Patents by Inventor Gerard Raymond Landry

Gerard Raymond Landry has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and methods to control the uniformity of electroplated workpiece
    Publication number: 20020125140
    Abstract: An electroplating system for plating at least one metal on at least one substrate. At least one plating tank contains a plating solution including the at least one metal to be plated on the at least one substrate. At least one anode is arranged in the at least one plating tank. The at least one anode is at least partially immersed within the plating solution during plating of the at least one metal. At least one cathode includes at least one workpiece portion in contact with the at least one substrate and at least one thief portion arranged in the vicinity of at least one portion of the at least one substrate for controlling plating of the at least one metal on the at least one portion of the at least one substrate. At least one power supply is connected to the at least one cathode. At least one controller separately controls a flow of power to the at least one workpiece portion of the cathode and the at least one thief portion of the cathode.
    Type: Application
    Filed: December 12, 2000
    Publication date: September 12, 2002
    Inventors: Cyprian Emeka Uzoh, Gerard Raymond Landry
  • Apparatus for controlling the uniformity of an electroplated workpiece
    Patent number: 6168693
    Abstract: An electroplating system for plating at least one metal on at least one substrate. At least one plating tank contains a plating solution including the at least one metal to be plated on the at least one substrate. At least one anode is arranged in the at least one plating tank. The at least one anode is at least partially immersed within the plating solution during plating of the at least one metal. At least one cathode includes at least one workpiece portion in contact with the at least one substrate and at least one thief portion arranged in the vicinity of at least one portion of the at least one substrate for controlling plating of the at least one metal on the at least one portion of the at least one substrate. At least one power supply is connected to the at least one cathode. At least one controller separately controls a flow of power to the at least one workpiece portion of the cathode and the at least one thief portion of the cathode.
    Type: Grant
    Filed: January 22, 1998
    Date of Patent: January 2, 2001
    Assignee: International Business Machines Corporation
    Inventors: Cyprian Emeka Uzoh, Gerard Raymond Landry