Abstract: A coaxial connection assembly includes a first spring pin fixed to a first component to be connected, such as an antenna which may be a patch antenna. The assembly also includes a first contact on a circuit board for connecting to the first component by way of the first spring pin. The assembly also includes a front end module (FEM) cover for spacing apart the first component and the circuit board. The FEM cover defines a first channel through which the first spring pin extends. The FEM cover is formed from a conductive material, and the first channel contains a dielectric medium or substance.

Abstract: A circuit board connection system is provided having a first circuit board having a first connector and a second circuit board having a second connector for mating with the first connector. A chassis is provided for mounting the first circuit board and the second circuit board, and when assembled, the first circuit board and the second circuit board lie parallel to a mounting surface of the chassis. At least one first alignment feature is fixed to or integrated into the first circuit board and at least one complementary alignment feature is fixed to or integrated into the second circuit board or the mounting surface of the chassis. An interaction between the first alignment feature and the complementary alignment feature forces alignment of the first connector with the second connector as the first circuit board is moved towards the second circuit board along the mounting surface of the chassis.

Abstract: A chassis is provided for a circuit board, the chassis having a heatsink. The chassis includes a plurality of fins extending from the chassis for extracting heat from electronics mounted on the chassis. The plurality of fins are organized into at least two fin sections, wherein a first fin section has a first set of fins of the plurality of fins and a second fin section has a second set of fins of the plurality of fins. The chassis further provides a thermal break between the first fin section and the second fin section, the thermal break being an air gap between the first set of fins and the second set of fins. An aerofoil is then fixed in the air gap and inhibits air flow between the first fin section and the second fin section.

Abstract: A self-cooling chassis for a communication device. The chassis includes a top housing including a first set of input/output (I/O) connectors arranged along a top housing front side. The top housing is configured to house at least one processor communicatively coupled to the first set of I/O connectors. The top housing has a top side including a plurality of heat fins configured to dissipate heat away from the at least one processor. The top housing has a top housing aperture. The chassis includes a bottom housing including a second set of I/O connectors arranged along a bottom housing front side. The bottom housing houses a I/O circuitry. The I/O circuitry communicatively couples the second set of I/O connectors to at least one processor. The bottom housing has a bottom housing aperture. The chassis includes a guide pin configured to be inserted into a top housing aperture and a bottom housing aperture.

Abstract: A connector is provided having a housing having a first end and a second end, the first end having a face and the second end being substantially open. The first end of the housing has an opening in it. The connector also has a gasket at the second end. The connector also has conduits extending from the opening of the first end to the second end. The conduits enter the housing at the first end as a single cable, and separate from each other within the housing. Also provided is a connector system including the connector, a receiving connector mounted on a circuit board, and an outdoor unit housing the circuit board having an opening for receiving the conduits.

Abstract: A chassis is provided for supporting electronic device circuitry. The chassis includes a mounting surface on a first side of the chassis and a cooling surface on a second side of the chassis opposite the mounting surface. The cooling surface has a plurality of fin fixation connectors for fixing cooling fins to the cooling surface. The chassis also has at least one fan connector for fixing a fan assembly at or adjacent the cooling surface. Also provided is a chassis system for electronic device circuitry. Such a system can be used in a fanless configuration and a fan-cooled configuration. In addition to the chassis, the system includes a first set of fins having a first length and a first depth and a second set of fins having a second length and a second depth smaller than the first depth. The system also includes a fan assembly.

Abstract: A chassis is provided for a circuit board, the chassis having a heatsink. The chassis includes a plurality of fins extending from the chassis for extracting heat from electronics mounted on the chassis. The plurality of fins are organized into at least two fin sections, wherein a first fin section has a first set of fins of the plurality of fins and a second fin section has a second set of fins of the plurality of fins. The chassis further provides a thermal break between the first fin section and the second fin section, the thermal break being an air gap between the first set of fins and the second set of fins. An aerofoil is then fixed in the air gap and inhibits air flow between the first fin section and the second fin section.

Abstract: A chassis is provided for supporting electronic device circuitry. The chassis generally includes a mounting surface on a first side of the chassis and a cooling surface on a second side of the chassis opposite the mounting surface. The cooling surface has a plurality of heatsink fins extending from the cooling surface. The chassis also has at least one vapor chamber between the mounting surface and the cooling surface. The vapor chamber is located adjacent the plurality of heatsink fins.

Abstract: A coaxial connection assembly includes a first spring pin fixed to a first component to be connected, such as an antenna which may be a patch antenna. The assembly also includes a first contact on a circuit board for connecting to the first component by way of the first spring pin. The assembly also includes a front end module (FEM) cover for spacing apart the first component and the circuit board. The FEM cover defines a first channel through which the first spring pin extends. The FEM cover is formed from a conductive material, and the first channel contains a dielectric medium or substance.

Abstract: A self-cooling chassis for a communication device. The chassis includes a top housing including a first set of input/output (I/O) connectors arranged along a top housing front side. The top housing is configured to house at least one processor communicatively coupled to the first set of I/O connectors. The top housing has a top side including a plurality of heat fins configured to dissipate heat away from the at least one processor. The top housing has a top housing aperture. The chassis includes a bottom housing including a second set of I/O connectors arranged along a bottom housing front side. The bottom housing houses a I/O circuitry. The I/O circuitry communicatively couples the second set of I/O connectors to at least one processor. The bottom housing has a bottom housing aperture. The chassis includes a guide pin configured to be inserted into a top housing aperture and a bottom housing aperture.

Abstract: A circuit board connection system is provided having a first circuit board having a first connector and a second circuit board having a second connector for mating with the first connector. A chassis is provided for mounting the first circuit board and the second circuit board, and when assembled, the first circuit board and the second circuit board lie parallel to a mounting surface of the chassis. At least one first alignment feature is fixed to or integrated into the first circuit board and at least one complementary alignment feature is fixed to or integrated into the second circuit board or the mounting surface of the chassis. An interaction between the first alignment feature and the complementary alignment feature forces alignment of the first connector with the second connector as the first circuit board is moved towards the second circuit board along the mounting surface of the chassis.

Abstract: A radio equipment and a method for interconnecting components in the radio equipment are disclosed. The radio equipment includes a signal processing module and a radio component positioned relative to each other for a high-speed connection using at least a first mechanical connector and a high-speed connector. The first mechanical connector includes a first part disposed on the radio component and a second part disposed on the signal processing module. The high-speed connector includes a first part disposed on the radio component and a second part disposed on the signal processing module. At least one high-speed processing capability is provided to the radio equipment using the signal processing module through the high-speed connector. The signal processing module and the radio equipment are interchangeably connected.