Abstract: A battery cell may include a lid, a case, a jellyroll, and a gasket. The lid may include a first pin and a second pin. The case may form a chamber when sealed with the lid. The jellyroll may include a negative electrode having a negative electrode tab and a positive electrode having a positive electrode tab. The jellyroll may be disposed inside the chamber. The negative electrode tab may couple with the first pin to form a negative terminal of the battery cell and the positive electrode tab may couple with the second pin to form a positive terminal of the battery cell. The gasket may partially encase each of the negative electrode tab and the positive electrode tab to prevent a contact between the negative electrode tab, the positive electrode tab, and/or the case of the battery cell.

Abstract: Methods, systems, and non-transitory computer readable media for estimating well interference on a target well from other potential wells in a subsurface volume of interest are disclosed. Exemplary implementations may include: obtaining well implementation data for the target well and the other potential wells; obtaining estimated reservoir volumes as a function of position; generating well overlap between the target well and the other potential wells; generating extraction interference probabilities; generating a representation of a well layout as a function of position in the subsurface volume of interest; and displaying the representation.

Abstract: A battery cell may include a lid, a case, a jellyroll, and a gasket. The lid may include a first pin and a second pin. The case may form a chamber when sealed with the lid. The jellyroll may include a negative electrode having a negative electrode tab and a positive electrode having a positive electrode tab. The jellyroll may be disposed inside the chamber. The negative electrode tab may couple with the first pin to form a negative terminal of the battery cell and the positive electrode tab may couple with the second pin to form a positive terminal of the battery cell. The gasket may partially encase each of the negative electrode tab and the positive electrode tab to prevent a contact between the negative electrode tab, the positive electrode tab, and/or the case of the battery cell.

Abstract: Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.

Abstract: Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.

Abstract: Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.

Abstract: A power converter comprising a DC/AC bridge circuit electrically coupled between positive and negative DC bus terminals and a set of phase terminals, a DC/DC bridge circuit electrically coupled to the positive and negative DC bus terminals and a set of DC bridge terminals. The power converter may be configured to control the transfer of power to and/or from the DC bridge terminals and to control the transfer of power to and/or from the AC phase terminals.

Abstract: Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.

Abstract: A power converter comprising a DC/AC bridge circuit electrically coupled between positive and negative DC bus terminals and a set of phase terminals, a DC/DC bridge circuit electrically coupled to the positive and negative DC bus terminals and a set of DC bridge terminals. The power converter may be configured to control the transfer of power to and/or from the DC bridge terminals and to control the transfer of power to and/or from the AC phase terminals.

Abstract: Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.

Abstract: Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.

Abstract: Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.

Abstract: Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.

Abstract: A power module comprises first and second substrates carrying semiconductor devices and coupled to respective pluralities of heat exchange members without intervening thermally insulative structures. One or more heat exchange loops circulate a heat exchange medium thermally coupled to the heat exchange members. Substrates may function as integral bus bars.