Abstract: A film capacitor includes first and second contact layers and a metallized dielectric film with first and second end faces and with first and second film sides. The first end face of the metallized dielectric film is connected to the first contact layer and the second end face is connected to the second contact layer. The metallized dielectric film has first, second and third metallization layers, with at least two of the metallization layers applied on the first film side of the metallized dielectric film and at least a further of the metallization layers applied on the second film side. The metallization layers are arranged on the film sides in such a manner that a first overlap with a first partial capacitance and a second overlap with a second partial capacitance are embodied between the metallization layers on the film sides, with the partial capacitances forming a series connection.