Abstract: Interpretation: This is the first ever report to uncover a tangible lipidomic basis by which maternal emotional well-being may influence fetal neurodevelopment and the later risk for psychopathology. This novel insight points to the potential utility of nutritional approaches among pregnant women with high levels of depressive symptoms in the prevention of offspring risk for later socio-emotional behavioral problems predictive of future psychopathology. Such a novel approach is particularly pertinent in light of the preference to avoid pharmacological interventions such as anti-depressant medications during pregnancy.

Abstract: The invention describes a thermal block assembly comprising a first thermally and electrically conductive block part realised for connection to an anode pad of a light-emitting diode (LED) and dimensioned to provide an essentially complete thermal path for heat originating at the anode pad; a second thermally and electrically conductive block part realised for connection to a cathode pad of the LED and dimensioned to provide an essentially complete thermal path for heat originating at the cathode pad; and a bonding layer applied to the block parts to fix the positions of the block parts on either side of a gap. The invention further describes an LED arrangement comprising said thermal block assembly and at least one LED mounted thereto, and a method of manufacturing said thermal block assembly.

Abstract: An elongated lead frame (100) for a plurality of solid state light emitters (116), an elongated lighting assembly and a method of manufacturing an elongated lead frame are provided. The elongated lead frame comprises a first patterned layer (310) of an electrically conductive material and a second patterned layer (320) of an electrically isolating material. The first patterned layer comprising two electrically conductive tracks (102) that comprise first structures (316, 316?) for a first layer of a stack of light emitter islands and two electrically conductive connections between the first structures, at least one of the electrically conductive tracks comprises in between pairs of neighboring first structures a winded portion for forming a flexible electrically conductive connection in between the pairs of neighboring first structures.

Abstract: The invention describes a method of manufacturing an LED module, comprising the steps of providing a translucent encapsulant comprising a number of layers to enclose a number of LEDs of the LED module; modifying the surface structure of an outer surface of a layer to form at least one dense scattering region corresponding to the position of an LED of the LED module; to form at least one sparse scattering region that does not correspond to the position of an LED of the LED module; and to form a transition scattering region between a dense scattering region and a sparse scattering region. The invention further describes an LED module, and a device comprising a device housing and at least one such LED module.

Abstract: The invention describes a thermal block assembly comprising a first thermally and electrically conductive block part realised for connection to an anode pad of a light-emitting diode (LED) and dimensioned to provide an essentially complete thermal path for heat originating at the anode pad; a second thermally and electrically conductive block part realised for connection to a cathode pad of the LED and dimensioned to provide an essentially complete thermal path for heat originating at the cathode pad; and a bonding layer applied to the block parts to fix the positions of the block parts on either side of a gap. The invention further describes an LED arrangement comprising said thermal block assembly and at least one LED mounted thereto, and a method of manufacturing said thermal block assembly.

Abstract: The invention describes an LED module comprising a number of light-emitting diodes arranged on a carrier; and an encapsulant covering the LEDs, which encapsulant comprises a translucent constituent and a metallic particle constituent, and wherein the constituents of the encapsulant are chosen to impart a desired degree of concealment to the LEDs in the inactive state of the LED module. The invention further describes a device comprising a device housing and at least one such LED module arranged to emit light through an aperture in the device housing, and wherein the constituents of the encapsulant of the LED modules are chosen according to a colour of the device housing. The invention further describes a method of manufacturing such an LED module.

Abstract: The invention describes a method of manufacturing an LED module, comprising the steps of providing a translucent encapsulant comprising a number of layers to enclose a number of LEDs of the LED module; modifying the surface structure of an outer surface of a layer to form at least one dense scattering region corresponding to the position of an LED of the LED module; to form at least one sparse scattering region that does not correspond to the position of an LED of the LED module; and to form a transition scattering region between a dense scattering region and a sparse scattering region. The invention further describes an LED module, and a device comprising a device housing and at least one such LED module.

Abstract: A mounting assembly (10) is disclosed for mounting and connecting an electrical device, in particular a light emitting diode. The mounting assembly (10) comprises a mounting element (12) including at least two metal layers (14, 16) each having a top surface (24) and a bottom surface (28). Top contact pads are formed at the top surface of each of the metal layers for providing a planar electrical and thermal contact to the electrical device. Bottom contact pads are formed at the bottom surface of each of the metal layers for providing a planar electrical and thermal contact to a mounting board (34).

Abstract: An elongated lead frame (100) for a plurality of solid state light emitters (116), an elongated lighting assembly and a method of manufacturing an elongated lead frame are provided. The elongated lead frame comprises a first patterned layer (310) of an electrically conductive material and a second patterned layer (320) of an electrically isolating material. The first patterned layer comprising two electrically conductive tracks (102) that comprise first structures (316, 316?) for a first layer of a stack of light emitter islands and two electrically conductive connections between the first structures, at least one of the electrically conductive tracks comprises in between pairs of neighboring first structures a winded portion for forming a flexible electrically conductive connection in between the pairs of neighboring first structures.

Abstract: The invention provides an interconnected string of three LED modules, having internal and external connections such that each LED in the string is fully individually addressable. LED biases and interconnects are oriented and configured such that individual addressability is achieved without the need for direct external signal connections to each LED in the string. Consequently embodiments are provided comprising pluralities of strings, arranged so as to form an array of LED modules, wherein wiring tracks running beneath, or along the intermediary spaces between, rows of LEDs are not required. Hence are provided LED devices comprising an array of individually addressable LED modules, having reduced spacing between rows and columns, and having optimal thermal path perpendicularly across the substrate layer. Provided devices have improved heat dissipation and greater achievable LED array density.

