Patents by Inventor Gerard KOOPS

Gerard KOOPS has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuits separated by through-wafer trench isolation
    Patent number: 9177852
    Abstract: An isolated semiconductor circuit comprising: a first sub-circuit and a second sub-circuit; a backend that includes an electrically isolating connector between the first and second sub-circuits; a lateral isolating trench between the semiconductor portions of the first and second sub-circuits, wherein the lateral isolating trench extends along the width of the semiconductor portions of the first and second sub-circuits, wherein one end of the isolating trench is adjacent the backend, and wherein the isolating trench is filled with an electrically isolating material.
    Type: Grant
    Filed: August 1, 2014
    Date of Patent: November 3, 2015
    Assignee: NXP B.V.
    Inventors: Peter Gerard Steeneken, Roel Daamen, Gerard Koops, Jan Sonsky, Evelyne Gridelet, Coenraad Cornelis Tak
  • INTEGRATED CIRCUITS SEPARATED BY THROUGH-WAFER TRENCH ISOLATION
    Publication number: 20140342527
    Abstract: An isolated semiconductor circuit comprising: a first sub-circuit and a second sub-circuit; a backend that includes an electrically isolating connector between the first and second sub-circuits; a lateral isolating trench between the semiconductor portions of the first and second sub-circuits, wherein the lateral isolating trench extends along the width of the semiconductor portions of the first and second sub-circuits, wherein one end of the isolating trench is adjacent the backend, and wherein the isolating trench is filled with an electrically isolating material.
    Type: Application
    Filed: August 1, 2014
    Publication date: November 20, 2014
    Inventors: Peter Gerard STEENEKEN, Roel DAAMEN, Gerard KOOPS, Jan SONSKY, Evelyne GRIDELET, Coenraad Cornelis TAK
  • Integrated circuits separated by through-wafer trench isolation
    Patent number: 8853816
    Abstract: An isolated semiconductor circuit comprising: a first sub-circuit and a second sub-circuit; a backend that includes an electrically isolating connector between the first and second sub-circuits; a lateral isolating trench between the semiconductor portions of the first and second sub-circuits, wherein the lateral isolating trench extends along the width of the semiconductor portions of the first and second sub-circuits, wherein one end of the isolating trench is adjacent the backend, and wherein the isolating trench is filled with an electrically isolating material.
    Type: Grant
    Filed: December 5, 2012
    Date of Patent: October 7, 2014
    Assignee: NXP B.V.
    Inventors: Peter Gerard Steeneken, Roel Daamen, Gerard Koops, Jan Sonsky, Evelyne Gridelet, Coenraad Cornelis Tak
  • INTEGRATED CIRCUITS SEPARATED BY THROUGH-WAFER TRENCH ISOLATION
    Publication number: 20140151844
    Abstract: An isolated semiconductor circuit comprising: a first sub-circuit and a second sub-circuit; a backend that includes an electrically isolating connector between the first and second sub-circuits; a lateral isolating trench between the semiconductor portions of the first and second sub-circuits, wherein the lateral isolating trench extends along the width of the semiconductor portions of the first and second sub-circuits, wherein one end of the isolating trench is adjacent the backend, and wherein the isolating trench is filled with an electrically isolating material.
    Type: Application
    Filed: December 5, 2012
    Publication date: June 5, 2014
    Applicant: NXP B.V.
    Inventors: Peter Gerard STEENEKEN, Roel DAAMEN, Gerard KOOPS, Jan SONSKY, Evelyne GRIDELET, Coenraad Cornelis TAK