Abstract: Semiaromatic semicrystalline thermoplastic polyamide molding compositions, comprising A) from 40 to 100% by weight of a copolyamide composed of a1) from 30 to 44 mol % of units which derive from terephthalic acid a2) from 6 to 20 mol % of units which derive from isophthalic acid a3) from 42 to 49.5 mol % of units which derive from hexamethylenediamine a4) from 0.5 to 8 mol % of units which derive from aromatic diamines having from 6 to 30 carbon atoms, where the molar percentages of components a1) to a4) together give 100%, and B) from 0 to 50% by weight of a fibrous or particulate filler C) from 0 to 30% by weight of an elastomeric polymer D) from 0 to 30% by weight of other additives and processing aids, where the percentages by weight of components A) to D) together give 100%.

Abstract: A process is provided for the preparation of polyamides in an aqueous reaction mixture containing a nitrile selected from 6-aminocapronitrile and adipodinitrile, wherein a nitrile is used through which, in the liquid state, a gas inert to the nitrile has been passed.

Abstract: The thermoplastic molding composition comprises, based on the total weight of components A, C and, if desired, B and D to G, which is 100% by weight in total, a: as component A, from 1 to 99% by weight of at least one polyester, b: as component B, from 0 to 98% by weight of at least one polycarbonate, c: from 1 to 80% by weight of a specific graft copolymer C, d: as component D, from 0 to 80% by weight of at least one styrene copolymer, e: as component E, from 0 to 30% by weight of at least one rubber, f: as component F, from 0 to 60% by weight of at least one fibrous or particulate filler, and g: as component G, from 0 to 20% by weight of other additives.

Abstract: The present invention relates to molding compositions comprising polycondensates, particulate graft copolymers, copolymer made from vinylaromatic monomer and acrylonitrile and/or methacrylonitrile, fibers, polycarbonate, carbon black and customary additives. Moldings and composites made from this molding composition are described as are recycled materials from these, and the use of the molding compositions, moldings, composites and recycled materials.

Abstract: In a process for producing filler-containing thermoplastic molding compositions by mixing fillers with thermoplastics in the melt,a) the fillers are mixed in a mixing apparatus in the melt with a low molecular weight thermoplastic having a melt viscosity of at most 30 Pas (measured at 20.degree. C. above the melting point of the thermoplastic compound and at a shear gradient of 1,000 s.sup.-1),b) the product thus obtained is removed from the mixing apparatus, cooled and comminuted, andc) the comminuted product is then subjected in the solid phase to a post-condensation.

Abstract: Thermoplastic molding materials contain, as essential components,A) 40-95% by weight of a partly aromatic copolyamide having a triamine content of less than 0.5% by weight, consisting essentially ofA.sub.1) 20-90% by weight of units derived from terephthalic acid and hexamethylenediamine,A.sub.2 5-50% by weight of units derived from .epsilon.-caprolactam andA.sub.3) 0-80% by weight of units derived from adipic acid and hexamethylenediamine, andB) 5-60% by weight of fibrous or particulate fillers or mixtures of these.

Abstract: Thermoplastic molding materials containA) 4-94% by weight of a partly aromatic, semicrystalline copolyamide having a triamine content of less than 0.5% by weight and composed of(A.sub.1) 20-90% by weight of units derived from terephthalic acid and hexamethylenediamine,(A.sub.2) 0-50% by weight of units derived from .epsilon.-caprolactam,(A.sub.3) 0-80% by weight of units derived from adipic acid and hexametheylenediamine and(A.sub.4) 0-40% by weight of further polyamide-forming monomers,the amount of components (A.sub.2) or (A.sub.3) or (A.sub.4) or of mixtures thereof being not less than 10% by weight,B) 4-94% by weight of a polyolefin homo- or copolymer or a mixture thereof,C) 2-20% by weight of an adhesion promoter,D) 0-20% by weight of a toughening polymer andE) 0-60 % by weight of additives and processing assistants.

Abstract: Thermoplastic polyamide molding materials contain, as essential components,A) from 39 to 99% by weight of a polyamide or a mixture of different polyamides andB) from 1 to 30% by weight of a phenol of the general formula IR.sub.3 E Iand E is a trivalent, aliphatic, C.sub.1 -C.sub.10 -hydrocarbon radical, triazinetriyl or a trivalent C.sub.6 - or C.sub.10 -aryl radical, andc) from 0 to 60% by weight, based on the amount of polyamide, of fibrous or particulate fillers or a mixture thereof.

Abstract: Thermoplastic molding compositions contain as essential componentsA) 40-95% by weight of a partly aromatic copolyamide composed essentially ofA.sub.1) 20-90% by weight of units derived from terephthalic acid and hexamethylenediamine,A.sub.2) 0-50% by weight of units derived from .epsilon.-caprolactam andA.sub.3) 0-80% by weight of units derived from adipic acid and hexamethylenediamine,B) 5-60% by weight of an impact modifying rubber, and in additionC) 0-50% by weight of fibrous or particulate fillers or mixtures thereof.

