Abstract: Provided are an alginate dialdehyde-functionalized material, an alginate dialdehyde-modified material, and preparation methods therefor. Further provided is use of the above materials and methods in the manufacture of antibacterial, antifungal, and antiviral protective products. Raw materials used and the preparation methods are simple, economical, environmentally friendly and easy to scale up, have high inhibitory activity against bacteria, fungi and viruses and have great application potential in the fields of biology, medicine, health, etc.

Abstract: The invention provides a vertically adjustable chemical mechanical polishing head having a pivot mechanism and method for use thereof.

Abstract: The present invention provides compounds capable of binding to an Fc receptor and modulating Fc receptor activity comprising a core lipophilic group in the form of an Aryl ring substituted with a group rich in p-electrons. The invention further provides for a method of treating an autoimmune disease involving Fc receptor activity using such compounds. A method for obtaining a compound which modulates Fc receptor activity is also provided, the method comprising: (a) providing or designing compounds having structural characteristics to fit in the groove of the Fc?RIIa structure; and (b) screening the compounds for modulating activity on the Fc receptor.

Abstract: The invention provides a pad removal apparatus and method that enables improved pad removal from a platen.

Abstract: In one aspect, the invention provides a method for planarizing a circular disc-type semiconductor wafer or other substrate. The method includes the steps of pressing a retaining ring surrounding the wafer against a polishing pad at a first pressure; pressing a first peripheral edge portion of the wafer against the polishing pad with a second pressure; and pressing a second portion of the wafer interior to the peripheral edge portion against the polishing pad with a third pressure. The second pressure may be provided through a mechanical member in contact with the peripheral edge portion; and the second pressure may be a pneumatic pressure against a backside surface of the wafer. Desirably, the pneumatic pressure is exerted through a resilient membrane, or is exerted by gas pressing directly against at least a portion of the wafer backside surface.

Abstract: A process for the surface functionalisation of a polymeric substrate, which process comprises: (a) contacting the substrate with a diarylcarbene precursor, (b) generating a carbene reactive intermediate from the diarylcarbene precursor so that it reacts with the substrate to functionalise the surface, and (c) further functionalising the activated substrate obtained in step (b).

Abstract: The invention provides a pad removal apparatus and method that enables improved pad removal from a platen.

Abstract: The invention provides aminoalkylindole compounds of Formula (I), wherein R1-R5, n and p are as described. Also provided are compositions containing compounds of Formula (I) and the use of compounds of Formula (I) in modulating the activity of a cannabinoid receptor in a subject.

Abstract: A polishing apparatus (100) is provided for polishing a substrate (102) that has slurry distributor (125) which improves planarization uniformity. Generally, apparatus (100) includes: (i) platen (106) with polishing surface (110); (ii) head (116) adapted to hold substrate (102) against polishing surface; (iii) mechanism to rotate platen (106) during polishing; (iv) dispenser (124) having nozzles (126, 128) to dispense slurry on the surface (110); and (v) distributor (125) between the nozzles (126, 128) and head (116). In one embodiment, apparatus (100) further includes a wiper (180) between head (116) and distributor (125) to remove used slurry and polishing byproducts from surface (110), thereby reducing agglomerations or deposits that can damage substrate (102) and improving yield. Optionally, apparatus (100) further includes dispenser (186) for dispensing a fluid before and/or after wiper (180) to substantially eliminate buildup of deposits. Method for polishing and substrate polished according to method.

Abstract: A polishing apparatus (100) is provided for polishing a substrate (102) that has slurry distributor (125) which improves planarization uniformity. Generally, the apparatus (100) includes: (i) a platen (106) with a polishing surface (110); (ii) a head (116) adapted to hold the substrate (102) against the polishing surface; (iii) a mechanism to rotate the platen (106) during polishing; (iv) a dispenser (124) having nozzles (126, 128) to dispense slurry on the surface (110); and (v) a distributor (125) between the nozzles (126, 128) and the head (116). In one embodiment, the apparatus (100) further includes a wiper (180) between the head (116) and the distributor (125) to remove used slurry and polishing byproducts from the surface (110), thereby reducing agglomerations or deposits that can damage the substrate (102) and improving yield.

Abstract: An alternative technique whereby highly reactive carbene or nitrene species are generated from inert precursors under less harsh photolytic, and sometimes thermolytic, conditions has also been investigated for application to dyeing and other surface modifying processes of various natural and synthetic polymers. The chemistry of cargenes and nitrenes is well documented, and these reactive entities are known to form covalent bonds with many types of functional group groups. The application of these species to the surface modification or organic solids using different approaches both for the generation of the required carbenes or nitrenes, and for their reaction with the solid surface has been reported. Interestingly, although nitrenes (often generated from an azide or sulfonylazide precursor under photolytic or thermolytic conditions) are more stable, and therefore less reactive, than their carbene analogues, they have used much more widely for the dyeing of polymeric substrates.

Abstract: The invention provides a vertically adjustable chemical mechanical polishing head having a pivot mechanism and method for use thereof.

Abstract: The invention provides a chemical mechanical polishing pad and method that enables improved wafer removal from the polishing pad after completion of chemical mechanical polishing of the wafer.

Abstract: A process for the surface functionalization of a polymeric substrate, which process comprises: a) contacting the substrate with a diarylcarbene precursor, b) generating a carbene reactive intermediate from the diarylcarbene precursor so that it reacts with the substrate to functionalize the surface, and c) further functionalizing the activated substrate obtained in step (b).

Abstract: The invention provides aminoalkylindole compounds of Formula (I), wherein R1-R5, n and p are as described. Also provided are compositions containing compounds of Formula (I) and the use of compounds of Formula (I) in modulating the activity of a cannabinoid receptor in a subject. In particular, the invention provides the use of such compounds as analgesic agents.

Abstract: A polishing apparatus (100) is provided for polishing a substrate (102) that has slurry distributor (125) which improves planarization uniformity. Generally, the apparatus (100) includes: (i) a platen (106) with a polishing surface (110); (ii) a head (116) adapted to hold the substrate (102) against the polishing surface; (iii) a mechanism to rotate the platen (106) during polishing; (iv) a dispenser (124) having nozzles (126, 128) to dispense slurry on the surface (110); and (v) a distributor (125) between the nozzles (126, 128) and the head (116). In one embodiment, the apparatus (100) further includes a wiper (180) between the head (116) and the distributor (125) to remove used slurry and polishing byproducts from the surface (110), thereby reducing agglomerations or deposits that can damage the substrate (102) and improving yield.