Abstract: This invention relates to a high speed customizing machine which has a device for transferring portable objects and incorporates an integrated circuit having at least one memory, and a rotary platform equipped with a plurality of hybrid connection devices, positioned transversely to the transfer device and each linked to an electronic card. Each electronic card enables customization of each chip card and is positioned in front of each connection device.

Abstract: A high-speed personalization machine has a portable object transfer device for transporting objects that incorporate an integrated circuit which contains at least one memory. The machine has a turning plate whose axis of rotation is inclined or parallel with respect to a transfer line and the plate is equipped with a number of connecting devices and an electronic card that is associated with each connecting device. Each electronic card is connected to a computerized management system and is arranged radially with respect to the turning plate so that the computerized personalization management system makes it possible to manage personalization of all of the cards.

Abstract: This invention relates to a plastic substrate production process, the production device for such a substrate, and the use of the process for the production of integrated circuit boards. The plastic substrate production process is characterized in that it comprises the following steps: unwinding and straightening of a continuous strip of plastic which is slightly larger in dimension than one of the dimensions of the board; printing, at at least one printing station, of a series of printing patterns and of printed markings; driving of the strip at a regulated printing speed; detection of the difference in speed; cutting by a press of the strip at positions defined by the printed markings; and regulation of the printing speed as a function of the difference between the printing speed and the driving speed.

Abstract: This invention relates to a device for producing smart cards, characterized in that it comprises a station (1) for milling recesses in batches of plastic cards associated with a station (3) for inlaying integrated circuits in said recesses, said milled cards being conveyed from milling station (1) to inlaying station (3) by a transfer system (2) making possible an adaptation to the speed differences of the stations (1, 3) and to the positioning differences of these stations (1, 3).