Abstract: In one aspect, a sample collection device for collecting a biological sample is disclosed, which comprises a sample-receiving cup having a body that extends from a proximal opening to a distal opening, where the proximal opening is configured for receiving a biological sample. The sample collection device further includes a sensor comprising at least one sensing unit, where the sensor is sealingly connected to the distal opening of the sample-receiving cup such that the sensing unit is exposed to the distal opening. A reservoir for storing one or more sample-processing reagents is provided in the fluid-receiving cup such that the sensing unit is in fluid contact with the reagent(s) stored in the reservoir. A frangible membrane separates the reservoir from the proximal opening.

Abstract: A method of detecting one or more scratches on a surface of a wafer made of a non-semiconductor material is provided. A UV beam is produced from a UV illumination source. The UV beam is incident on a front surface of the wafer. The UV beam being characterized that for scratches of a given material having a UV cutoff wavelength ?cutoff, over 90% of the spectral system response SSR is at wavelengths below ?cutoff?5 nm and expressed as: ? 0 ? cutoff - 5 ? ? nm ? S ? ? S ? ? R ? ( ? ) > 0.90 · ? 0 ? ? S ? ? S ? ? R ? ( ? ) A reflected beam of scattering of the UV beam is detected in response to scratches on a surface of the wafer. The scattering is captured.

Abstract: A method of detecting one or more scratches on a surface of a wafer made of a non-semiconductor material is provided. A UV beam is produced from a UV illumination source. The UV beam is incident on a front surface of the wafer. The UV beam being characterized that for scratches of a given material having a UV cutoff wavelength ?cutoff, over 90% of the spectral system response SSR is at wavelengths below ?cutoff?5 nm and expressed as: ? 0 ? cutoff - 5 ? nm ? SSR ? ( ? ) > 0.90 · ? 0 ? ? SSR ? ( ? ) A reflected beam of scattering of the UV beam is detected in response to scratches on a surface of the wafer. The scattering is captured.

Abstract: There is described an improved Surface Reflectance Instrument which achieves more complete detection of surface defects in the nature of small particles. One of the improvements is the use of an elliptical integrated cavity with internal surface mirrors, and another the use of a position sensing diode as the detector for the scattered light. Other improvements and the use of a stable laser at a particular wavelength resulting in greater detection are also described.