Abstract: A transport assembly that supports a substrate and controllably moves the substrate within a semiconductor processing system in a manner that reduces the likelihood of the substrate being damaged. The assembly includes a spatula having an uneven upper surface that contacts the substrate. The spatula upper surface includes a plurality of protrusions that form peaks and a plurality of valleys between the peaks. Each of the peaks contacts the lower surface of the substrate so as to distribute the pressure exerted by the spatula on the substrate. A network of channels is created between the lower surface of the substrate and the valleys of the spatula that enables gas to readily flow therethrough. The channels extend to openings along the sides of the spatula to communicate the channels with neighboring space. Entrapped pockets of heated gas are inhibited from forming underneath the substrate, and the substrate can be easily lifted off of the spatula.