Abstract: The thermoplastic molding compositions contain as essential componentsA) from 96 to 99.9% by weight of at least one polyamide,B) from 0.1 to 4% by weight of one or more dialkyl ketones of the general formula I ##STR1## where R and R' are each alkyl of from 10 to 30 carbon atoms, and also, based on the sum total of A) and B),C) from 0 to 40% by weight of an impact modifying rubber,D) from 0 to 60% by weight of fibrous or particulate fillers or a mixture thereof, andE) from 0 to 120% by weight of a modified polyphenylene ether.

Abstract: A process for the surface treatment of moldings based on polyamides by treatment with an aqueous acid, wherein the aqueous acid used is a 30-85% strength solution of H.sub.3 PO.sub.4 yields moldings which are readily metallizable. Metallized moldings obtained by this process are useful in the production of automobiles and in the electronics industry.

Abstract: Polypropylene/polyamide molding compositions, suitable in particular for producing moldings, advantageously consist of, in each case based on 100 parts by weight of the molding composition,A) from 10 to 89.5 parts by weight of one or more polypropylene homopolymers and/or copolymers,B) from 10 to 89.5 parts by weight of one or more polyamides,C) from 0.

Abstract: The invention relates to a process for the preparation of reinforced, impact-modified thermoplastic molding compositions which contain, based on 100 parts by weight,A) from 30 to 93 parts by weight of one or more thermoplastics from the group comprising the polyamides, polyesters, polycarbonates and polyphenylene ethers,B) from 5 to 50 parts by weight of fibers, preferably glass fibers, andC) from 2 to 20 parts by weight of one or more impact-modifying rubbers,in which processthe fibers (B) are first introduced into the melt of the thermoplastic (A),components (A) and (B) are mixed,the rubber (C) is then introduced into the resultant mixture in the melt, andthe resultant molding composition is extruded and granulated,wherein the reaction is carried out in one step, expediently at a constant temperature in the range of, advantageously, from 250.degree. to 300.degree. C.

Abstract: Thermoplastic molding materials contain, as essential components,A) from 40 to 99.5% by weight of a thermoplastic polyamide,B) from 0.5 to 15% by weight of a thermoplastic polyester elastomerand furthermoreC) from 0 to 50% by weight of fibrous or particulate fillers or a mixture of these.

Abstract: Thermoplastic molding compositions contain as essential components(A) 10-89% by weight of a copolyamide of(A.sub.1) 80-99% by weight of recurring units derived from adipic acid and hexamethylenediamine and(A.sub.2) 1-20% by weight of units derived from .epsilon.-caprolactam,(B) 10-80% by weight of polyhexamethyleneadipamide,(C) 1-40% by weight of an impact-modifying rubber and in addition(D) 0-60% by weight of a fibrous or particulate filler or a mixture thereof.

Abstract: Flameproofed thermoplastic molding materials contain(A) 40-99% by weight of a partly aromatic amide copolymer consisting essentially of(a.sub.1) 40-50% by weight of units derived from terephthalic acid and hexamethylenediamine,(a.sub.2) 0-50% by weight of units derived from .epsilon.-caprolactam and(a.sub.3) 0-60% by weight of units derived from adipic acid and hexamethylenediamine,components (a.sub.2) and/or (a.sub.3) accounting altogether for not less than 10% by weight of the total number of units,(B) 1-30% by weight of a flameproofing combination of(b.sub.1) 40-97% by weight of red phosphorus,(b.sub.2) 1-50% by weight of an inorganic compound of a divalent or tetravalent metal,(b.sub.3) 1-40% by weight of an organic mono- or dicarboxylic acid and(b.sub.

Abstract: An electrically conductive surface layer is produced on moldings consisting of plastics which are soluble or swellable in organic solvents, the conductivity of the said layer being based on a system, incorporated therein, oforganic electron acceptors (I) on the one hand andorganic electron donors (II), iodides (III) or a mixture of (II) and (III) as electron donors, on the other hand,by a process in which the moldings are treated with organic solutions of these components.The products have a surface resistance of from 10.sup.8 to 10.sup.2 ohm and have the advantage that the remaining properties of the moldings are virtually unaffected by the agents (I) to (III).

Abstract: A solid mixture contains as essential components(A) from 40 to 99% by weight, based on the total weight of (A) and (B), of a nonnucleating thermoplastic polyamide and(B) from 1 to 60% by weight, based on the total weight of (A) and (B), of a thermoplastic polyamide which contains a nucleating agent, and in addition(C) from 0 to 60% by weight, based on the total weight of (A)+(B)+(C), of fibrous or particulate fillers.

Abstract: Wholly aromatic thermotropic polyesters are based on(A) 30 to 60 mol % of 4-hydroxybenzoic acid,(B) 20 to 35 mol % of terephthalic acid and(C) 20 to 35 mol % of a mixture of(C.sub.1) trimethylhydroquinone and(C.sub.2) resorcinolthe molar ratio of C.sub.1 :C.sub.2 being within the range from 0.4:1 to 0.7:1 and the molar ratio of B:C within the range from 0.9:1 to 1.1:1.

Abstract: In microelectronic components and thick-film hybrid circuits, the multilayer substrates of the said components and the substrates of the said circuits are produced using liquid crystalline polymers which can be processed by a thermoplastic method.