Abstract: The subject matter contained herein discloses methods for forming a vertical metallic pillar overlying an under bump metal pad further overlying a semiconductor substrate, and applying a discrete solder cap on a top surface of the pillar, wherein the metallic pillar is defined by at least one photoresist layer. The method includes heating a multi-element metallic paste containing a variable amount of metallic powder, a melting point depressant and a flux such that the metal powder sinters to form the metallic pillar and simultaneously adheres the metallic pillar to the underbump metal pad.

Abstract: The subject matter contained herein discloses methods for forming a vertical metallic pillar overlying an under bump metal pad further overlying a semiconductor substrate, and applying a discrete solder cap on a top surface of the pillar, wherein the metallic pillar is defined by at least one photoresist layer. The method includes heating a multi-element metallic paste containing a variable amount of metallic powder, a melting point depressant and a flux such that the metal powder sinters to form the metallic pillar and simultaneously adheres the metallic pillar to the underbump metal pad.

Abstract: A fleshing device for removing flesh from a hide includes a hide supporting structure for supporting the hide so that the hide extends in a substantially vertical hide plane. The device also includes a fleshing tool having a fleshing blade for removing the flesh from the hide and a tool supporting structure for movably supporting the fleshing tool so as to allow the fleshing tool to be moved in a tool plane substantially parallel to the hide plane while the fleshing blade operationally contacts the flesh.