Abstract: Process for transfer of a microstructure (12) from an initial substrate (10) to a final substrate (32). The process includes the following steps in sequence:bonding between the initial substrate (10) and an intermediate substrate (24), the microstructure facing the intermediate substrate,formation of at least one layer (30) of bond material on at least one selected region (16) of the initial substrate including the microstructurebring the said selected region (16) into contact with the final substrate,treatment of the bond material in an area corresponding to the selected region (16), to increase the bond force,breaking the selected region (16) of the initial substrate, from the intermediate substrate (24).

Abstract: This process comprises the following steps:a) make a set of chips (110, 111, 112, 113) on a substrate (100), each chip including a number of electrodes (110a, 110b, 111a, 111b),b) individual validity test on each chip and the formation of at least one electrical network (117a, 117b) for addressable matched electrodes on different valid chips,c) make a deposit successively on matched electrode sets by dipping the substrate in an appropriate electrochemical bath and by application of appropriate voltages on the electrical network to cause an electrochemical reaction on the electrodes.

Abstract: A heating device is provided for connecting by means of a melting material to a connection support at least one component mounted on the support in at least one connection region at the periphery of the support. The device locally heats the support and/or the component in the connection region. Particular utility for the present invention is found in the area of production of flat display screens, although other utilities are also contemplated.

Abstract: A process for checking the conformity of hybridization balls present on a chip or a substrate and its implementation device are provided. The process includes positioning the hybridization balls of the electronic component or substrate near a strip transparent to a predetermined wavelength. The hybridization balls are partially flattened against the strip by positioning the electronic component or substrate at a previously defined distance from the transparent strip. The previously defined distance corresponds to a theoretical reference ball height less an acceptable deviation between the theoretical reference ball height and a minimum height of the hybridization balls. The partial flattening creates ball flats on the hybridization balls at the strip. The hybridization balls are illuminated with a light beam of the predetermined wavelength that is emitted through the strip. A portion of the light beam reflected back through the strip by the hybridization balls to be checked and is acquired.

Abstract: Three-dimensional multichip module.The invention relates to a three-dimensional or 3D multichip module having a plurality of bidimensional, elementary electronic modules (4a-4d), each incorporating at least one chip (10a-10d), a support (6a-6d) on which is placed the chip and a conductive interconnection network or array (8a-8d) covering an upper surface of the support. These elementary modules are substantially superimposed in a displaced manner (in the form of a staircase) and are interconnected by means of their interconnection networks and connection pads (12a-12d) placed on those parts of the elementary modules not covered by the upper elementary module.Application to the association of integrated circuits in microconnection technology.

Abstract: Flat electrical connecting cable with controlled electrical and thermal resistances.It comprises a flat insulating support, on which are installed connecting lines constituted by two superimposed layers. The first of them is constituted by a poor heat conducting material, such a manganin, while the second is discontinuous andis formed from a very good electric conducting material, such as copper. The segments on which the second layer is installed are thermally insulated an at uniform temperature. It is possible to vary the conductivity of the different layers by acting on the thickness and width thereof.This invention is applicable in industries such as cryogenics and space, as well as all applications functioning between a cold source and hot source, where it is wished to control the heat exchanges.

Abstract: A microconnector with a high density of contacts which make it possible to connect N parallel electrodes to N electrical conductors. The microconnector comprises a support able to receive the electrodes, N electrically conductive, flexible, elastic wires, respectively connected to the N conductors and fixed to an insulating part movable relative to said support in such a way that the wires are parallel and each of them can come into contact with a single electrode as a result of a displacement of the insulating part when the electrodes are fitted in the support. A cam is provided for moving the part in such a way as to bring about simultaneous contacts between the respective electrodes and wires. The microconnector can be used in connection with flat screen display means.

Abstract: A microconnector is used for connecting electrodes placed on a support and which are insulated from one another to the same number of conductors as there are electrodes and comprises a means for the elastic gripping of the support and flexible, elastic conductor wires, whose number is the same as that of the electrodes for connecting to the latter, which are insulated from one another and from the gripping means and which are fixed to the latter in such a way that each of them can come into contact with a single electrode when the support is gripped by the gripping means. Application is to low temperature electrical connections and to high density connections in a reduced space.

Abstract: Method and apparatus for producing an electrical interconnection circuit for electronic components in which an insulating base support incorporating conductive zones is used, the different conductive zones to be interconnected are joined by an insulating wire by adhering it to the base support, the bared wire is welded to the conductive zones and is cut after welding, wherein a thermally weldable insulating wire is used and liquid flux is deposited on the parts of the wire to be welded resting on the conductive zones before making the weld.

Abstract: At least one slot is formed in one or both connecting end-portions of a flexible insulating support, the slot or slots being superposed on the terminals of the corresponding electrical assembly. Connecting leads are unwound and bonded to the flexible support in the form of a continuous conductor arranged as a snaked coil, the ends of the loops which are placed beyond the slots being then cut off and removed. The method of interconnection permits the achievement of a high connection density, the connecting terminal pitch being of the order of a few tenths of a millimeter.

Abstract: Different conductive zones on an insulating base support are interconnected by bonding an insulated wire to the support. In order to establish electric contacts between conductive zones and the conductive core of the insulated wire, the wire is stripped, soldered onto the conductive zones and cut after soldering.

Abstract: A method of connecting electronic microcomponents comprising the steps of realizing a support with conducting wire connecting pads secured on said support, the position of which is adapted to the arrangement of the connections for the microcomponents, making a connecting circuit by sticking an insulated wire onto said support and connecting said conducting wire connecting pads, positioning the microcomponent panels so that each microcomponent connection is in electrical contact with one of said wire connecting pads, welding the connections to their respective wire connecting pads.A substrate for connecting microcomponents comprising a support on which conducting wire connecting pads are deposited and joined by a connecting circuit made of insulated wire.A hybrid circuit comprising a number of electronic microcomponents connected by said substrate.