Abstract: The invention provides an interconnected string of three LED modules, having internal and external connections such that each LED in the string is fully individually addressable. LED biases and interconnects are oriented and configured such that individual addressability is achieved without the need for direct external signal connections to each LED in the string. Consequently embodiments are provided comprising pluralities of strings, arranged so as to form an array of LED modules, wherein wiring tracks running beneath, or along the intermediary spaces between, rows of LEDs are not required. Hence are provided LED devices comprising an array of individually addressable LED modules, having reduced spacing between rows and columns, and having optimal thermal path perpendicularly across the substrate layer. Provided devices have improved heat dissipation and greater achievable LED array density.

Abstract: A light-emitting module (3a-c; 23; 26; 33a-c) comprising a plurality of light-sources (12a-e; 27a-h) arranged in at least a first and a second column (18a-b; 28a-c) arranged side by side and extending along a first direction of extension (X1) of the light-emitting module (3a-c; 23; 26; 33a-c); and a plurality of connector terminal pairs (13a-b, 14a-b, 15a-b, 16a-b 17a-b), each being electrically connected to a corresponding one of the light-sources (3a-c; 23; 26; 33a-c) for enabling supply of electrical power thereto. Each connector terminal pair (13a-b, 14a-b, 15a-b, 16a-b 17a-b) comprises a first connector terminal (13a, 14a, 15a, 16a 17a) and a second connector terminal (13b, 14b, 15b, 16b 17b) being arranged at opposite sides of the light-emitting module (3a-c; 23; 26; 33a-c).

Abstract: A mounting assembly (10) is disclosed for mounting and connecting an electrical device, in particular a light emitting diode. The mounting assembly (10) comprises a mounting element (12) including at least two metal layers (14, 16) each having a top surface (24) and a bottom surface (28). Top contact pads are formed at the top surface of each of the metal layers for providing a planar electrical and thermal contact to the electrical device. Bottom contact pads are formed at the bottom surface of each of the metal layers for providing a planar electrical and thermal contact to a mounting board (34).

Abstract: The present invention relates to a grid-shaped lighting module (13; 23) comprising: a plurality of electrically conducting wires (15a-b) defining a grid with nodes (16a-c); and a plurality of solid-state light-sources (17a-c) each being arranged at a respective one of the nodes and connected to two electrically conducting wires of the plurality of electrically conducting wires. The electrically conducting wires (15a-b) are pleated such that the grid-shaped lighting module (13; 23) exhibits a 3D-topography. Various embodiments of the present invention provide improved mechanical stability and allows for thin illumination panels based on the grid-shaped lighting module.

Abstract: There is provided a method for manufacturing a light emitting diode, LED, matrix (100) comprising the steps of providing with a maintained integrity a conductor sheet (150) with a plurality of component areas (111) interconnected with meandering connection tracks (116), mounting a plurality of LEDs (120) to a respective component area thereby forming a subassembly (100?), trimming and stretching the subassembly thereby straightening the connection tracks such that an m×n LED conductor matrix is formed during the step of stretching.

Abstract: An electrical contact for a detector, the electrical component, comprising a cadmium tellurium component, a first layer formed onto the cadmium tellurium component, wherein the first layer comprises indium and a contact agent being bonded directly or indirectly to the first layer to be in electrical contact with the first layer. The contact agent may be a stud bump or a conductive adhesive interconnect being bonded indirectly to the first layer via noble metal shielding layer.

Abstract: There is provided a method for manufacturing a light emitting diode, LED, matrix (100) comprising the steps of providing with a maintained integrity a conductor sheet (150) with a plurality of component areas (111) interconnected with meandering connection tracks (116), mounting a plurality of LEDs (120) to a respective component area thereby forming a subassembly (100?), trimming and stretching the subassembly thereby straightening the connection tracks such that an m×n LED conductor matrix is formed during the step of stretching.

Abstract: The present invention relates to a grid-shaped lighting module (13; 23) comprising: a plurality of electrically conducting wires (15a-b) defining a grid with nodes (16a-c); and a plurality of solid-state light-sources (17a-c) each being arranged at a respective one of the nodes and connected to two electrically conducting wires of the plurality of electrically conducting wires. The electrically conducting wires (15a-b) are pleated such that the grid-shaped lighting module (13; 23) exhibits a 3D-topography. Various embodiments of the present invention provide improved mechanical stability and allows for thin illumination panels based on the grid-shaped lighting module.

Abstract: A light-emitting module (3a-c; 23; 26; 33a-c) comprising a plurality of light-sources (12a-e; 27a-h) arranged in at least a first and a second column (18a-b; 28a-c) arranged side by side and extending along a first direction of extension (X1) of the light-emitting module (3a-c; 23; 26; 33a-c); and a plurality of connector terminal pairs (13a-b, 14a-b, 15a-b, 16a-b 17a-b), each being electrically connected to a corresponding one of the light-sources (3a-c; 23; 26; 33a-c) for enabling supply of electrical power thereto. Each connector terminal pair (13a-b, 14a-b, 15a-b, 16a-b 17a-b) comprises a first connector terminal (13a, 14a, 15a, 16a 17a) and a second connector terminal (13b, 14b, 15b, 16b 17b) being arranged at opposite sides of the light-emitting module (3a-c; 23; 26; 33a-c).

Abstract: An electrical contact for a cadmium tellurium component, in particular a cadmium zinc tellurium component comprising a cadmium tellurium component, a first layer (21) formed onto the cadmium tellurium component (10), wherein the first layer (21) comprises indium and a contact agent (30) being bonded directly or indirectly to the first layer (21) to be in electrical contact with the first layer (21). The contact agent may be a stud bump or a conductive adhesive interconnect being bonded indirectly to the first layer via noble metal shielding layer.