounted thereon.
    Type: Application
    Filed: October 30, 2002
    Publication date: April 3, 2003
    Applicant: Lamina Ceramics, Inc.
    Inventors: Mark Stuart Hammond, Ellen Schwartz Tormey, Barry Jay Thaler, Leszek Hozer, Hung-tse Daniel Chen, Bernard Dov Geller, Gerard Frederickson
  • Ceramic multilayer circuit boards mounted on a patterned metal support substrate
    Patent number: 6518502
    Abstract: A package for an electronic component includes a metal support substrate having a pattern of openings therethrough and a body of an insulating material, such as glass or ceramic, on and bonded to the surface of the support substrate. The body is formed from a plurality of layers of an insulating material, and conductive vias extending through the plurality of layers to the support substrate; said insulating body having an opening therein, an electronic component directly mounted in said opening to the patterned base plate. The base plate can be cut into one or more modules and directly soldered to a motherboard having additional devices mounted thereon.
    Type: Grant
    Filed: May 10, 2001
    Date of Patent: February 11, 2003
    Assignee: Lamina Ceramics, In
    Inventors: Mark Stuart Hammond, Ellen Schwartz Tormey, Barry Jay Thaler, Leszek Hozer, Hung-tse Daniel Chen, Bernard Dov Geller, Gerard Frederickson
  • CERAMIC MULTILAYER CIRCUIT BOARDS MOUNTED ON A PATTERNED METAL SUPPORT SUBSTRATE AND METHOD OF MAKING
    Publication number: 20020166684
    Abstract: A package for an electronic component includes a metal support substrate having a pattern of openings therethrough and a body of an insulating material, such as glass or ceramic, on and bonded to the surface of the support substrate. The body is formed from a plurality of layers of an insulating material, and conductive vias extending through the plurality of layers to the support substrate; said insulating body having an opening therein, an electronic component directly mounted in said opening to the patterned base plate. The base plate can be cut into one or more modules and directly soldered to a motherboard having additional devices mounted thereon.
    Type: Application
    Filed: May 10, 2001
    Publication date: November 14, 2002
    Inventors: Mark Stuart Hammond, Ellen Schwartz Tormey, Barry Jay Thaler, Leszek Hozer, Hung-tse Daniel Chen, Bernard Dov Geller, Gerard Frederickson