Abstract: Methods, systems, and non-transitory computer readable media for estimating well interference on a target well from other potential wells in a subsurface volume of interest are disclosed. Exemplary implementations may include: obtaining well implementation data for the target well and the other potential wells; obtaining estimated reservoir volumes as a function of position; generating well overlap between the target well and the other potential wells; generating extraction interference probabilities; generating a representation of a well layout as a function of position in the subsurface volume of interest; and displaying the representation.

Abstract: A power module includes first and second electrode terminals adapted to electrically connect to a power source, a first switch element, a second switch element, a first Kelvin source pin, and a second Kelvin source pin. The first switch element is electrically connected to the first electrode terminal The second switch element is electrically connected between the first switch element and the second electrode terminal and includes a drain and a source electrically connected to the first switch element and the second electrode terminal respectively. The first Kelvin source pin is electrically connected to the source of the second switch element and is adapted to receive a gate drive signal for driving the second switch element. The second Kelvin source pin is electrically connected to the source of the second switch element and is configured to be electrically connected to a snubber circuit.

Abstract: A battery cell may include a lid, a case, a jellyroll, and a gasket. The lid may include a first pin and a second pin. The case may form a chamber when sealed with the lid. The jellyroll may include a negative electrode having a negative electrode tab and a positive electrode having a positive electrode tab. The jellyroll may be disposed inside the chamber. The negative electrode tab may couple with the first pin to form a negative terminal of the battery cell and the positive electrode tab may couple with the second pin to form a positive terminal of the battery cell. The gasket may partially encase each of the negative electrode tab and the positive electrode tab to prevent a contact between the negative electrode tab, the positive electrode tab, and/or the case of the battery cell.

Abstract: Methods, apparatus and system to access personal data of a consumer (generated when said user is operating with a first service provider) by a second service provider, maintaining the privacy of the consumer. The proposed invention allows accessing data belonging to a certain consumer (for example, data generated when using a certain telecommunications service) by another entity providing services to the user (for example a bank) without sending the personal identification of the consumer. The proposed invention adds more flexibility, saves resources and increases scalability, efficiency and privacy.

Abstract: Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.

Abstract: Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.

Abstract: Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.

Abstract: A power converter comprising a DC/AC bridge circuit electrically coupled between positive and negative DC bus terminals and a set of phase terminals, a DC/DC bridge circuit electrically coupled to the positive and negative DC bus terminals and a set of DC bridge terminals. The power converter may be configured to control the transfer of power to and/or from the DC bridge terminals and to control the transfer of power to and/or from the AC phase terminals.

Abstract: Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.

Abstract: A power converter comprising a DC/AC bridge circuit electrically coupled between positive and negative DC bus terminals and a set of phase terminals, a DC/DC bridge circuit electrically coupled to the positive and negative DC bus terminals and a set of DC bridge terminals. The power converter may be configured to control the transfer of power to and/or from the DC bridge terminals and to control the transfer of power to and/or from the AC phase terminals.

Abstract: Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.

Abstract: Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.

Abstract: Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.

Abstract: Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.

Abstract: A power module comprises first and second substrates carrying semiconductor devices and coupled to respective pluralities of heat exchange members without intervening thermally insulative structures. One or more heat exchange loops circulate a heat exchange medium thermally coupled to the heat exchange members. Substrates may function as integral bus bars.