Abstract: The invention relates to a camera device and a method for manufacturing such a device. The camera device comprises an image capturing element, a lens element for imaging an object at the image capturing element and a spacer means for maintaining a predetermined distance along the main optical axis through the lens and the image capturing element, and lens substrate for carrying the lens wherein the spacer means comprises an adhesive layer. This enables a mass manufacturing process wherein parts of the individual camera elements can be manufactured in manifold on different substrates, after which the different substrates are stacked, aligned and joined via adhesive layers. In the manufacturing process the different distances between the plates and the wafers are adjusted and maintained via the spacer means comprising the adhesive layers. From the stack individual camera devices are sawn out.

Abstract: The invention relates to a camera device and a method for manufacturing such a device. The camera device comprises an image capturing element, a lens element for imaging an object at the image capturing element and a spacer means for maintaining a predetermined distance along the main optical axis though the lens and the image capturing element, and lens substrate for carrying the lens wherein the spacer means comprises an adhesive layer. This enables a mass manufacturing process wherein parts of the individual camera elements can be manufactured in manifold on different substrates, after which the different substrates are stacked, aligned and joined via adhesive layers. In the manufacturing process the different distances between the plates and the wafers are adjusted and maintained via the spacer means comprising the adhesive layers. From the stack individual camera devices are sawn out.

Abstract: The invention relates to an integrated semiconductor optical device comprising: a) an optical element (2), b) a housing (3) around said optical element (2), c) a glass window (51, 52) in said housing (3) allowing a light beam (71, 72) to pass through. In order to integrate the optics and the semiconductor optical device, while avoiding a difficult alignment procedure when using discrete lenses, the integrated semiconductor optical device according to the present invention further comprises a lens (61, 62) associated with said glass window (51, 52), said lens (61, 62) being directly replicated on the surface of said glass window (51, 52) outside said housing (3) by means of a replication method comprising the steps of: 1) filling a gap between the glass window and a mould with a liquid light-transmissive polymeric material, 2) curing the polymeric material to obtain said lens, and 3) removing the mould.

Abstract: The invention relates to a method and an apparatus for manufacturing an optical device by means of a replication method comprising the steps of: a) filling a gap between a substrate and a mould with a liquid light-transmissive polymeric material, b) curing the polymeric material to obtain a replica layer, c) removing the mould. In order to manufacture optical devices, such as lenses having a larger NA-value, it is proposed according to the present invention that the replication method is repeated at least two times while using the same or different moulds, and that the substrate, together with one or more replica layers obtained during one or more previous runs of the replication method, is used as a substrate for the next run of the replication method.