Patents by Inventor Gerardo Bagalawig Nazareno

Gerardo Bagalawig Nazareno has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for reconstructing an integrated circuit package using lapping
    Patent number: 6884663
    Abstract: A method is provided for reconstructing an integrated circuit package comprising: attaching a die to exposed wire bond pads of a lead frame so that the die is electrically connected to the lead frame; and encapsulating the die and the wire bond pads in an encapsulant; and reshaping an upper surface of the encapsulant where at least a portion of the encapsulant reshaping is performed by a lapping process.
    Type: Grant
    Filed: January 7, 2002
    Date of Patent: April 26, 2005
    Assignee: Delphon Industries, LLC
    Inventors: Joseph J. Dlugokecki, Gerardo Bagalawig Nazareno, Carmencita I. Robbins, Steven David Swendrowski
  • Method for deconstructing an integrated circuit package using lapping
    Patent number: 6813828
    Abstract: A method is provided for deconstructing an integrated circuit package comprising: taking an integrated circuit package comprising a lead frame having a plurality of wire bond pads for placing a die into electrical contact with the lead frame, and an encapsulant encapsulating the wire bond pads; and removing the encapsulant to expose the wire bond pads; wherein at least a portion of the encapsulant is removed by a lapping process.
    Type: Grant
    Filed: January 7, 2002
    Date of Patent: November 9, 2004
    Assignee: Gel Pak L.L.C.
    Inventors: Joseph J. Dlugokecki, Gerardo Bagalawig Nazareno, Carmencita I. Robbins, Steven David Swendrowski
  • Method for deconstructing an integrated ciruit package using lapping
    Publication number: 20030126741
    Abstract: A method is provided for deconstructing an integrated circuit package comprising: taking an integrated circuit package comprising a lead frame having a plurality of wire bond pads for placing a die into electrical contact with the lead frame, and an encapsulant encapsulating the wire bond pads; and removing the encapsulant to expose the wire bond pads; wherein at least a portion of the encapsulant is removed by a lapping process.
    Type: Application
    Filed: January 7, 2002
    Publication date: July 10, 2003
    Inventors: Joseph J. Dlugokecki, Gerardo Bagalawig Nazareno, Carmencita I. Robbins, Steven David Swendrowski
  • Method for reconstructing an integrated circuit package using lapping
    Publication number: 20030127423
    Abstract: A method is provided for reconstructing an integrated circuit package comprising: attaching a die to exposed wire bond pads of a lead frame so that the die is electrically connected to the lead frame; and encapsulating the die and the wire bond pads in an encapsulant; and reshaping an upper surface of the encapsulant where at least a portion of the encapsulant reshaping is performed by a lapping process.
    Type: Application
    Filed: January 7, 2002
    Publication date: July 10, 2003
    Inventors: Joseph J. Dlugokecki, Gerardo Bagalawig Nazareno, Carmencita I. Robbins, Steven David Swendrowski