Abstract: This invention relates to apparatus for and methods of bonding a component to a substrate. More particularly, this invention relates to apparatus for and methods of removing small components, such a dies or other electrical components, from a wafer and bonding the components to a substrate.

Abstract: Apparatus for and methods of bonding electrical components or semiconductor chips to a substrate or lead frame is disclosed. According to the present invention, a sawn semiconductor wafer is held upside down in a first substantially horizontal plane and the substrate or lead frame to which it is to be bound is held in a second plane which is below and substantially parallel to the first plane. A die eject head located above the sawn wafer cooperates with a die bond head located between the wafer and the substrate to remove an individual die from the sawn wafer. The die bond head then rotates about an axis which is parallel to both planes and places the die on the lead frame. Also included is a transducer means which is responsive to electrical stimulus for actuating the die eject head and the die bond head such that the interactive force between the heads and the component may be precisely controlled.